SBASAF2 August   2022 ADS131M06-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Measurements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input ESD Protection Circuitry
      2. 8.3.2  Input Multiplexer
      3. 8.3.3  Programmable Gain Amplifier (PGA)
      4. 8.3.4  Voltage Reference
      5. 8.3.5  Clocking and Power Modes
      6. 8.3.6  ΔΣ Modulator
      7. 8.3.7  Digital Filter
        1. 8.3.7.1 Digital Filter Implementation
          1. 8.3.7.1.1 Fast-Settling Filter
          2. 8.3.7.1.2 SINC3 and SINC3 + SINC1 Filter
        2. 8.3.7.2 Digital Filter Characteristic
      8. 8.3.8  DC Block Filter
      9. 8.3.9  Internal Test Signals
      10. 8.3.10 Channel Phase Calibration
      11. 8.3.11 Calibration Registers
      12. 8.3.12 Communication Cyclic Redundancy Check (CRC)
      13. 8.3.13 Register Map CRC
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset
        2. 8.4.1.2 SYNC/RESET Pin
        3. 8.4.1.3 RESET Command
      2. 8.4.2 Fast Start-Up Behavior
      3. 8.4.3 Conversion Modes
        1. 8.4.3.1 Continuous-Conversion Mode
        2. 8.4.3.2 Global-Chop Mode
      4. 8.4.4 Power Modes
      5. 8.4.5 Standby Mode
      6. 8.4.6 Current-Detect Mode
    5. 8.5 Programming
      1. 8.5.1 Interface
        1. 8.5.1.1  Chip Select (CS)
        2. 8.5.1.2  Serial Data Clock (SCLK)
        3. 8.5.1.3  Serial Data Input (DIN)
        4. 8.5.1.4  Serial Data Output (DOUT)
        5. 8.5.1.5  Data Ready (DRDY)
        6. 8.5.1.6  Conversion Synchronization or System Reset (SYNC/RESET)
        7. 8.5.1.7  SPI Communication Frames
        8. 8.5.1.8  SPI Communication Words
        9. 8.5.1.9  ADC Conversion Data
          1. 8.5.1.9.1 Collecting Data for the First Time or After a Pause in Data Collection
        10. 8.5.1.10 Commands
          1. 8.5.1.10.1 NULL (0000 0000 0000 0000)
          2. 8.5.1.10.2 RESET (0000 0000 0001 0001)
          3. 8.5.1.10.3 STANDBY (0000 0000 0010 0010)
          4. 8.5.1.10.4 WAKEUP (0000 0000 0011 0011)
          5. 8.5.1.10.5 LOCK (0000 0101 0101 0101)
          6. 8.5.1.10.6 UNLOCK (0000 0110 0101 0101)
          7. 8.5.1.10.7 RREG (101a aaaa annn nnnn)
            1. 8.5.1.10.7.1 Reading a Single Register
            2. 8.5.1.10.7.2 Reading Multiple Registers
          8. 8.5.1.10.8 WREG (011a aaaa annn nnnn)
        11. 8.5.1.11 Short SPI Frames
      2. 8.5.2 Synchronization
    6. 8.6 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Unused Inputs and Outputs
      2. 9.1.2 Antialiasing
      3. 9.1.3 Minimum Interface Connections
      4. 9.1.4 Multiple Device Configuration
      5. 9.1.5 Troubleshooting
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current Shunt Measurement
        2. 9.2.2.2 Battery Pack Voltage Measurement
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 CAP Pin Behavior
      2. 9.3.2 Power-Supply Sequencing
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Switching Characteristics

over operating ambient temperature range, DOUT load: 20 pF || 100 kΩ (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT(1)
1.65 V ≤ DVDD ≤ 2.0 V
tp(CSDO) Propagation delay time, CS falling edge to DOUT driven 50 ns
tp(SCDO) Progapation delay time, SCLK rising edge to valid new DOUT 32 ns
tp(CSDOZ) Propagation delay time, CS rising edge to DOUT high impedace 75 ns
tw(DRH) Pulse duration, DRDY high 4 tCLKIN
tw(DRL) Pulse duration, DRDY low 4 tCLKIN
SPI timeout 32768 tCLKIN
tPOR Power-on-reset time Measured from supplies at 90% to first DRDY rising edge 250 μs
tREGACQ Register default acquisition time 5 µs
2.7 V ≤ DVDD ≤ 3.6 V
tp(CSDO) Propagation delay time, CS falling edge to DOUT driven 50 ns
tp(SCDO) Progapation delay time, SCLK rising edge to valid new DOUT 20 ns
tp(CSDOZ) Propagation delay time, CS rising edge to DOUT high impedace 75 ns
tw(DRH) Pulse duration, DRDY high 4 tCLKIN
tw(DRL) Pulse duration, DRDY low 4 tCLKIN
SPI timeout 32768 tCLKIN
tPOR Power-on-reset time Measured from supplies at 90% to first DRDY rising edge 250 μs
tREGACQ Register default acquisition time 5 µs
(1) tCLKIN = 1/fCLKIN