SLAS760D May   2011  – November 2015 ADS5263

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics, Dynamic Performance - 16-Bit ADC
    6. 7.6  Electrical Characteristics, General - 16-Bit ADC Mode
    7. 7.7  Electrical Characteristics, Dynamic Performance - 14-Bit ADC
    8. 7.8  Digital Characteristics
    9. 7.9  Timing Requirements
    10. 7.10 LVDS Timing at Lower Sampling Frequencies - 2 Wire, 8× Serialization
    11. 7.11 LVDS Timing for 1 Wire 16× Serialization
    12. 7.12 LVDS Timing for 2 Wire, 7× Serialization
    13. 7.13 LVDS Timing for 1 Wire, 14× Serialization
    14. 7.14 Serial Interface Timing Requirements
    15. 7.15 Reset Switching Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 Typical Characteristic - 16-Bit ADC Mode
      2. 7.16.2 Typical Characteristic - 14-Bit ADC Mode
      3. 7.16.3 Typical Characteristics - Common Plots
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Processing Blocks
      2. 8.3.2 Digital Gain
      3. 8.3.3 Digital Filter
      4. 8.3.4 Custom Filter Coefficients
        1. 8.3.4.1 Custom Filter Without Decimation
      5. 8.3.5 Digital Averaging
      6. 8.3.6 Performance with Digital Processing Blocks
        1. 8.3.6.1 18-Bit Data Output with Digital Processing
      7. 8.3.7 Flexible Mapping o Channel Data to LVDS Outputs
      8. 8.3.8 Output LVDS Interface
      9. 8.3.9 Programmable LCLK Phase
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration
      2. 8.4.2 Serial Register Readout
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Register Initialization
    6. 8.6 Register Maps
      1. 8.6.1 Default State After Reset
      2. 8.6.2 Description of Serial Registers
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Analog Input
        1. 9.1.1.1 Drive Circuit Requirements
      2. 9.1.2 Large and Small Signal Input Bandwidth
      3. 9.1.3 Clamp Function For CCD Signals
        1. 9.1.3.1 Differential Input Drive
        2. 9.1.3.2 Clamp Operation
        3. 9.1.3.3 Synchronization to External CCD Timing
      4. 9.1.4 Low-Frequency Noise Suppression
      5. 9.1.5 External Reference Mode
    2. 9.2 Typical Applications
      1. 9.2.1 Driving Circuit Design: Low Input Frequencies (< 50 MHz)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Driving Circuit Design: Input Frequencies > 50 MHz
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Definition of Specifications
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging
      1. 13.1.1 Exposed Pad
      2. 13.1.2 Non-Magnetic Package

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Definition of Specifications

Analog Bandwidth – The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low-frequency value.

Aperture Delay – The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. This delay is different across channels. The maximum variation is specified as aperture delay variation (channel-to-channel).

Aperture Uncertainty (Jitter) – The sample-to-sample variation in aperture delay.

Clock Pulse Width/Duty Cycle – The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle.

Maximum Conversion Rate – The maximum sampling rate at which specified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted.

Minimum Conversion Rate – The minimum sampling rate at which the ADC functions.

Differential Nonlinearity (DNL) – An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs.

Integral Nonlinearity (INL) – The INL is the deviation of the ADC transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs.

Gain Error – Gain error is the deviation of the ADC actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Gain error has two components: error as a result of reference inaccuracy and error as a result of the channel. Both errors are specified independently as EGREF and EGCHAN.

To a first-order approximation, the total gain error is ETOTAL ~ EGREF + EGCHAN.

For example, if ETOTAL = ±0.5%, the full-scale input varies from (1 – 0.5/100) x FSideal to (1 + 0.5/100) x FSideal.

Offset Error – The offset error is the difference, given in number of LSBs, between the ADC actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into millivolts.

Temperature Drift – The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. It is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX – TMIN.

Signal-to-Noise Ratio – SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at dc and the first nine harmonics.

Equation 1. ADS5263 q_snr_las635.gif

SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.

Signal-to-Noise and Distortion (SINAD) – SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc.

Equation 2. ADS5263 q_sinad_las635.gif

SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.

Effective Number of Bits (ENOB) – ENOB is a measure of the converter performance as compared to the theoretical limit based on quantization noise.

Equation 3. ADS5263 q_enob_las635.gif

Total Harmonic Distortion (THD) – THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD).

Equation 4. ADS5263 q_thd_las635.gif

THD is typically given in units of dBc (dB to carrier).

Spurious-Free Dynamic Range (SFDR) – The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier).

Two-Tone Intermodulation Distortion – IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1 – f2 or 2f2 – f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.

DC Power-Supply Rejection Ratio (DC PSRR) – DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The dc PSRR is typically given in units of mV/V.

AC Power-Supply Rejection Ratio (AC PSRR) – AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If ΔVSUP is the change in supply voltage and ΔVOUT is the resultant change of the ADC output code (referred to the input), then:

Equation 5. ADS5263 q_psrr_las635.gif

Voltage Overload Recovery – The number of clock cycles taken to recover to less than 1% error after an overload on the analog inputs. This is tested by separately applying a sine wave signal with 6dB positive and negative overload. The deviation of the first few samples after the overload (from the expected values) is noted.

Common-Mode Rejection Ratio (CMRR) – CMRR is the measure of rejection of variation in the analog input common-mode by the ADC. If ΔVCM_IN is the change in the common-mode voltage of the input pins and ΔVOUT is the resulting change of the ADC output code (referred to the input), then:

Equation 6. ADS5263 q_cmrr_las635.gif

Crosstalk (only for multi-channel ADCs) – This is a measure of the internal coupling of a signal from an adjacent channel into the channel of interest. It is specified separately for coupling from the immediate neighboring channel (near-channel) and for coupling from channel across the package (far-channel). It is usually measured by applying a full-scale signal in the adjacent channel. Crosstalk is the ratio of the power of the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the adjacent channel input. It is typically expressed in dBc.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.