SBAS766B May   2016  – January 2017 ADS54J20

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  AC Characteristics
    7. 7.7  Digital Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Typical Characteristics
    10. 7.10 Typical Characteristics: Contour
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Inputs
      2. 8.3.2 DDC Block
        1. 8.3.2.1 Decimate-by-2 Filter
        2. 8.3.2.2 Decimate-by-4 Filter Using a Digital Mixer
        3. 8.3.2.3 Decimate-by-4 Filter with IQ Outputs
      3. 8.3.3 SYSREF Signal
        1. 8.3.3.1 SYSREF Not Present (Subclass 0, 2)
      4. 8.3.4 Overrange Indication
        1. 8.3.4.1 Fast OVR
      5. 8.3.5 Power-Down Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration
        1. 8.4.1.1 Serial Interface
        2. 8.4.1.2 Serial Register Write: Analog Bank
        3. 8.4.1.3 Serial Register Readout: Analog Bank
        4. 8.4.1.4 JESD Bank SPI Page Selection
        5. 8.4.1.5 Serial Register Write: JESD Bank
          1. 8.4.1.5.1 Individual Channel Programming
        6. 8.4.1.6 Serial Register Readout: JESD Bank
      2. 8.4.2 JESD204B Interface
        1. 8.4.2.1 JESD204B Initial Lane Alignment (ILA)
        2. 8.4.2.2 JESD204B Test Patterns
        3. 8.4.2.3 JESD204B Frame
        4. 8.4.2.4 JESD204B Frame
        5. 8.4.2.5 JESD204B Frame Assembly with Decimation
          1. 8.4.2.5.1 JESD Transmitter Interface
          2. 8.4.2.5.2 Eye Diagrams
    5. 8.5 Register Maps
      1. 8.5.1 Detailed Register Information
      2. 8.5.2 Example Register Writes
      3. 8.5.3 Register Descriptions
        1. 8.5.3.1 General Registers
          1. 8.5.3.1.1 Register 0h (address = 0h)
          2. 8.5.3.1.2 Register 3h (address = 3h)
          3. 8.5.3.1.3 Register 4h (address = 4h)
          4. 8.5.3.1.4 Register 5h (address = 5h)
          5. 8.5.3.1.5 Register 11h (address = 11h)
        2. 8.5.3.2 Master Page (080h) Registers
          1. 8.5.3.2.1  Register 20h (address = 20h), Master Page (080h)
          2. 8.5.3.2.2  Register 21h (address = 21h), Master Page (080h)
          3. 8.5.3.2.3  Register 23h (address = 23h), Master Page (080h)
          4. 8.5.3.2.4  Register 24h (address = 24h), Master Page (080h)
          5. 8.5.3.2.5  Register 26h (address = 26h), Master Page (080h)
          6. 8.5.3.2.6  Register 4Fh (address = 4Fh), Master Page (080h)
          7. 8.5.3.2.7  Register 53h (address = 53h), Master Page (080h)
          8. 8.5.3.2.8  Register 54h (address = 54h), Master Page (080h)
          9. 8.5.3.2.9  Register 55h (address = 55h), Master Page (080h)
          10. 8.5.3.2.10 Register 59h (address = 59h), Master Page (080h)
        3. 8.5.3.3 ADC Page (0Fh) Register
          1. 8.5.3.3.1 Register 5F (addresses = 5F), ADC Page (0Fh)
        4. 8.5.3.4 Main Digital Page (6800h) Registers
          1. 8.5.3.4.1  Register 0h (address = 0h), Main Digital Page (6800h)
          2. 8.5.3.4.2  Register 41h (address = 41h), Main Digital Page (6800h)
          3. 8.5.3.4.3  Register 42h (address = 42h), Main Digital Page (6800h)
          4. 8.5.3.4.4  Register 43h (address = 43h), Main Digital Page (6800h)
          5. 8.5.3.4.5  Register 44h (address = 44h), Main Digital Page (6800h)
          6. 8.5.3.4.6  Register 4Bh (address = 4Bh), Main Digital Page (6800h)
          7. 8.5.3.4.7  Register 4Dh (address = 4Dh), Main Digital Page (6800h)
          8. 8.5.3.4.8  Register 4Eh (address = 4Eh), Main Digital Page (6800h)
          9. 8.5.3.4.9  Register 52h (address = 52h), Main Digital Page (6800h)
          10. 8.5.3.4.10 Register 72h (address = 72h), Main Digital Page (6800h)
          11. 8.5.3.4.11 Register ABh (address = ABh), Main Digital Page (6800h)
          12. 8.5.3.4.12 Register ADh (address = ADh), Main Digital Page (6800h)
          13. 8.5.3.4.13 Register F7h (address = F7h), Main Digital Page (6800h)
        5. 8.5.3.5 JESD Digital Page (6900h) Registers
          1. 8.5.3.5.1  Register 0h (address = 0h), JESD Digital Page (6900h)
          2. 8.5.3.5.2  Register 1h (address = 1h), JESD Digital Page (6900h)
          3. 8.5.3.5.3  Register 2h (address = 2h), JESD Digital Page (6900h)
          4. 8.5.3.5.4  Register 3h (address = 3h), JESD Digital Page (6900h)
          5. 8.5.3.5.5  Register 5h (address = 5h), JESD Digital Page (6900h)
          6. 8.5.3.5.6  Register 6h (address = 6h), JESD Digital Page (6900h)
          7. 8.5.3.5.7  Register 7h (address = 7h), JESD Digital Page (6900h)
          8. 8.5.3.5.8  Register 16h (address = 16h), JESD Digital Page (6900h)
          9. 8.5.3.5.9  Register 31h (address = 31h), JESD Digital Page (6900h)
          10. 8.5.3.5.10 Register 32h (address = 32h), JESD Digital Page (6900h)
        6. 8.5.3.6 JESD Analog Page (6A00h) Registers
          1. 8.5.3.6.1 Registers 12h-5h (addresses = 12h-5h), JESD Analog Page (6A00h)
          2. 8.5.3.6.2 Register 16h (address = 16h), JESD Analog Page (6A00h)
          3. 8.5.3.6.3 Register 17h (address = 17h), JESD Analog Page (6A00h)
          4. 8.5.3.6.4 Register 1Ah (address = 1Ah), JESD Analog Page (6A00h)
          5. 8.5.3.6.5 Register 1Bh (address = 1Bh), JESD Analog Page (6A00h)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Start-Up Sequence
      2. 9.1.2 Hardware Reset
      3. 9.1.3 SNR and Clock Jitter
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Transformer-Coupled Circuits
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Sequencing and Initialization
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13 Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.