SBAS608C June   2014  – December 2015 ADS7042

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Companion Products
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Characteristics
    7. 8.7 Typical Characteristics
  9. Parameter Measurement Information
    1. 9.1 Digital Voltage Levels
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Reference
      2. 10.3.2 Analog Input
      3. 10.3.3 ADC Transfer Function
      4. 10.3.4 Serial Interface
    4. 10.4 Device Functional Modes
      1. 10.4.1 Offset Calibration
        1. 10.4.1.1 Offset Calibration on Power-Up
        2. 10.4.1.2 Offset Calibration During Normal Operation
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Single-Supply DAQ with the ADS7042
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Antialiasing Filter
          2. 11.2.1.2.2 Input Amplifier Selection
          3. 11.2.1.2.3 Reference Circuit
        3. 11.2.1.3 Application Curve
      2. 11.2.2 DAQ Circuit with the ADS7042 for Maximum SINAD
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
        3. 11.2.2.3 Application Curves
      3. 11.2.3 12-Bit, 10-kSPS DAQ Circuit Optimized for DC Sensor Measurements
        1. 11.2.3.1 Design Requirements
        2. 11.2.3.2 Detailed Design Procedure
        3. 11.2.3.3 Application Curve
  12. 12Power-Supply Recommendations
    1. 12.1 AVDD and DVDD Supply Recommendations
    2. 12.2 Estimating Digital Power Consumption
    3. 12.3 Optimizing Power Consumed by the Device
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Community Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • RUG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

15 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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