SBAS580D May   2013  – March 2018 ADS7250 , ADS7850 , ADS8350

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: All Devices
    6. 6.6  Electrical Characteristics: ADS7250
    7. 6.7  Electrical Characteristics: ADS7850
    8. 6.8  Electrical Characteristics: ADS8350
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics: ADS7250
    12. 6.12 Typical Characteristics: ADS7850
    13. 6.13 Typical Characteristics: ADS8350
    14. 6.14 Typical Characteristics: All Devices
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference
      2. 7.3.2 Analog Input
        1. 7.3.2.1 Analog Input Full-Scale Range
      3. 7.3.3 ADC Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface
      2. 7.4.2 Short-Cycling, Frame Abort, and Reconversion Feature
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 DAQ Circuit: Maximum SINAD for a 10-kHz Input Signal at 750-kSPS Throughput
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 ADC Reference Driver
          2. 8.2.1.2.2 ADC Input Driver
            1. 8.2.1.2.2.1 Input Amplifier Selection
            2. 8.2.1.2.2.2 Antialiasing Filter
        3. 8.2.1.3 Application Curve
      2. 8.2.2 DAQ Circuit: Maximum SINAD for a 100-kHz Input Signal at 750-kSPS Throughput
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 ADC Reference Driver
          2. 8.2.2.2.2 ADC Input Driver
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage AVDD to GND –0.3 7 V
DVDD to GND –0.3 7
Analog input voltage AINP_x to REFGND_x REFGND_x – 0.3 AVDD + 0.3 V
AINM_x to REFGND_x REFGND_x – 0.3 AVDD + 0.3
REFIN_x to REFGND_x REFGND_x – 0.3 AVDD + 0.3
Digital input voltage CS, SCLK to GND GND – 0.3 DVDD + 0.3 V
Ground voltage difference | REFGND_x – GND | 0.3 V
Input current Any pin except supply pins ±10 mA
Maximum virtual junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.