SBAS482C January   2010  – September 2017 ADS7924

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Multiplexer
      2. 7.3.2 ADC Input
      3. 7.3.3 Reference
      4. 7.3.4 Clock
      5. 7.3.5 Data Format
      6. 7.3.6 ADC Conversion Timing
        1. 7.3.6.1 Power-Up Time
        2. 7.3.6.2 Acquisition Time
        3. 7.3.6.3 Conversion Time
        4. 7.3.6.4 Sleep Time
      7. 7.3.7 Interrupt Output (INT)
      8. 7.3.8 PWRCON
      9. 7.3.9 Alarm
    4. 7.4 Device Functional Modes
      1. 7.4.1 ADC Operating Modes
        1. 7.4.1.1 Idle Mode
        2. 7.4.1.2 Awake Mode
        3. 7.4.1.3 Manual-Single Mode
        4. 7.4.1.4 Manual-Scan Mode
        5. 7.4.1.5 Auto-Single Mode
        6. 7.4.1.6 Auto-Scan Mode
        7. 7.4.1.7 Auto-Single With Sleep Mode
        8. 7.4.1.8 Auto-Scan With Sleep Mode
        9. 7.4.1.9 Auto-Burst Scan With Sleep Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
      2. 7.5.2 I2C Address Selection
      3. 7.5.3 I2C Speed Modes
      4. 7.5.4 Slave Mode Operations
        1. 7.5.4.1 Receive Mode
        2. 7.5.4.2 Transmit Mode:
      5. 7.5.5 Writing the Registers
      6. 7.5.6 Reading the Registers
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Using an Operational Amplifier Between Multiplexer Output and ADC Input
      2. 8.1.2 Using an Operational Amplifier and RC Filter Between Multiplexer Output and ADC Input
      3. 8.1.3 Using an RC Filter Between Multiplexer Output and ADC Input
      4. 8.1.4 Operational Amplifier With Filter and Gain Option Between Multiplexer Output and ADC Input
      5. 8.1.5 Driving an RC Filter With an Operational Amplifier Between Multiplexer Output and ADC Input
      6. 8.1.6 Average Power Consumption
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Throughput
        2. 8.2.2.2 Selecting the Operational Amplifier
        3. 8.2.2.3 Selecting the RC Filter
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

MicroPOWER, E2E are trademarks of Texas Instruments.

I2C is a trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.