SLAS708A September   2010  – September 2019 ADS7947 , ADS7948 , ADS7949

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     ADS794x Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions: ADS794x (12-, 10-, 8-Bit)
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ADS7947 (12-Bit)
    6. 7.6  Electrical Characteristics: ADS7948 (10-Bit)
    7. 7.7  Electrical Characteristics: ADS7949 (8-Bit)
    8. 7.8  Timing Requirements
    9. 7.9  Switching Characteristics
    10. 7.10 Typical Characteristics: ADS7947, ADS7948, ADS7949
    11. 7.11 Typical Characteristics: ADS7947 (12-Bit)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer and ADC Input
      2. 8.3.2 Reference
      3. 8.3.3 Clock
      4. 8.3.4 ADC Transfer Function
      5. 8.3.5 Power-Down
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Operation
    5. 8.5 Programming
      1. 8.5.1 16-Clock Frame
      2. 8.5.2 32-Clock Frame
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving an ADC Without a Driving Op Amp
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) ADS794x UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 54.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.7 °C/W
RθJB Junction-to-board thermal resistance 19.2 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 14.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.