SLAS605C June   2008  – July 2018 ADS7950 , ADS7951 , ADS7952 , ADS7953 , ADS7954 , ADS7955 , ADS7956 , ADS7957 , ADS7958 , ADS7959 , ADS7960 , ADS7961

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Detailed Block Diagram
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: TSSOP Packages
    2.     Pin Functions: VQFN Packages
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TSSOP
    5. 7.5  Thermal Information: VQFN
    6. 7.6  Electrical Characteristics: ADS7950, ADS7951, ADS7952, ADS7953
    7. 7.7  Electrical Characteristics, ADS7954, ADS7955, ADS7956, ADS7957
    8. 7.8  Electrical Characteristics, ADS7958, ADS7959, ADS7960, ADS7961
    9. 7.9  Timing Requirements
    10. 7.10 Typical Characteristics (All ADS79xx Family Devices)
    11. 7.11 Typical Characteristics (12-Bit Devices Only)
    12. 7.12 Typical Characteristics (12-Bit Devices Only)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Reference
      2. 8.3.2 Power Saving
    4. 8.4 Device Functional Modes
      1. 8.4.1 Channel Sequencing Modes
      2. 8.4.2 Device Programming and Mode Control
        1. 8.4.2.1 Mode Control Register
        2. 8.4.2.2 Program Registers
      3. 8.4.3 Device Power-Up Sequence
      4. 8.4.4 Operating in Manual Mode
      5. 8.4.5 Operating in Auto-1 Mode
      6. 8.4.6 Operating in Auto-2 Mode
      7. 8.4.7 Continued Operation in a Selected Mode
    5. 8.5 Programming
      1. 8.5.1 Digital Output
      2. 8.5.2 GPIO Registers
      3. 8.5.3 Alarm Thresholds for GPIO Pins
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Analog Input
    2. 9.2 Typical Applications
      1. 9.2.1 Unbuffered Multiplexer Output (MXO)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 OPA192 Buffered Multiplexer Output (MXO)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
  • DBT|38
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Thermal Information: VQFN

THERMAL METRIC(1) ADS7953, ADS7957, ADS7961 UNIT
RHB (VQFN) RGE (VQFN)
32 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 40.6 36.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.1 39.3 °C/W
RθJB Junction-to-board thermal resistance 13.1 14.7 °C/W
ψJT Junction-to-top characterization parameter 0.8 0.7 °C/W
ψJB Junction-to-board characterization parameter 13 14.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.7 5.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.