SBAS363E December   2009  – August 2016 ADS8331 , ADS8332

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Companion Products
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics: VA = 2.7 V
    6. 8.6  Electrical Characteristics: VA = 5 V
    7. 8.7  Timing Requirements: VA = 2.7 V
    8. 8.8  Timing Characteristics: VA = 5 V
    9. 8.9  Typical Characteristics: DC Performance
    10. 8.10 Typical Characteristics: AC Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Signal Conditioning
      2. 9.3.2 Analog Input
        1. 9.3.2.1 Driver Amplifier Choice
        2. 9.3.2.2 Bipolar to Unipolar Driver
    4. 9.4 Device Functional Modes
      1. 9.4.1 Reference
      2. 9.4.2 Converter Operation
        1. 9.4.2.1 Manual Channel Select Mode
        2. 9.4.2.2 Auto Channel Select Mode
        3. 9.4.2.3 Start of a Conversion
        4. 9.4.2.4 Status Output Pin (EOC/INT)
        5. 9.4.2.5 Power-Down Modes and Acquisition Time
    5. 9.5 Programming
      1. 9.5.1 Digital Interface
        1. 9.5.1.1 Internal Register
      2. 9.5.2 Writing to the Converter
        1. 9.5.2.1 Configuring the Converter and Default Mode
      3. 9.5.3 Reading the Configuration Register
      4. 9.5.4 Reading the Conversion Result
        1. 9.5.4.1 TAG Mode
        2. 9.5.4.2 Daisy-Chain Mode
      5. 9.5.5 Reset Function
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 ADC Reference Driver
        1. 10.1.1.1 Reference Driver Circuit for VREF = 4.096 V
        2. 10.1.1.2 Reference Driver Circuit for VREF=2.5 V, VA=2.7 V
      2. 10.1.2 ADC Input Driver
        1. 10.1.2.1 Input Amplifier Selection
        2. 10.1.2.2 ADC Input RC Filter
    2. 10.2 Typical Applications
      1. 10.2.1 DAQ Circuit for Low Noise and Distortion Performance for a 10-kHz Input Signal at 500 kSPS
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Ultra Low-Power DAQ Circuit for DC Input Signals at 10 kSPS per Channel
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 8. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADS8331 Click here Click here Click here Click here Click here
ADS8332 Click here Click here Click here Click here Click here

13.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 Trademarks

TMS320, E2E are trademarks of Texas Instruments.

SPI is a trademark of Motorola, Inc.

All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.