SBAS677A June   2014  – October 2014 ADS8339

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Family
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parametric Measurement Information
    1. 8.1 Timing Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Input
      2. 9.3.2 Power Saving
      3. 9.3.3 Digital Output
      4. 9.3.4 SCLK Input
    4. 9.4 Device Functional Modes
      1. 9.4.1 CS Mode for a 3-Wire Interface
        1. 9.4.1.1 3-Wire CS Mode Without a Busy Indicator
        2. 9.4.1.2 3-Wire CS Mode With a Busy Indicator
      2. 9.4.2 CS Mode for a 4-Wire Interface
        1. 9.4.2.1 4-Wire CS Mode Without a Busy Indicator
        2. 9.4.2.2 4-Wire CS Mode With a Busy Indicator
      3. 9.4.3 Daisy-Chain Mode
        1. 9.4.3.1 Daisy-Chain Mode Without a Busy Indicator
        2. 9.4.3.2 Daisy-Chain Mode With a Busy Indicator
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 ADC Reference Driver
        1. 10.1.1.1 Reference Driver Circuit
      2. 10.1.2 ADC Input Driver
        1. 10.1.2.1 Input Amplifier Selection
        2. 10.1.2.2 Antialiasing Filter
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Do's and Don'ts
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

REF5045 Data Sheet, SBOS410

THS4281 Data Sheet, SLOS432

OPA333 Data Sheet, SBOS351

OPA836 Data Sheet, SLOS713

ADS886xEVM-PDK and ADS83x9EVM-PDK User Guide, SBAU233

13.2 Trademarks

SPI is a trademark of Motorola.

TINA is a trademark of Texas Instruments Inc..

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.