SBAS761A February   2020  – February 2020 ADS8355

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings
    3. 6.3      Recommended Operating Conditions
    4. 6.4      Thermal Information
    5. 6.5      Electrical Characteristics
    6. Table 1. Timing Requirements
    7. Table 2. Switching Characteristics
    8. 6.6      Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input: Full-Scale Range Selection
        2. 7.3.2.2 Analog Input: Single-Ended and Pseudo-Differential Configurations
      3. 7.3.3 Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Conversion Data Read: Dual-SDO Mode (Default)
      2. 7.4.2 Conversion Data Read: Single-SDO Mode
      3. 7.4.3 Low-Power Modes
        1. 7.4.3.1 STANDBY Mode
        2. 7.4.3.2 PD (Power-Down) Mode
    5. 7.5 Programming
      1. 7.5.1 Register Read/Write Operation
    6. 7.6 Register Map
      1. 7.6.1 ADS8355 Registers
        1. 7.6.1.1  PD_STANDBY Register (Offset = 4h) [reset = 0h]
          1. Table 9. PD_STANDBY Register Field Descriptions
        2. 7.6.1.2  PD_KEY Register (Offset = 5h) [reset = 0h]
          1. Table 10. PD_KEY Register Field Descriptions
        3. 7.6.1.3  SDO_CTRL Register (Offset = Dh) [reset = 0h]
          1. Table 11. SDO_CTRL Register Field Descriptions
        4. 7.6.1.4  DATA_OUT_CTRL Register (Offset = 11h) [reset = 0h]
          1. Table 12. DATA_OUT_CTRL Register Field Descriptions
        5. 7.6.1.5  REF_SEL Register (Offset = 20h) [reset = 0h]
          1. Table 13. REF_SEL Register Field Descriptions
        6. 7.6.1.6  REFDAC_A_LSB Register (Offset = 24h) [reset = 0h]
          1. Table 14. REFDAC_A_LSB Register Field Descriptions
        7. 7.6.1.7  REFDAC_A_MSB Register (Offset = 25h) [reset = 0h]
          1. Table 15. REFDAC_A_MSB Register Field Descriptions
        8. 7.6.1.8  REFDAC_B_LSB Register (Offset = 26h) [reset = 0h]
          1. Table 16. REFDAC_B_LSB Register Field Descriptions
        9. 7.6.1.9  REFDAC_B_MSB Register (Offset = 27h) [reset = 0h]
          1. Table 17. REFDAC_B_MSB Register Field Descriptions
        10. 7.6.1.10 INPUT_CONFIG Register (Offset = 28h) [reset = 0h]
          1. Table 18. INPUT_CONFIG Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Amplifier Selection
      2. 8.1.2 Charge Kickback Filter
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AVDD to REFGND_x(2) or GND –0.3 6 V
DVDD to GND –0.3 6 V
Analog (AINP_x and AINM_x)(3) and reference input (REFIO_x) voltage with respect to REFGND_x REFGND_x – 0.3 AVDD + 0.3 V
Digital input voltage with respect to GND GND – 0.3 DVDD + 0.3 V
REFGND_x GND – 0.3 GND + 0.3 V
Input current to any pin except supply pins –10 10 mA
Junction temperature, TJ –40 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) REFGND_x refers to REFGND_A and REFGND_B. REFIO_x refers to REFIO_A and REFIO_B.
(3) AINP_x refers AINP_A and AINP_B. AINM_x refers to AINM_A and AINM_B.