SBASAY5 June   2024 ADS8681W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input Structure
      2. 6.3.2 Analog Input Impedance
      3. 6.3.3 Input Protection Circuit
      4. 6.3.4 Programmable Gain Amplifier (PGA)
      5. 6.3.5 Second-Order, Low-Pass Filter (LPF)
      6. 6.3.6 ADC Driver
      7. 6.3.7 Reference
        1. 6.3.7.1 Internal Reference
        2. 6.3.7.2 External Reference
      8. 6.3.8 ADC Transfer Function
      9. 6.3.9 Alarm Features
        1. 6.3.9.1 Input Alarm
        2. 6.3.9.2 AVDD Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Host-to-Device Connection Topologies
        1. 6.4.1.1 Single Device: All multiSPI Options
        2. 6.4.1.2 Single Device: Standard SPI Interface
        3. 6.4.1.3 Multiple Devices: Daisy-Chain Topology
      2. 6.4.2 Device Operational Modes
        1. 6.4.2.1 RESET State
        2. 6.4.2.2 ACQ State
        3. 6.4.2.3 CONV State
    5. 6.5 Programming
      1. 6.5.1 Data Transfer Frame
      2. 6.5.2 Input Command Word and Register Write Operation
      3. 6.5.3 Output Data Word
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols With a Single SDO-x
          2. 6.5.4.2.2 Legacy, SPI-Compatible (SYS-xy-S) Protocols With Dual SDO-x
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options
            2. 6.5.4.2.3.2 Output Bus Width Options
  8. 7 Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 DEVICE_ID_REG Register (address = 00h)
      2. 7.1.2 RST_PWRCTL_REG Register (address = 04h)
      3. 7.1.3 SDI_CTL_REG Register (address = 08h)
      4. 7.1.4 SDO_CTL_REG Register (address = 0Ch)
      5. 7.1.5 DATAOUT_CTL_REG Register (address = 10h)
      6. 7.1.6 RANGE_SEL_REG Register (address = 14h)
      7. 7.1.7 ALARM_REG Register (address = 20h)
      8. 7.1.8 ALARM_H_TH_REG Register (address = 24h)
      9. 7.1.9 ALARM_L_TH_REG Register (address = 28h)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Alarm Function
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
      2. 8.3.2 Power Saving
        1. 8.3.2.1 NAP Mode
        2. 8.3.2.2 Power-Down (PD) Mode
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

Figure 8-8 illustrates a PCB layout example for the ADS868xW with a single-ended input configuration and AINM connected to GND.

  • Partition the PCB into analog and digital sections. Make sure the analog signals are kept away from the digital lines. This layout helps keep the analog input and reference input signals away from the digital noise. In this layout example, the analog input and reference signals are routed on the lower side of the board. Additionally, the digital connections are routed on the top side of the board.
  • Use a single dedicated ground plane.
  • Make sure power sources to the ADS868xW are clean and well-bypassed. Use a 1μF, X7R-grade, 0603-size ceramic capacitor with at least a 10V rating in close proximity to the analog (AVDD) supply pins. For decoupling the digital supply pin (DVDD), use a 1μF, X7R-grade, 0603-size ceramic capacitor with at least a 10V rating. Avoid placing vias between the AVDD and DVDD pins and the bypass capacitors. Connect all ground pins to the ground plane with short, low-impedance paths.
  • There are two decoupling capacitors used for the REFCAP pin. The first is a small, 1μF, 0603-size ceramic capacitor placed close to the device pins for decoupling the high-frequency signals. The second is a 10μF, 0805-size ceramic capacitor to provide the charge required by the reference circuit of the device. Use a capacitor with an ESR less than 0.2Ω for the 10μF capacitor. Directly connect both capacitors to the device pins without any vias between the pins and capacitors.
  • Decouple the REFIO pin with a minimum of 4.7μF ceramic capacitor if the internal reference of the device is used. Place the capacitor close to the device pins.