SBASAY5 June 2024 ADS8681W
PRODUCTION DATA
THERMAL METRIC(1) | ADS868xW | UNIT | |
---|---|---|---|
RUM (WQFN) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 31.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 27.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 7.4 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 7.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.9 | °C/W |