SBASAY5 June   2024 ADS8681W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input Structure
      2. 6.3.2 Analog Input Impedance
      3. 6.3.3 Input Protection Circuit
      4. 6.3.4 Programmable Gain Amplifier (PGA)
      5. 6.3.5 Second-Order, Low-Pass Filter (LPF)
      6. 6.3.6 ADC Driver
      7. 6.3.7 Reference
        1. 6.3.7.1 Internal Reference
        2. 6.3.7.2 External Reference
      8. 6.3.8 ADC Transfer Function
      9. 6.3.9 Alarm Features
        1. 6.3.9.1 Input Alarm
        2. 6.3.9.2 AVDD Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Host-to-Device Connection Topologies
        1. 6.4.1.1 Single Device: All multiSPI Options
        2. 6.4.1.2 Single Device: Standard SPI Interface
        3. 6.4.1.3 Multiple Devices: Daisy-Chain Topology
      2. 6.4.2 Device Operational Modes
        1. 6.4.2.1 RESET State
        2. 6.4.2.2 ACQ State
        3. 6.4.2.3 CONV State
    5. 6.5 Programming
      1. 6.5.1 Data Transfer Frame
      2. 6.5.2 Input Command Word and Register Write Operation
      3. 6.5.3 Output Data Word
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols With a Single SDO-x
          2. 6.5.4.2.2 Legacy, SPI-Compatible (SYS-xy-S) Protocols With Dual SDO-x
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options
            2. 6.5.4.2.3.2 Output Bus Width Options
  8. 7 Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 DEVICE_ID_REG Register (address = 00h)
      2. 7.1.2 RST_PWRCTL_REG Register (address = 04h)
      3. 7.1.3 SDI_CTL_REG Register (address = 08h)
      4. 7.1.4 SDO_CTL_REG Register (address = 0Ch)
      5. 7.1.5 DATAOUT_CTL_REG Register (address = 10h)
      6. 7.1.6 RANGE_SEL_REG Register (address = 14h)
      7. 7.1.7 ALARM_REG Register (address = 20h)
      8. 7.1.8 ALARM_H_TH_REG Register (address = 24h)
      9. 7.1.9 ALARM_L_TH_REG Register (address = 28h)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Alarm Function
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
      2. 8.3.2 Power Saving
        1. 8.3.2.1 NAP Mode
        2. 8.3.2.2 Power-Down (PD) Mode
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AIN_P, AIN_M to GND AVDD = 5V –20 20 V
AVDD = Unpowered –15 15
AVDD to GND or DVDD to GND –0.3 7 V
REFCAP to REFGND or REFIO to REFGND –0.3 5.7 V
GND to REFGND –0.3 0.3 V
Digital input pins to GND –0.3 DVDD + 0.3 V
Digital output pins to GND –0.3 DVDD + 0.3 V
Input current to any pin except supply pins –10 10 mA
Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –60 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.