SBASAY5 June   2024 ADS8681W

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input Structure
      2. 6.3.2 Analog Input Impedance
      3. 6.3.3 Input Protection Circuit
      4. 6.3.4 Programmable Gain Amplifier (PGA)
      5. 6.3.5 Second-Order, Low-Pass Filter (LPF)
      6. 6.3.6 ADC Driver
      7. 6.3.7 Reference
        1. 6.3.7.1 Internal Reference
        2. 6.3.7.2 External Reference
      8. 6.3.8 ADC Transfer Function
      9. 6.3.9 Alarm Features
        1. 6.3.9.1 Input Alarm
        2. 6.3.9.2 AVDD Alarm
    4. 6.4 Device Functional Modes
      1. 6.4.1 Host-to-Device Connection Topologies
        1. 6.4.1.1 Single Device: All multiSPI Options
        2. 6.4.1.2 Single Device: Standard SPI Interface
        3. 6.4.1.3 Multiple Devices: Daisy-Chain Topology
      2. 6.4.2 Device Operational Modes
        1. 6.4.2.1 RESET State
        2. 6.4.2.2 ACQ State
        3. 6.4.2.3 CONV State
    5. 6.5 Programming
      1. 6.5.1 Data Transfer Frame
      2. 6.5.2 Input Command Word and Register Write Operation
      3. 6.5.3 Output Data Word
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols With a Single SDO-x
          2. 6.5.4.2.2 Legacy, SPI-Compatible (SYS-xy-S) Protocols With Dual SDO-x
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options
            2. 6.5.4.2.3.2 Output Bus Width Options
  8. Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 DEVICE_ID_REG Register (address = 00h)
      2. 7.1.2 RST_PWRCTL_REG Register (address = 04h)
      3. 7.1.3 SDI_CTL_REG Register (address = 08h)
      4. 7.1.4 SDO_CTL_REG Register (address = 0Ch)
      5. 7.1.5 DATAOUT_CTL_REG Register (address = 10h)
      6. 7.1.6 RANGE_SEL_REG Register (address = 14h)
      7. 7.1.7 ALARM_REG Register (address = 20h)
      8. 7.1.8 ALARM_H_TH_REG Register (address = 24h)
      9. 7.1.9 ALARM_L_TH_REG Register (address = 28h)
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Alarm Function
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
      2. 8.3.2 Power Saving
        1. 8.3.2.1 NAP Mode
        2. 8.3.2.2 Power-Down (PD) Mode
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

at AVDD_5V = 4.75V to 5.25V, VDD_1V8 = 1.75V to 1.85V, IOVDD = 1.15V to 1.85V, and maximum throughput (unless otherwise noted); minimum and maximum values at TA = -40°C to +125°C; typical values at TA = 25°C
MIN TYP MAX UNIT
CONVERSION CYCLE
fcycle Sampling frequency ADS8681W 1000 kSPS
ADS8685W 500
ADS8689W 100
tcycle ADC cycle time period 1 / fcycle
tacq Acquisition time ADS8681W 335 ns
ADS8685W 1000
ADS8689W 5000
tconv Conversion time ADS8681W 665 ns
ADS8685W 1000
ADS8689W 5000
ASYNCHRONOUS RESET
twl_RST Pulse duration: RST low 100 ns
tD_RST_POR Delay time for POR reset: RST rising to RVS rising 20 ms
tD_RST_APP Delay time for application reset: RST rising to CONVST/CS rising 1 µs
tNAP_WKUP Wake-up time: NAP mode 20 µs
tPWRUP Power-up time: PD mode 20 ms
SPI-COMPATIBLE SERIAL INTERFACE
fCLK Serial clock frequency 66.67 Mhz
tCLK Serial clock time period 1/fCLK
tPH_CK SCLK high time 0.45 0.55 tCLK
tPL_CK SCLK low time 0.45 0.55 tCLK
tSU_CSCK Setup time: CONVST/CS falling to first SCLK capture edge 7.5 ns
tSU_CKDI Setup time: SDI data valid to SCLK capture edge 7.5 ns
tHT_CKDI Hold time: SCLK capture edge to (previous) data valid on SDI 7.5 ns
tHT_CKCS Delay time: last SCLK capture edge to CONVST/CS rising 7.5 ns
tDEN_CSDO Delay time: CONVST/CS falling edge to data enable 9.5 ns
tDZ_CSDO Delay time: CONVST/CS rising to SDO-x going to 3-state 10 ns
tD_CKDO Delay time: SCLK launch edge to (next) data valid on SDO-x 12 ns
tD_CSRVS Delay time: CONVST/CS rising edge to RVS falling 14 ns
SOURCE-SYNCHRONOUS SERIAL INTERFACE (EXTERNAL CLOCK)
fCLK Serial clock frequency 66.67 MHz
tCLK Serial clock time period 1/fCLK
tPH_CK SCLK high time 0.45 0.55 tCLK
tPL_CK SCLK low time 0.45 0.55 tCLK
Delay time: CONVST/CS falling edge to data enable 9.5 ns
Delay time: CONVST/CS rising to SDO-x going to tri-state 10 ns
Delay time: SCLK rising edge to RVS rising 14 ns
Delay time: SCLK falling edge to RVS falling 14 ns
Delay time: RVS rising to (next) data valid on SDO-x 2.5 ns
Delay time: CONVST/CS rising edge to RVS displaying internal device state 15 ns
SOURCE-SYNCHRONOUS SERIAL INTERFACE (INTERNAL CLOCK)
tDEN_CSDO Delay time: CONVST/CS falling edge to data enable 9.5 ns
tDZ_CSDO Delay time: CONVST/CS rising to SDO-x going to tri-state 10 ns
tDEN_CSRVS Delay time: CONVST/CS falling edge to first rising edge on RVS 50 ns
tD_RVSDO Delay time: RVS rising to (next) data valid on SDO-x 2.5 ns
tINTCLK Time period: internal clock 15 ns
tCYC_RVS Time period: RVS signal 15 ns
tWH_RVS RVS high time 0.4 0.6 tINTCLK
tWL_RVS RVS low time 0.4 0.6 tINTCLK
tD_CSRVS Delay time: CONVST/CS rising edge to RVS displaying internal device state 15 ns