SBAS905C November   2019  – July 2020 ADS8686S

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Switching Characteristics
    8. 6.8  Timing Diagrams: Universal
    9. 6.9  Timing Diagrams: Parallel Data Read
    10. 6.10 Timing Diagrams: Serial Data Read
    11. 6.11 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs
      2. 7.3.2  Analog Input Impedance
      3. 7.3.3  Input Clamp Protection Circuit
      4. 7.3.4  Programmable Gain Amplifier (PGA)
      5. 7.3.5  Second-Order, Programmable, Low-Pass Filter (LPF)
      6. 7.3.6  ADC Driver
      7. 7.3.7  Multiplexer
      8. 7.3.8  Digital Filter and Noise
      9. 7.3.9  Reference
        1. 7.3.9.1 Internal Reference
        2. 7.3.9.2 External Reference
        3. 7.3.9.3 Supplying One VREF to Multiple Devices
      10. 7.3.10 ADC Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Interface: Pin Description
        1. 7.4.1.1  REFSEL (Input)
        2. 7.4.1.2  RESET (Input)
        3. 7.4.1.3  SEQEN (Input)
        4. 7.4.1.4  HW_RANGESEL[1:0] (Input)
        5. 7.4.1.5  SER/BYTE/PAR (Input)
        6. 7.4.1.6  DB[3:0] (Input/Output)
        7. 7.4.1.7  DB4/SER1W (Input/Output)
        8. 7.4.1.8  DB5/CRCEN (Input/Output)
        9. 7.4.1.9  DB[7:6] (Input/Output)
        10. 7.4.1.10 DB8 (Input/Output)
        11. 7.4.1.11 DB9/BYTESEL (Input/Output)
        12. 7.4.1.12 DB10/SDI (Input/Output)
        13. 7.4.1.13 DB11/SDOB (Input/Output)
        14. 7.4.1.14 DB12/SDOA (Input/Output)
        15. 7.4.1.15 DB13/OS0 (Input/Output)
        16. 7.4.1.16 DB14/OS1 (Input/Output)
        17. 7.4.1.17 DB15/OS2 (Input/Output)
        18. 7.4.1.18 WR/BURST (Input)
        19. 7.4.1.19 SCLK/RD (Input)
        20. 7.4.1.20 CS (Input)
        21. 7.4.1.21 CHSEL[2:0] (Input)
        22. 7.4.1.22 BUSY (Output)
        23. 7.4.1.23 CONVST (Input)
      2. 7.4.2 Device Modes of Operation
        1. 7.4.2.1 Shutdown Mode
        2. 7.4.2.2 Operation Mode
          1. 7.4.2.2.1 Hardware Mode
          2. 7.4.2.2.2 Software Mode
        3. 7.4.2.3 Reset Functionality
        4. 7.4.2.4 Channel Selection
          1. 7.4.2.4.1 Hardware Mode Channel Selection
          2. 7.4.2.4.2 Software Mode Channel Selection
        5. 7.4.2.5 Sequencer
          1. 7.4.2.5.1 Hardware Mode Sequencer
          2. 7.4.2.5.2 Software Mode Sequencer
        6. 7.4.2.6 Burst Sequencer
          1. 7.4.2.6.1 Hardware Mode Burst Sequencer
          2. 7.4.2.6.2 Software Mode Burst Sequencer
        7. 7.4.2.7 Diagnostics
          1. 7.4.2.7.1 Analog Diagnosis
          2. 7.4.2.7.2 Interface Diagnosis: SELF TEST and CRC
    5. 7.5 Programming
      1. 7.5.1 Parallel Interface
        1. 7.5.1.1 Reading Conversion Results
        2. 7.5.1.2 Writing Register Data
        3. 7.5.1.3 Reading Register Data
      2. 7.5.2 Parallel Byte Interface
        1. 7.5.2.1 Reading Conversion Results
        2. 7.5.2.2 Writing Register Data
        3. 7.5.2.3 Reading Register Data
      3. 7.5.3 Serial Interface
        1. 7.5.3.1 Reading Conversion Results
        2. 7.5.3.2 Writing Register Data
        3. 7.5.3.3 Reading Register Data
    6. 7.6 Register Maps
      1. 7.6.1 Page1 Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 8x2 Channel Data Acquisition System (DAQ) for Power Automation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Input Protection for Electrical Overstress
  9. Power Supply Recommendations
    1. 9.1 Power Supplies
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics

At AVDD = 5 V, DVDD = 1.71 V to 5.25 V, VIL and VIH at datasheet limits, and fSAMPLE = 1 MSPS (unless otherwise noted); minimum and maximum values are at TA = –40°C to +125°C; typical values are at TA = 25°C.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
CONVST CONTROL
tCYCADC cycle timeNo oversampling, parallel or byte or serial 2-wire mode readback1µs
tCONVConversion time: CONVST rising edge to BUSY falling edge time, input channelsNo oversampling475520ns
Oversampling by 21.4µs
Oversampling by 43.2µs
Oversampling by 86.7µs
Oversampling by 1613.7µs
Oversampling by 3227.9µs
Oversampling by 6455.9µs
Oversampling by 128112µs
tCONV_DIAGConversion time: CONVST rising edge to BUSY falling edge time, diagnostic channelsNo oversampling525570ns
Oversampling by 21.4µs
Oversampling by 43.2µs
Oversampling by 86.7µs
Oversampling by 1613.7µs
Oversampling by 3227.9µs
Oversampling by 6455.9µs
Oversampling by 128112µs
tD_CNVBSYDelay between CONVST rising edge to BUSY rising edgeManual mode32ns
PARALLEL AND BYTE DATA READ
tD_ RDDBDelay time: RD falling edge to new data on DB[15:0]30ns
tDHZ_ CSDBDelay time: CS rising edge to DB[15:0] becoming tri-state1.71 V ≤ DVDD ≤ 2.3 V20ns
Delay time: CS rising edge to DB[15:0] becoming tri-state
DVDD > 2.3 V
12ns
SERIAL DATA READ
tD_ CSDODelay time: CS falling edge to SDOA and SDOB becoming valid (out of tri-state)1.71 V ≤ DVDD ≤ 2.3 V
16ns
Delay time: CS falling edge to SDOA and SDOB becoming valid (out of tri-state)DVDD > 2.3 V
9ns
tH_CKDOHold time: SCLK rising edge to data hold on SDOA and SDOB1.71 V ≤ DVDD ≤ 2.3 V
3ns
Hold time: SCLK rising edge to data hold on SDOA and SDOB2.3 V ≤ DVDD ≤ 3 V
3ns
Hold time: SCLK rising edge to data hold on SDOA and SDOBDVDD > 3 V
2.8ns
tD_CKDODelay time: SCLK rising edge to valid data on SDOA and SDOB1.71 V ≤ DVDD ≤ 2.3 V
20ns
Delay time: SCLK rising edge to valid data on SDOA and SDOB2.3 V < DVDD ≤ 3 V
12ns
Delay time: SCLK rising edge to valid data on SDOA and SDOBDVDD > 3 V
10ns
tDHZ_ CSDODelay time: CS rising edge to SDOA and SDOB becoming tri-state1.71 V ≤ DVDD ≤ 2.3 V
20ns
Delay time: CS rising edge to SDOA and SDOB becoming tri-stateDVDD > 2.3 V
10ns