SBAS686 July   2015 ADS8694 , ADS8698

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Analog Inputs
      2. 8.3.2  Analog Input Impedance
      3. 8.3.3  Input Overvoltage Protection Circuit
      4. 8.3.4  Programmable Gain Amplifier (PGA)
      5. 8.3.5  Second-Order, Low-Pass Filter (LPF)
      6. 8.3.6  ADC Driver
      7. 8.3.7  Multiplexer (MUX)
      8. 8.3.8  Reference
        1. 8.3.8.1 Internal Reference
        2. 8.3.8.2 External Reference
      9. 8.3.9  Auxiliary Channel
        1. 8.3.9.1 Input Driver for the AUX Channel
      10. 8.3.10 ADC Transfer Function
      11. 8.3.11 Alarm Feature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Interface
        1. 8.4.1.1 Digital Pin Description
          1. 8.4.1.1.1 CS (Input)
          2. 8.4.1.1.2 SCLK (Input)
          3. 8.4.1.1.3 SDI (Input)
          4. 8.4.1.1.4 SDO (Output)
          5. 8.4.1.1.5 DAISY (Input)
          6. 8.4.1.1.6 RST/PD (Input)
        2. 8.4.1.2 Data Acquisition Example
        3. 8.4.1.3 Host-to-Device Connection Topologies
          1. 8.4.1.3.1 Daisy-Chain Topology
          2. 8.4.1.3.2 Star Topology
      2. 8.4.2 Device Modes
        1. 8.4.2.1 Continued Operation in the Selected Mode (NO_OP)
        2. 8.4.2.2 Frame Abort Condition (FRAME_ABORT)
        3. 8.4.2.3 STANDBY Mode (STDBY)
        4. 8.4.2.4 Power-Down Mode (PWR_DN)
        5. 8.4.2.5 Auto Channel Enable with Reset (AUTO_RST)
        6. 8.4.2.6 Manual Channel n Select (MAN_Ch_n)
        7. 8.4.2.7 Channel Sequencing Modes
        8. 8.4.2.8 Reset Program Registers (RST)
    5. 8.5 Register Maps
      1. 8.5.1 Command Register Description
      2. 8.5.2 Program Register Description
        1. 8.5.2.1 Program Register Read/Write Operation
        2. 8.5.2.2 Program Register Map
        3. 8.5.2.3 Program Register Descriptions
          1. 8.5.2.3.1 Auto-Scan Sequencing Control Registers
            1. 8.5.2.3.1.1 Auto-Scan Sequence Enable Register (address = 01h)
            2. 8.5.2.3.1.2 Channel Power Down Register (address = 02h)
          2. 8.5.2.3.2 Device Features Selection Control Register (address = 03h)
          3. 8.5.2.3.3 Range Select Registers (addresses 05h-0Ch)
          4. 8.5.2.3.4 Alarm Flag Registers (Read-Only)
            1. 8.5.2.3.4.1 ALARM Overview Tripped-Flag Register (address = 10h)
            2. 8.5.2.3.4.2 Alarm Flag Registers: Tripped and Active (address = 11h to 14h)
          5. 8.5.2.3.5 Alarm Threshold Setting Registers
          6. 8.5.2.3.6 Command Read-Back Register (address = 3Fh)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Phase-Compensated, 8-Channel, Multiplexed Data Acquisition System for Power Automation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 18-Bit, 8-Channel, Integrated Analog Input Module for Programmable Logic Controllers (PLCs)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

TI E2E Community : e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright© 2014, Texas Instruments Incorporated