SBAS629B October   2015  – June 2017 ADS9110

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: Conversion Cycle
    7. 6.7  Timing Requirements: Asynchronous Reset, NAP, and PD
    8. 6.8  Timing Requirements: SPI-Compatible Serial Interface
    9. 6.9  Timing Requirements: Source-Synchronous Serial Interface (External Clock)
    10. 6.10 Timing Requirements: Source-Synchronous Serial Interface (Internal Clock)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Converter Module
        1. 7.3.1.1 Sample-and-Hold Circuit
        2. 7.3.1.2 External Reference Source
        3. 7.3.1.3 Internal Oscillator
        4. 7.3.1.4 ADC Transfer Function
      2. 7.3.2 Interface Module
    4. 7.4 Device Functional Modes
      1. 7.4.1 RST State
      2. 7.4.2 ACQ State
      3. 7.4.3 CNV State
    5. 7.5 Programming
      1. 7.5.1 Data Transfer Frame
      2. 7.5.2 Interleaving Conversion Cycles and Data Transfer Frames
      3. 7.5.3 Data Transfer Protocols
        1. 7.5.3.1 Protocols for Configuring the Device
        2. 7.5.3.2 Protocols for Reading From the Device
          1. 7.5.3.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 7.5.3.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 7.5.3.2.3 Source-Synchronous (SRC) Protocols
            1. 7.5.3.2.3.1 Output Clock Source Options with SRC Protocols
            2. 7.5.3.2.3.2 Bus Width Options with SRC Protocols
            3. 7.5.3.2.3.3 Output Data Rate Options with SRC Protocols
      4. 7.5.4 Device Setup
        1. 7.5.4.1 Single Device: All multiSPI™ Options
        2. 7.5.4.2 Single Device: Minimum Pins for a Standard SPI Interface
        3. 7.5.4.3 Multiple Devices: Daisy-Chain Topology
        4. 7.5.4.4 Multiple Devices: Star Topology
    6. 7.6 Register Maps
      1. 7.6.1 Device Configuration and Register Maps
        1. 7.6.1.1 PD_CNTL Register (address = 010h)
        2. 7.6.1.2 SDI_CNTL Register (address = 014h)
        3. 7.6.1.3 SDO_CNTL Register (address = 018h)
        4. 7.6.1.4 DATA_CNTL Register (address = 01Ch)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Driver
      2. 8.1.2 Input Amplifier Selection
      3. 8.1.3 Charge Kickback Filter
      4. 8.1.4 ADC Reference Driver
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power-Supply Recommendations
    1. 9.1 Power-Supply Decoupling
    2. 9.2 Power Saving
      1. 9.2.1 NAP Mode
      2. 9.2.2 PD Mode
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Signal Path
      2. 10.1.2 Grounding and PCB Stack-Up
      3. 10.1.3 Decoupling of Power Supplies
      4. 10.1.4 Reference Decoupling
      5. 10.1.5 Differential Input Decoupling
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

multiSPI, E2E are trademarks of Texas Instruments.

TINA is a trademark of TI.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.