SBAS629B October   2015  – June 2017 ADS9110

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: Conversion Cycle
    7. 6.7  Timing Requirements: Asynchronous Reset, NAP, and PD
    8. 6.8  Timing Requirements: SPI-Compatible Serial Interface
    9. 6.9  Timing Requirements: Source-Synchronous Serial Interface (External Clock)
    10. 6.10 Timing Requirements: Source-Synchronous Serial Interface (Internal Clock)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Converter Module
        1. 7.3.1.1 Sample-and-Hold Circuit
        2. 7.3.1.2 External Reference Source
        3. 7.3.1.3 Internal Oscillator
        4. 7.3.1.4 ADC Transfer Function
      2. 7.3.2 Interface Module
    4. 7.4 Device Functional Modes
      1. 7.4.1 RST State
      2. 7.4.2 ACQ State
      3. 7.4.3 CNV State
    5. 7.5 Programming
      1. 7.5.1 Data Transfer Frame
      2. 7.5.2 Interleaving Conversion Cycles and Data Transfer Frames
      3. 7.5.3 Data Transfer Protocols
        1. 7.5.3.1 Protocols for Configuring the Device
        2. 7.5.3.2 Protocols for Reading From the Device
          1. 7.5.3.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 7.5.3.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 7.5.3.2.3 Source-Synchronous (SRC) Protocols
            1. 7.5.3.2.3.1 Output Clock Source Options with SRC Protocols
            2. 7.5.3.2.3.2 Bus Width Options with SRC Protocols
            3. 7.5.3.2.3.3 Output Data Rate Options with SRC Protocols
      4. 7.5.4 Device Setup
        1. 7.5.4.1 Single Device: All multiSPI™ Options
        2. 7.5.4.2 Single Device: Minimum Pins for a Standard SPI Interface
        3. 7.5.4.3 Multiple Devices: Daisy-Chain Topology
        4. 7.5.4.4 Multiple Devices: Star Topology
    6. 7.6 Register Maps
      1. 7.6.1 Device Configuration and Register Maps
        1. 7.6.1.1 PD_CNTL Register (address = 010h)
        2. 7.6.1.2 SDI_CNTL Register (address = 014h)
        3. 7.6.1.3 SDO_CNTL Register (address = 018h)
        4. 7.6.1.4 DATA_CNTL Register (address = 01Ch)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Driver
      2. 8.1.2 Input Amplifier Selection
      3. 8.1.3 Charge Kickback Filter
      4. 8.1.4 ADC Reference Driver
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power-Supply Recommendations
    1. 9.1 Power-Supply Decoupling
    2. 9.2 Power Saving
      1. 9.2.1 NAP Mode
      2. 9.2.2 PD Mode
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Signal Path
      2. 10.1.2 Grounding and PCB Stack-Up
      3. 10.1.3 Decoupling of Power Supplies
      4. 10.1.4 Reference Decoupling
      5. 10.1.5 Differential Input Decoupling
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.