SBAS876C August   2018  – June 2019 ADS9224R , ADS9234R

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: ADS92x4R
    6. 6.6  Electrical Characteristics: ADS9224R
    7. 6.7  Electrical Characteristics: ADS9234R
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics: ADS9224R
    11. 6.11 Typical Characteristics: ADS9234R
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Converter Modules
        1. 7.3.1.1 Analog Input With Sample-and-Hold
        2. 7.3.1.2 ADC Transfer Function
      2. 7.3.2 Internal Reference Voltage
      3. 7.3.3 Reference Buffers
      4. 7.3.4 REFby2 Buffer
      5. 7.3.5 Data Averaging
        1. 7.3.5.1 Averaging of Two Samples
        2. 7.3.5.2 Averaging of Four Samples
    4. 7.4 Device Functional Modes
      1. 7.4.1 ACQ State
      2. 7.4.2 CNV State
      3. 7.4.3 Reset or Power-Down
        1. 7.4.3.1 Reset
        2. 7.4.3.2 Power-Down
      4. 7.4.4 Conversion Control and Data Transfer Frame
        1. 7.4.4.1 Conversion Control and Data Transfer Frame With Zero Cycle Latency (Zone 1 Transfer)
        2. 7.4.4.2 Conversion Control and Data Transfer Frame With Wide Read Cycle (Zone 2 Transfer)
    5. 7.5 READY/STROBE Output
      1. 7.5.1 READY Output
      2. 7.5.2 STROBE Output
    6. 7.6 Programming
      1. 7.6.1 Output Data Word
      2. 7.6.2 Data Transfer Protocols
        1. 7.6.2.1 Protocols for Reading From the Device
          1. 7.6.2.1.1 Legacy, SPI-Compatible Protocols (SPI-xy-S-SDR)
          2. 7.6.2.1.2 SPI-Compatible Protocols With Bus Width Options and Single Data Rate (SPI-xy-D-SDR and SPI-xy-Q-SDR)
          3. 7.6.2.1.3 SPI-Compatible Protocols With Bus Width Options and Double Data Rate (SPI-x1-S-DDR, SPI-x1-D-DDR, SPI-x1-Q-DDR)
          4. 7.6.2.1.4 Clock Re-Timer (CRT) Protocols (CRT-S-SDR, CRT-D-SDR, CRT-Q-SDR, CRT-S-DDR, CRT-D-DDR, CRT-Q-DDR)
          5. 7.6.2.1.5 Parallel Byte Protocols (PB-xy-AB-SDR, PB-xy-AA-SDR)
        2. 7.6.2.2 Device Setup
          1. 7.6.2.2.1 Single Device: All Enhanced-SPI Options
          2. 7.6.2.2.2 Single Device: Minimum Pins for a Standard SPI Interface
        3. 7.6.2.3 Protocols for Configuring the Device
      3. 7.6.3 Reading and Writing Registers
    7. 7.7 Register Maps
      1. 7.7.1 ADS92x4R Registers
        1. 7.7.1.1 DEVICE_STATUS Register (Offset = 0h) [reset = 0h]
          1. Table 12. DEVICE_STATUS Register Field Descriptions
        2. 7.7.1.2 POWER_DOWN_CFG Register (Offset = 1h) [reset = 0h]
          1. Table 13. POWER_DOWN_CFG Register Field Descriptions
        3. 7.7.1.3 PROTOCOL_CFG Register (Offset = 2h) [reset = 0h]
          1. Table 14. PROTOCOL_CFG Register Field Descriptions
        4. 7.7.1.4 BUS_WIDTH Register (Offset = 3h) [reset = 0h]
          1. Table 15. BUS_WIDTH Register Field Descriptions
        5. 7.7.1.5 CRT_CFG Register (Offset = 4h) [reset = 0h]
          1. Table 16. CRT_CFG Register Field Descriptions
        6. 7.7.1.6 OUTPUT_DATA_WORD_CFG Register (Offset = 5h) [reset = 0h]
          1. Table 17. OUTPUT_DATA_WORD_CFG Register Field Descriptions
        7. 7.7.1.7 DATA_AVG_CFG Register (Offset = 6h) [reset = 0h]
          1. Table 18. DATA_AVG_CFG Register Field Descriptions
        8. 7.7.1.8 REFBY2_OFFSET Register (Offset = 7h) [reset = 0h]
          1. Table 19. REFBY2_OFFSET Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Driver
        1. 8.1.1.1 Charge-Kickback Filter
      2. 8.1.2 Input Amplifier Selection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Signal Path
      2. 10.1.2 Grounding and PCB Stack-Up
      3. 10.1.3 Decoupling of Power Supplies
      4. 10.1.4 Reference Decoupling
      5. 10.1.5 Differential Input Decoupling
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.1 READY Output

After power-up or after exiting power-down (a rising edge on PD/RST), the READY signal is set high. After a time of 0.9 ms, this signal goes low, indicating that the device is initialized and the registers can be configured. However, conversions can be performed with the desired accuracy only after a time of tPD-WKUP (see the Specifications section). After power-up, for a zone 1 transfer (see Figure 44), the device starts conversion on the CONVST rising edge and the READY pin remains low during the conversion process. After a time of tDRDY, the conversion process completes, READY is set high, and data can be read by the host. The host can read data by bringing CS high and by providing clocks on SCLK. After CS is brought low, READY is set low.
For a zone 2 transfer, TI recommends masking the READY output by setting the READY_MASK bit in the OUTPUT_DATA_WORD_CFG register.