SBASAG2B December   2023  – August 2024 ADS9227

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Switching Characteristics
    8. 5.8  Timing Diagrams
    9. 5.9  Typical Characteristics: All Devices
    10. 5.10 Typical Characteristics: ADS9229
    11. 5.11 Typical Characteristics: ADS9228
    12. 5.12 Typical Characteristics: ADS9227
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
      2. 6.3.2 Analog Input Bandwidth
      3. 6.3.3 ADC Transfer Function
      4. 6.3.4 Reference
        1. 6.3.4.1 Internal Reference Voltage
        2. 6.3.4.2 External Reference Voltage
      5. 6.3.5 Temperature Sensor
      6. 6.3.6 Data Averaging
      7. 6.3.7 Digital Down Converter
      8. 6.3.8 Data Interface
        1. 6.3.8.1 Data Frame Width
        2. 6.3.8.2 Synchronizing Multiple ADCs
        3. 6.3.8.3 Test Patterns for Data Interface
          1. 6.3.8.3.1 User-Defined Test Pattern
          2. 6.3.8.3.2 User-Defined Alternating Test Pattern
          3. 6.3.8.3.3 Ramp Test Pattern
      9. 6.3.9 ADC Sampling Clock Input
    4. 6.4 Device Functional Modes
      1. 6.4.1 Reset
      2. 6.4.2 Power-Down Options
      3. 6.4.3 Normal Operation
      4. 6.4.4 Initialization Sequence
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. 7 Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Data Acquisition (DAQ) Circuit for ≤20kHz Input Signal Bandwidth
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Data Acquisition (DAQ) Circuit for ≤100kHz Input Signal Bandwidth
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Application Curves
      3. 8.2.3 Data Acquisition (DAQ) Circuit for ≤1MHz Input Signal Bandwidth
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.6 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.