SBASA81B January   2023  – October 2024 ADS9815 , ADS9817

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Clamp Protection Circuit
        2. 6.3.1.2 Programmable Gain Amplifier (PGA)
        3. 6.3.1.3 Wide-Common-Mode Voltage Rejection Circuit
        4. 6.3.1.4 Gain Error Calibration
      2. 6.3.2 ADC Transfer Function
      3. 6.3.3 ADC Sampling Clock Input
      4. 6.3.4 Reference
        1. 6.3.4.1 Internal Reference Voltage
        2. 6.3.4.2 External Reference Voltage
      5. 6.3.5 Sample Synchronization
      6. 6.3.6 Data Interface
        1. 6.3.6.1 Data Clock Output
        2. 6.3.6.2 ADC Output Data Randomizer
        3. 6.3.6.3 Test Patterns for Data Interface
          1. 6.3.6.3.1 Fixed Pattern
          2. 6.3.6.3.2 Digital Ramp
          3. 6.3.6.3.3 Alternating Test Pattern
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down
      2. 6.4.2 Reset
      3. 6.4.3 Initialization Sequence
      4. 6.4.4 Normal Operation
    5. 6.5 Programming
      1. 6.5.1 Register Write
      2. 6.5.2 Register Read
      3. 6.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration
        1. 6.5.3.1 Register Write With Daisy-Chain
        2. 6.5.3.2 Register Read With Daisy-Chain
  8. 7 Register Map
    1. 7.1 Register Bank 0
    2. 7.2 Register Bank 1
    3. 7.3 Register Bank 2
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Parametric Measurement Unit (PMU)
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.