SBOS531E August   2010  – June 2019 AFE031

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
  4. 4 Revision History
  5. 5 Description, continued
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Thermal Information
    4. 8.4  Electrical Characteristics: Transmitter (Tx)
    5. 8.5  Electrical Characteristics: Power Amplifier (PA)
    6. 8.6  Electrical Characteristics: Receiver (Rx)
    7. 8.7  Electrical Characteristics: Digital
    8. 8.8  Electrical Characteristics: Two-Wire Interface
    9. 8.9  Electrical Characteristics: Internal Bias Generator
    10. 8.10 Electrical Characteristics: Power Supply
    11. 8.11 Timing Requirements
    12. 8.12 Timing Diagrams
    13. 8.13 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Feature Description
      1. 9.2.1 PA Block
      2. 9.2.2 Tx Block
      3. 9.2.3 Rx Block
      4. 9.2.4 DAC Block
      5. 9.2.5 REF1 and REF2 Blocks
      6. 9.2.6 Zero Crossing Detector Block
      7. 9.2.7 ETx and ERx Blocks
    3. 9.3 Power Supplies
    4. 9.4 Pin Descriptions
      1. 9.4.1 Current Overload
      2. 9.4.2 Thermal Overload
    5. 9.5 Calibration Modes
      1. 9.5.1 Tx Calibration Mode
      2. 9.5.2 Rx Calibration Mode
    6. 9.6 Serial Interface
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Detailed Design Procedure
        1. 10.2.1.1 Line-Coupling Circuit
        2. 10.2.1.2 Circuit Protection
        3. 10.2.1.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Powerline Communications Developer’s Kit
        2. 11.1.2.2 TINA-TI™ (Free Software Download)
        3. 11.1.2.3 TI Precision Designs
        4. 11.1.2.4 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.