SBOS531E August   2010  – June 2019 AFE031

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
  4. Revision History
  5. Description, continued
  6. Device Comparison Table
  7. Pin Configuration and Functions
    1.     Pin Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Thermal Information
    4. 8.4  Electrical Characteristics: Transmitter (Tx)
    5. 8.5  Electrical Characteristics: Power Amplifier (PA)
    6. 8.6  Electrical Characteristics: Receiver (Rx)
    7. 8.7  Electrical Characteristics: Digital
    8. 8.8  Electrical Characteristics: Two-Wire Interface
    9. 8.9  Electrical Characteristics: Internal Bias Generator
    10. 8.10 Electrical Characteristics: Power Supply
    11. 8.11 Timing Requirements
    12. 8.12 Timing Diagrams
    13. 8.13 Typical Characteristics
  9. Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Feature Description
      1. 9.2.1 PA Block
      2. 9.2.2 Tx Block
      3. 9.2.3 Rx Block
      4. 9.2.4 DAC Block
      5. 9.2.5 REF1 and REF2 Blocks
      6. 9.2.6 Zero Crossing Detector Block
      7. 9.2.7 ETx and ERx Blocks
    3. 9.3 Power Supplies
    4. 9.4 Pin Descriptions
      1. 9.4.1 Current Overload
      2. 9.4.2 Thermal Overload
    5. 9.5 Calibration Modes
      1. 9.5.1 Tx Calibration Mode
      2. 9.5.2 Rx Calibration Mode
    6. 9.6 Serial Interface
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Detailed Design Procedure
        1. 10.2.1.1 Line-Coupling Circuit
        2. 10.2.1.2 Circuit Protection
        3. 10.2.1.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Powerline Communications Developer’s Kit
        2. 11.1.2.2 TINA-TI™ (Free Software Download)
        3. 11.1.2.3 TI Precision Designs
        4. 11.1.2.4 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Descriptions

DAC (Pin 7)

The DAC pin is used to configure the SPI to either read or write data to the Command and Data Registers, or to write data to the DAC register. Setting the DAC pin high allows access to the DAC register. Setting the DAC pin low allows access to the Command and Data Registers.

SD (Pin 8)

The Shutdown pin (SD) can be used to shut down the entire AFE031 for maximum power savings. When the SD pin is low, normal operation of the AFE031 occurs. When the SD pin is high, all circuit blocks within the AFE031, including the serial interface, are placed into the lowest-power operating modes. In this condition, the entire AFE031 draws only 95 μA of current. All register contents at the time the AFE031 is placed into shutdown mode are saved; upon re-enabling the AFE031, the register contents retain the respective saved values.

INT Pin (9)

The Interrupt pin (INT) can be used to signal the microprocessor of an unusual operating condition that results from an anomaly on the ac mains. The INTpin can be triggered by two external circuit conditions, depending upon the Enable Register settings. The AFE031 can be programmed to issue an interrupt on these conditions:

  • Current Overload
  • Thermal Overload