SLASF96 April   2024 AFE20408

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 6.3.1.1 DAC Resistor String
        2. 6.3.1.2 DAC Register Structure
          1. 6.3.1.2.1 DAC Synchronous Operation
        3. 6.3.1.3 DAC Buffer Amplifier
          1. 6.3.1.3.1 Autorange Detection
          2. 6.3.1.3.2 Power-Supply Monitoring
      2. 6.3.2 Analog-to-Digital Converter (ADC)
        1. 6.3.2.1 Versatile High-Voltage Measurement Capability
        2. 6.3.2.2 High-Precision Delta-Sigma ADC
          1. 6.3.2.2.1 ADC Custom Channel Sequencer
        3. 6.3.2.3 Low Latency Digital Filter
        4. 6.3.2.4 Flexible Conversion Times and Averaging
        5. 6.3.2.5 Integrated Precision Oscillator
      3. 6.3.3 Output Switch Overview
      4. 6.3.4 Drain Switch Control
      5. 6.3.5 FLEXIO Pin
      6. 6.3.6 Internal Temperature Sensor
      7. 6.3.7 Programmable Out-of-Range Alarms
        1. 6.3.7.1 Temperature Sensor Alarm Function
        2. 6.3.7.2 Supply Out-of-Range Alarm Function
        3. 6.3.7.3 ADC Alarm Function
    4. 6.4 Device Functional Modes
      1. 6.4.1 All-Positive DAC Range Mode
      2. 6.4.2 All-Negative DAC Range Mode
      3. 6.4.3 Mixed DAC Range Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 I2C Bus Overview
        2. 6.5.1.2 I2C Bus Definitions
        3. 6.5.1.3 I2C Target Address Selection
        4. 6.5.1.4 I2C Read and Write Operations
        5. 6.5.1.5 I2C Timeout Function
        6. 6.5.1.6 I2C General-Call Reset
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SPI Bus Overview
  8. 7 Register Maps
    1. 7.1 Global Register Map
      1. 7.1.1 Global Registers: Global Page
        1. 7.1.1.1  NOP_RESET Register (address = 00h) [reset = 0000h]
        2. 7.1.1.2  PAGE Register (address = 01h) [reset = 0000h]
        3. 7.1.1.3  GEN_STATUS Register (address = 03h) [reset = 4000h]
        4. 7.1.1.4  ALARM_STATUS_0 Register (address = 04h) [reset = 0000h]
        5. 7.1.1.5  ALARM_STATUS_1 Register (address = 05h) [reset = 0000h]
        6. 7.1.1.6  PWR_STATUS_0 Register (address = 06h) [reset = 0001h]
        7. 7.1.1.7  PWR_STATUS_1 Register (address = 07h) [reset = 0000h]
        8. 7.1.1.8  PWR_EN Register (address = 08h) [reset = 0200h]
        9. 7.1.1.9  TRIGGER Register (address = 10h) [reset = 0000h]
        10. 7.1.1.10 GPIO_DATA Register (address = 11h) [reset = 0001h]
        11. 7.1.1.11 DRVEN_SW_EN Register (address = 12h) [reset = 00FFh]
        12. 7.1.1.12 DRVEN Register (address = 13h) [reset = 0000h]
        13. 7.1.1.13 DAC_BCAST Register (address = 14h) [reset = 0000h]
        14. 7.1.1.14 GLOBAL_CFG Register (address = 17h) [reset = 0000h]
        15. 7.1.1.15 ADC_SENSE0 Register (address = 18h) [reset = 0000h]
        16. 7.1.1.16 ADC_SENSE1 Register (address = 19h) [reset = 0000h]
        17. 7.1.1.17 ADC_ADC0 Register (address = 1Ah) [reset = 0000h]
        18. 7.1.1.18 ADC_ADC1 Register (address = 1Bh) [reset = 0000h]
        19. 7.1.1.19 ADC_TMP Register (address = 1Ch) [reset = 0000h]
    2. 7.2 General Configuration Register Map
      1. 7.2.1 General Configuration Registers: Page 0
        1. 7.2.1.1  CHIP_ID Register (address = 40h) [reset = 2480h]
        2. 7.2.1.2  CHIP_VER Register (address = 41h) [reset = 0000h]
        3. 7.2.1.3  SDO_EN Register (address = 42h) [reset = 0000h]
        4. 7.2.1.4  GEN_CFG_0 Register (address = 44h) [reset = 0010h]
        5. 7.2.1.5  GEN_CFG_1 Register (address = 45h) [reset = 1101h]
        6. 7.2.1.6  ALARMOUT_SRC_0 Register (address = 48h) [reset = 0000h]
        7. 7.2.1.7  ALARMOUT_SRC_1 Register (address = 49h) [reset = 1833h]
        8. 7.2.1.8  ALARM_STATUS_0_BYP Register (address = 4Ch) [reset = 0000h]
        9. 7.2.1.9  ALARM_STATUS_1_BYP Register (address = 4Dh) [reset = 0000h]
        10. 7.2.1.10 PAON_SRC_0 Register (address = 50h) [reset = 0000h]
        11. 7.2.1.11 PAON_SRC_1 Register (address = 51h) [reset = 1833h]
        12. 7.2.1.12 RESET_FLAGS Register (Offset = 70h) [Reset = 000Fh]
    3. 7.3 ADC Configuration Register Map
      1. 7.3.1 ADC Configuration Registers: Page 1
        1. 7.3.1.1  ADC_GEN_CFG Register (address = 40h) [reset = 3334h]
        2. 7.3.1.2  ADC_CONV_CFG_0 Register (address = 41h) [reset = 0555h]
        3. 7.3.1.3  ADC_CONV_CFG_1 Register (address = 42h) [reset = 0000h]
        4. 7.3.1.4  ADC_BYP Register (address = 44h) [reset = 0000h]
        5. 7.3.1.5  ADC_HYST_0 Register (address = 46h) [reset = 0808h]
        6. 7.3.1.6  ADC_HYST_1 Register (address = 47h) [reset = 0008h]
        7. 7.3.1.7  SENSE0_UP_THRESH Register (address = 50h) [reset = 7FFFh]
        8. 7.3.1.8  SENSE0_LO_THRESH Register (address = 51h) [reset = 8000h]
        9. 7.3.1.9  SENSE1_UP_THRESH Register (address = 52h) [reset = 7FFFh]
        10. 7.3.1.10 SENSE1_LO_THRESH Register (address = 53h) [reset = 8000h]
        11. 7.3.1.11 ADC0_UP_THRESH Register (address = 54h) [reset = 7FFFh]
        12. 7.3.1.12 ADC0_LO_THRESH Register (address = 55h) [reset = 0000h]
        13. 7.3.1.13 ADC1_UP_THRESH Register (address = 56h) [reset = 7FFFh]
        14. 7.3.1.14 ADC1_LO_THRESH Register (address = 57h) [reset = 0000h]
        15. 7.3.1.15 TMP_UP_THRESH Register (address = 58h) [reset = 7FFFh]
    4. 7.4 ADC Custom Channel Sequencer Configuration Register Map
      1. 7.4.1 ADC CCS Registers: Page 3
        1. 7.4.1.1 ADC_CCS_IDS_n Registers (address = 40h to 7Eh) [reset = see ]
        2. 7.4.1.2 ADC_CCS_CFG_0 Register (address = 7Fh) [reset = 0004h]
    5. 7.5 DAC Configuration Register Map
      1. 7.5.1 DAC Configuration Registers: Page 3
        1. 7.5.1.1  DAC_CURRENT Register (address = 40h) [reset = 0000h]
        2. 7.5.1.2  DAC_SYNC_CFG Register (address = 41h) [reset = 0000h]
        3. 7.5.1.3  DAC_CFG Register (address = 42h) [reset = 0000h]
        4. 7.5.1.4  DAC_APD_EN Register (address = 43h) [reset = AAFFh]
        5. 7.5.1.5  DACA_APD_SRC_0 Register (address = 44h) [reset = 0000h]
        6. 7.5.1.6  DACA_APD_SRC_1 Register (address = 45h) [reset = 1833h]
        7. 7.5.1.7  OUTA_APD_SRC_0 Register (address = 46h) [reset = 0000h]
        8. 7.5.1.8  OUTA_APD_SRC_1 Register (address = 47h) [reset = 1833h]
        9. 7.5.1.9  DACB_APD_SRC_0 Register (address = 48h) [reset = 0000h]
        10. 7.5.1.10 DACB_APD_SRC_1 Register (address = 49h) [reset = 1833h]
        11. 7.5.1.11 OUTB_APD_SRC_0 Register (address = 4Ah) [reset = 0000h]
        12. 7.5.1.12 OUTB_APD_SRC_1 Register (address = 4Bh) [reset = 1833h]
        13. 7.5.1.13 DAC_CODE_LIMIT_0 Register (address = 4Ch) [reset = 3F3Fh]
        14. 7.5.1.14 DAC_CODE_LIMIT_1 Register (address = 4Dh) [reset = 3F3Fh]
        15. 7.5.1.15 DAC_CODE_LIMIT_2 Register (address = 4Eh) [reset = 3F3Fh]
        16. 7.5.1.16 DAC_CODE_LIMIT_3 Register (address = 4Fh) [reset = 3F3Fh]
        17. 7.5.1.17 DRVEN0_EN Register (address = 50h) [reset = 0000h]
        18. 7.5.1.18 DRVEN1_EN Register (address = 51h) [reset = 0000h]
        19. 7.5.1.19 FLEXIO_EN Register (address = 52h) [reset = 0000h]
    6. 7.6 DAC Buffer Register Map
      1. 7.6.1 DAC Buffer Data Registers: Page 4
        1. 7.6.1.1 DACA/Bn Buffer Registers (address = 40h to 47h) [reset = 0000h]
    7. 7.7 DAC Active Register Map
      1. 7.7.1 DAC Active Data Registers: Page 4
        1. 7.7.1.1 DACA/Bn Active Register (address = 40h to 47h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Switching Timing
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ADC Input Conditioning
        2. 8.2.2.2 Quiescent Current and Total Power Consumption
          1. 8.2.2.2.1 Maximum VCC/VSS Supply Current Transients
          2. 8.2.2.2.2 DAC Load Stability
        3. 8.2.2.3 Disabling PA Drain Voltage
        4. 8.2.2.4 PAON External Circuit
      3. 8.2.3 Application Curves
        1. 8.2.3.1 DAC Load Stability
        2. 8.2.3.2 Start-Up Behavior
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Diagram
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.1 Output Switching Timing

The externally applied output capacitors allow for noise filtering, and enable fast switching on the output channels of the device. Large capacitors can be connected to the output of the static channels: DACA0, DACA1, DACA2, DACA3 on group A, and DACB0, DACB1, DACB2, DACB3 on group B. Capacitors of lower values can be connected to the dynamic channels, OUTA0, OUTA2, OUTB0, and OUTB2. This capacitor arrangement means that the larger capacitors can quickly charge the smaller capacitors instead of relying on the DAC output buffers.

Figure 8-1 shows a simplified model of switch arrangement for the OUTA0 channel. The on-resistance of the switches are represented by RSW1 and RSW2. These resistors primarily serve to limit the settling time of VOUTA1 after a switching event, as the settling time is essentially an RC function.

GUID-20230320-SS0I-JPMQ-Q7TS-H19SNVZ917B6-low.svgFigure 8-1 Switching Transients

For example, consider the case where DRVEN0 changes from a low-state to a high-state. The steady-state of VDACA0 is equal to VDACA1 before the switch event. After the DRVEN pin goes high, SW2 closes, connecting COUTA1 and CDACA0 to each other. As these capacitors are now in parallel, the voltages across each equalize to a new voltage. This voltage, described as VCDAC||COUT in the following equation, can be calculated by finding the charge stored in each capacitor. The total charge on the two capacitors in parallel is equal to the sum of the charge of each capacitor.

Equation 2. QCDAC||COUT=QCDAC + QCOUT
Equation 3. VCDAC||COUTCDACA1+COUTA0=VDACA1×CDACA1+VOUTA0×COUTA0
Equation 4. VCDAC||COUT=VDACA1×CDACA1+VOUTA0×COUTA0CDACA1+COUTA0

The time required for the two output to equalize, described as the Capacitive Settling Period, is calculated using the equation below. As DACA0 is lower potential than DACA1, VOUTA0 can be expressed as a charging function.

Equation 5. VOUTA0t=VCDAC||COUT-VOUTA0t01-e-tRSW1×COUTA0+VOUTA0t0

During the capacitive settling period, VDACA1 is expressed as a discharging RC function.

Equation 6. VDACA1t=VDACA1t0 - VDACA1t0 - VCDAC||COUT1-e-tRSW1×COUTA0

Connecting the capacitors together allows the output to change to VCDAC||COUT quickly, but after that period, the DAC output buffer continues to charge COUTA1 to the VDACA0 value. The settling time for that final transition depends on the RC function formed by the series resistance on the DAC output, the switch resistance, and the capacitive load on the DAC. In addition, the output current of the DAC is limited.

Figure 8-2 shows the switch response for the OUTA0 pin when switching from a static DAC channel to VSS, while Figure 8-3 shows the switch response of the OUTA0 signal when switching between static DAC outputs.

GUID-20240122-SS0I-CLP4-C70N-P2QK8WKHX7WR-low.svgFigure 8-2 DAC-to-VSS Switch Response
GUID-20240122-SS0I-MVQ7-PR8F-CLK0DXCBXW8N-low.svgFigure 8-3 DAC-to-DAC Switch Response