SLASF96 April 2024 AFE20408
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NO. | NAME | ||
1 | VCCB | Power | Group B output buffers positive analog power supply. |
2 | DACB0 | Output | DACB0 buffer output. |
3 | OUTB0 | Output | DACB0 switch output. |
4 | DACB1 | Output | DACB1 buffer output. |
5 | DACB2 | Output | DACB2 buffer output. |
6 | OUTB2 | Output | DACB2 switch output. |
7 | DACB3 | Output | DACB3 buffer output. |
8 | VSSB | Power | Group B output buffers negative analog power supply. |
9 | DRVEN0 | Input | Asynchronous switch control signal. |
10 | SDA/SCLK | Input/Output | I2C: bidirectional data
line. SPI: Clock input. |
11 | SCL/ CS | Input | I2C: Clock input. SPI: Active-low serial data enable. This input is the frame synchronization signal for the serial data. When the signal goes low, this pin enables the serial interface input shift register. |
12 | A0/SDI | Input | I2C: Target address
selector. SPI: Data input. Data are clocked into the input shift register on each falling edge of the SCLK pin. |
13 | A1/SDO | Input/Output | I2C: Target address
selector. SPI: Data output. Data are clocked out of the input shift register on either rising or falling edges of the SCLK pin as specified by the FSDO bit. |
14 | VIO | Power | IO supply voltage. This pin sets the I/O operating voltage for the device. |
15 | RESET/FLEXIO | Input | Active low reset input. Logic low on this pin causes the device to initiate a reset event. Also referred to as FLEXIO, as this pin can be configured as RESET (default), GPIO, ALARMOUT output, ALARMIN input, DRVEN2, or LDAC. |
16 | DRVEN1 | Input | Asynchronous switch control signal. |
17 | VSSA | Power | Group A output buffers negative analog power supply. |
18 | DACA3 | Output | DACA3 buffer output. |
19 | OUTA2 | Output | DACA2 switch output. |
20 | DACA2 | Output | DACA2 buffer output. |
21 | DACA1 | Output | DACA1 buffer output. |
22 | OUTA0 | Output | DACA0 switch output. |
23 | DACA0 | Output | DACA0 buffer output. |
24 | VCCA | Power | Group A output buffers positive analog power supply. |
25 | GND | Ground | Ground reference point for all circuitry on the device. |
26 | VDD | Power | Analog supply voltage. |
27 | PAON | Output | Synchronization signal for PA biasing. |
28 | SENSE1– | Input | Current sensor 1 connection. |
29 | SENSE1+/ADCHV1 | Input | Current sensor 1 connection. Alternatively can be used as a high voltage ADC analog input. |
30 | SENSE0– | Input | Current sensor 0 connections. |
31 | SENSE0+ | Input | Current sensor 0 connections. |
32 | ADCHV0 | Input | High voltage ADC analog input 0. |
Thermal Pad | Thermal Pad | — | The thermal pad is located on the package underside. Connect the thermal pad to any internal PCB ground plane through multiple vias for good thermal performance. |