SBAS693C March   2015  – December 2023 AFE2256

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Documentation Support
      1. 4.1.1 Related Documentation
    2. 4.2 Trademarks
    3. 4.3 Electrostatic Discharge Caution
    4. 4.4 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • TDR|325
  • TDU|320
  • TBN|325
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.