SBFS042 June   2020 AFE3010

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      GFCI Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Powering The AFE3010
      2. 7.3.2 Sensing Amplifier
      3. 7.3.3 Noise Filter
      4. 7.3.4 ALARM (LED) Driver
      5. 7.3.5 Phase Detection
      6. 7.3.6 SCR Control
      7. 7.3.7 Self-Test Function
        1. 7.3.7.1 Periodic Self-Test
        2. 7.3.7.2 Continuous Self-Test
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Configuration
      2. 7.4.2 ALARM Modes to Drive LED
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Manual Self-Test Using PTT Pin
        1. 8.1.1.1 Successful Self-Test
        2. 8.1.1.2 Unsuccessful Self-Test
      2. 8.1.2 ALARM and RESET Function With SW_OPEN
        1. 8.1.2.1 No Self-Test Fail Event
        2. 8.1.2.2 Self-Test Fail Event
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) AFE3010 UNIT
RGT (QFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 49.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.5 °C/W
RθJB Junction-to-board thermal resistance 24 °C/W
ΨJT Junction-to-top characterization parameter 1.8 °C/W
ΨJB Junction-to-board characterization parameter 24 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.