SLASFB2 November   2023 AFE432A3W , AFE532A3W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Voltage Output
    6. 5.6  Electrical Characteristics: Current Output
    7. 5.7  Electrical Characteristics: Comparator Mode
    8. 5.8  Electrical Characteristics: ADC Input
    9. 5.9  Electrical Characteristics: General
    10. 5.10 Timing Requirements: I2C Standard Mode
    11. 5.11 Timing Requirements: I2C Fast Mode
    12. 5.12 Timing Requirements: I2C Fast-Mode Plus
    13. 5.13 Timing Requirements: SPI Write Operation
    14. 5.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    15. 5.15 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    16. 5.16 Timing Requirements: GPIO
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics: Voltage Output
    19. 5.19 Typical Characteristics: Current Output
    20. 5.20 Typical Characteristics: Comparator
    21. 5.21 Typical Characteristics: ADC
    22. 5.22 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Analog Front End (AFE) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 Power-Supply as Reference
      2. 6.4.2 Current-Output Mode
      3. 6.4.3 Comparator Mode
        1. 6.4.3.1 Programmable Hysteresis Comparator
        2. 6.4.3.2 Programmable Window Comparator
      4. 6.4.4 Analog-to-Digital Converter (ADC) Mode
      5. 6.4.5 Fault-Dump Mode
      6. 6.4.6 Application-Specific Modes
        1. 6.4.6.1 Voltage Margining and Scaling
          1. 6.4.6.1.1 High-Impedance Output and PROTECT Input
          2. 6.4.6.1.2 Programmable Slew-Rate Control
        2. 6.4.6.2 Function Generation
          1. 6.4.6.2.1 Triangular Waveform Generation
          2. 6.4.6.2.2 Sawtooth Waveform Generation
          3. 6.4.6.2.3 Sine Waveform Generation
      7. 6.4.7 Device Reset and Fault Management
        1. 6.4.7.1 Power-On Reset (POR)
        2. 6.4.7.2 External Reset
        3. 6.4.7.3 Register-Map Lock
        4. 6.4.7.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.7.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.7.4.2 NVM-CRC-FAIL-INT Bit
      8. 6.4.8 General-Purpose Input/Output (GPIO) Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-0-MARGIN-HIGH Register (address = 0Dh) [reset = 0000h]
    3. 7.3  DAC-1-MARGIN-HIGH Register (address = 13h) [reset = 0000h]
    4. 7.4  DAC-2-MARGIN-HIGH Register (address = 01h) [reset = 0000h]
    5. 7.5  DAC-0-MARGIN-LOW Register (address = 0Eh) [reset = 0000h]
    6. 7.6  DAC-1-MARGIN-LOW Register (address = 14h) [reset = 0000h]
    7. 7.7  DAC-2-MARGIN-LOW Register (address = 02h) [reset = 0000h]
    8. 7.8  DAC-0-GAIN-CONFIG Register (address = 0Fh) [reset = 0000h]
    9. 7.9  DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]
    10. 7.10 DAC-2-GAIN-CONFIG Register (address = 03h) [reset = 0000h]
    11. 7.11 DAC-1-CMP-MODE-CONFIG Register (address = 17h) [reset = 0000h]
    12. 7.12 DAC-0-FUNC-CONFIG Register (address = 12h) [reset = 0000h]
    13. 7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]
    14. 7.14 DAC-2-FUNC-CONFIG Register (address = 06h) [reset = 0000h]
    15. 7.15 DAC-0-DATA Register (address = 1Bh) [reset = 0000h]
    16. 7.16 DAC-1-DATA Register (address = 1Ch) [reset = 0000h]
    17. 7.17 DAC-2-DATA Register (address = 19h) [reset = 0000h]
    18. 7.18 ADC-CONFIG-TRIG Register (address = 1Dh) [reset = 0000h]
    19. 7.19 ADC-DATA Register (address = 1Eh) [reset = 0001h]
    20. 7.20 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    21. 7.21 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    22. 7.22 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    23. 7.23 GENERAL-STATUS Register (address = 22h) [reset = 20h, DEVICE-ID, VERSION-ID]
    24. 7.24 CMP-STATUS Register (address = 23h) [reset = 000Ch]
    25. 7.25 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    26. 7.26 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    27. 7.27 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    28. 7.28 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    29. 7.29 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    30. 7.30 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]

Figure 7-13 DAC-1-FUNC-CONFIG Register
1514131211109876543210
CLR-SEL-1SYNC-CONFIG-1BRD-CONFIG-1FUNC-GEN-CONFIG-BLOCK-1
R/W-0hR/W-0hR/W-0hR/W-000h
Table 7-19 DAC-1-FUNC-CONFIG Register Field Descriptions
BitFieldTypeResetDescription
15CLR-SEL-1R/W0h0: Clear DAC channel 1 to zero scale.
1: Clear DAC channel 1 to midscale.
14SYNC-CONFIG-1R/W0h0: DAC channel 1 output updates immediately after a write command.
1: DAC channel 1 output updates with LDAC pin falling-edge or when the LDAC bit in the COMMON-TRIGGER register is set to 1.
13BRD-CONFIG-1R/W0h0: Don't update DAC channel 1 with broadcast command.
1: Update DAC channel 1 with broadcast command.
Table 7-20 Linear-Slew Mode: FUNC-GEN-CONFIG-BLOCK-1 Field Descriptions
BitFieldTypeResetDescription
12-11PHASE-SEL-1R/W0h00: 0°
01: 120°
10: 240°
11: 90°
10-8FUNC-CONFIG-1R/W0h000: Triangular wave
001: Sawtooth wave
010: Inverse sawtooth wave
100: Sine wave
111: Disable function generation
Others: Invalid
7LOG-SLEW-EN-1R/W0h0: Enable linear slew
6-4CODE-STEP-1R/W0hCODE-STEP for linear slew mode:
000: 1-LSB
001: 2-LSB
010: 3-LSB
011: 4-LSB
100: 6-LSB
101: 8-LSB
110: 16-LSB
111: 32-LSB
3-0SLEW-RATE-1R/W0hSLEW-RATE for linear slew mode:
0000: No slew for margin-high and margin-low. Invalid for waveform generation.
0001: 4 µs/step
0010: 8 µs/step
0011: 12 µs/step
0100: 18 µs/step
0101: 27.04 µs/step
0110: 40.48 µs/step
0111: 60.72 µs/step
1000: 91.12 µs/step
1001: 136.72 µs/step
1010: 239.2 µs/step
1011: 418.64 µs/step
1100: 732.56 µs/step
1101: 1282 µs/step
1110: 2563.96 µs/step
1111: 5127.92 µs/step
Table 7-21 Logarithmic-Slew Mode: FUNC-GEN-CONFIG-BLOCK-1 Field Descriptions
BitFieldTypeResetDescription
12-11PHASE-SEL-1R/W0h00: 0°
01: 120°
10: 240°
11: 90°
10-8FUNC-CONFIG-1R/W0h000: Triangular wave
001: Sawtooth wave
010: Inverse sawtooth wave
100: Sine wave
111: Disable function generation
Others: Invalid
7LOG-SLEW-EN-1R/W0h1: Enable logarithmic slew.
In logarithmic slew mode, the DAC output moves from the DAC-1-MARGIN-LOW code to the DAC-1-MARGIN-HIGH code, or vice versa, in 3.125% steps.
When slewing in the positive direction, the next step is
(1 + 0.03125) times the current step.
When slewing in the negative direction, the next step is
(1 – 0.03125) times the current step.
When DAC-1-MARGIN-LOW is 0, the slew starts from code 1.
The time interval for each step is defined by RISE-SLEW-0 and FALL-SLEW-0.
6-4RISE-SLEW-1R/W0hSLEW-RATE for logarithmic slew mode (DAC-1-MARGIN-LOW to DAC-1-MARGIN-HIGH):
000: 4 µs/step
001: 12 µs/step
010: 27.04 µs/step
011: 60.72 µs/step
100: 136.72 µs/step
101: 418.64 µs/step
110: 1282 µs/step
111: 5127.92 µs/step
3-1FALL-SLEW-1R/W0hSLEW-RATE for logarithmic slew mode (DAC-1-MARGIN-HIGH to DAC-1-MARGIN-LOW):
000: 4 µs/step
001: 12 µs/step
010: 27.04 µs/step
011: 60.72 µs/step
100: 136.72 µs/step
101: 418.64 µs/step
110: 1282 µs/step
111: 5127.92 µs/step
0XX0hDon't care