SLASFB2 November   2023 AFE432A3W , AFE532A3W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Voltage Output
    6. 5.6  Electrical Characteristics: Current Output
    7. 5.7  Electrical Characteristics: Comparator Mode
    8. 5.8  Electrical Characteristics: ADC Input
    9. 5.9  Electrical Characteristics: General
    10. 5.10 Timing Requirements: I2C Standard Mode
    11. 5.11 Timing Requirements: I2C Fast Mode
    12. 5.12 Timing Requirements: I2C Fast-Mode Plus
    13. 5.13 Timing Requirements: SPI Write Operation
    14. 5.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    15. 5.15 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    16. 5.16 Timing Requirements: GPIO
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics: Voltage Output
    19. 5.19 Typical Characteristics: Current Output
    20. 5.20 Typical Characteristics: Comparator
    21. 5.21 Typical Characteristics: ADC
    22. 5.22 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Analog Front End (AFE) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 Power-Supply as Reference
      2. 6.4.2 Current-Output Mode
      3. 6.4.3 Comparator Mode
        1. 6.4.3.1 Programmable Hysteresis Comparator
        2. 6.4.3.2 Programmable Window Comparator
      4. 6.4.4 Analog-to-Digital Converter (ADC) Mode
      5. 6.4.5 Fault-Dump Mode
      6. 6.4.6 Application-Specific Modes
        1. 6.4.6.1 Voltage Margining and Scaling
          1. 6.4.6.1.1 High-Impedance Output and PROTECT Input
          2. 6.4.6.1.2 Programmable Slew-Rate Control
        2. 6.4.6.2 Function Generation
          1. 6.4.6.2.1 Triangular Waveform Generation
          2. 6.4.6.2.2 Sawtooth Waveform Generation
          3. 6.4.6.2.3 Sine Waveform Generation
      7. 6.4.7 Device Reset and Fault Management
        1. 6.4.7.1 Power-On Reset (POR)
        2. 6.4.7.2 External Reset
        3. 6.4.7.3 Register-Map Lock
        4. 6.4.7.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.7.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.7.4.2 NVM-CRC-FAIL-INT Bit
      8. 6.4.8 General-Purpose Input/Output (GPIO) Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-0-MARGIN-HIGH Register (address = 0Dh) [reset = 0000h]
    3. 7.3  DAC-1-MARGIN-HIGH Register (address = 13h) [reset = 0000h]
    4. 7.4  DAC-2-MARGIN-HIGH Register (address = 01h) [reset = 0000h]
    5. 7.5  DAC-0-MARGIN-LOW Register (address = 0Eh) [reset = 0000h]
    6. 7.6  DAC-1-MARGIN-LOW Register (address = 14h) [reset = 0000h]
    7. 7.7  DAC-2-MARGIN-LOW Register (address = 02h) [reset = 0000h]
    8. 7.8  DAC-0-GAIN-CONFIG Register (address = 0Fh) [reset = 0000h]
    9. 7.9  DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]
    10. 7.10 DAC-2-GAIN-CONFIG Register (address = 03h) [reset = 0000h]
    11. 7.11 DAC-1-CMP-MODE-CONFIG Register (address = 17h) [reset = 0000h]
    12. 7.12 DAC-0-FUNC-CONFIG Register (address = 12h) [reset = 0000h]
    13. 7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]
    14. 7.14 DAC-2-FUNC-CONFIG Register (address = 06h) [reset = 0000h]
    15. 7.15 DAC-0-DATA Register (address = 1Bh) [reset = 0000h]
    16. 7.16 DAC-1-DATA Register (address = 1Ch) [reset = 0000h]
    17. 7.17 DAC-2-DATA Register (address = 19h) [reset = 0000h]
    18. 7.18 ADC-CONFIG-TRIG Register (address = 1Dh) [reset = 0000h]
    19. 7.19 ADC-DATA Register (address = 1Eh) [reset = 0001h]
    20. 7.20 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    21. 7.21 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    22. 7.22 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    23. 7.23 GENERAL-STATUS Register (address = 22h) [reset = 20h, DEVICE-ID, VERSION-ID]
    24. 7.24 CMP-STATUS Register (address = 23h) [reset = 000Ch]
    25. 7.25 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    26. 7.26 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    27. 7.27 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    28. 7.28 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    29. 7.29 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    30. 7.30 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.4.6.2.1 Triangular Waveform Generation

Figure 6-11 shows that the triangular waveform uses the DAC-x-MARGIN-LOW (FUNCTION-MIN) and DAC-x-MARGIN-HIGH (FUNCTION-MAX) registers for minimum and maximum levels, respectively. The frequency of the waveform depends on the min and max levels, CODE-STEP and SLEW-RATE settings as shown in Equation 8. An external RC load with a time-constant larger than the slew-rate settings can be dominant over the internal frequency calculation. The CODE-STEP-x and SLEW-RATE-x settings are available in the DAC-x-FUNC-CONFIG register. Writing 0b000 to the FUNC-CONFIG-x bit field in the DAC-x-FUNC-CONFIG register selects triangular waveform.

Equation 6. fTRIANGLE=12×TIME_STEP×CEILINGFUNCTION_MAX-FUNCTION_MINCODE_STEP

where

  • TIME_STEP is the SLEW-RATE-x setting specified in Table 6-7.
  • CODE_STEP is the CODE-STEP-x setting specified in Table 6-6.
  • FUNCTION_MAX is the decimal value of DAC-x-MARGIN-HIGH bits in the DAC-x-MARGIN-HIGH register.
  • FUNCTION_MIN is the decimal value of the DAC-x-MARGIN-LOW bits in the DAC-x-MARGIN-LOW register.
GUID-20221017-SS0I-ZBDL-GFGG-QXPNRCJVXHP6-low.svgFigure 6-11 Triangle Waveform