SBASAL9 August   2022 AFE4432

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Device and Documentation Support
    1. 4.1 Receiving Notification of Documentation Updates
    2. 4.2 Support Resources
    3. 4.3 Trademarks
    4. 4.4 Electrostatic Discharge Caution
    5. 4.5 Glossary
  5. 5Mechanical, Packaging, and Orderable Information
    1. 5.1 Package Option Addendum
    2. 5.2 Tape and Reel Information
    3. 5.3 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YCH|25
Thermal pad, mechanical data (Package|Pins)

5.1 Package Option Addendum

Packaging Information

Orderable DeviceStatus(1)Package Type Package DrawingPins Package QtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp (°C)Device Marking(4)(5)
AFE4432YCHRACTIVEDSBGAYCH253000Green (RoHS & no Sn/Br)SNAGCULevel-1-260C-UNLIM-20 to 85AFE4432
AFE4432YCHT ACTIVE DSBGA YCH 25 250 Green (RoHS & no Sn/Br) SNAGCU Level-1-260C-UNLIM -20 to 85 AFE4432
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.