SLASFB2 November   2023 AFE432A3W , AFE532A3W

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Voltage Output
    6. 5.6  Electrical Characteristics: Current Output
    7. 5.7  Electrical Characteristics: Comparator Mode
    8. 5.8  Electrical Characteristics: ADC Input
    9. 5.9  Electrical Characteristics: General
    10. 5.10 Timing Requirements: I2C Standard Mode
    11. 5.11 Timing Requirements: I2C Fast Mode
    12. 5.12 Timing Requirements: I2C Fast-Mode Plus
    13. 5.13 Timing Requirements: SPI Write Operation
    14. 5.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    15. 5.15 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    16. 5.16 Timing Requirements: GPIO
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics: Voltage Output
    19. 5.19 Typical Characteristics: Current Output
    20. 5.20 Typical Characteristics: Comparator
    21. 5.21 Typical Characteristics: ADC
    22. 5.22 Typical Characteristics: General
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Smart Analog Front End (AFE) Architecture
      2. 6.3.2 Digital Input/Output
      3. 6.3.3 Nonvolatile Memory (NVM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage-Output Mode
        1. 6.4.1.1 Voltage Reference and DAC Transfer Function
          1. 6.4.1.1.1 Internal Reference
          2. 6.4.1.1.2 Power-Supply as Reference
      2. 6.4.2 Current-Output Mode
      3. 6.4.3 Comparator Mode
        1. 6.4.3.1 Programmable Hysteresis Comparator
        2. 6.4.3.2 Programmable Window Comparator
      4. 6.4.4 Analog-to-Digital Converter (ADC) Mode
      5. 6.4.5 Fault-Dump Mode
      6. 6.4.6 Application-Specific Modes
        1. 6.4.6.1 Voltage Margining and Scaling
          1. 6.4.6.1.1 High-Impedance Output and PROTECT Input
          2. 6.4.6.1.2 Programmable Slew-Rate Control
        2. 6.4.6.2 Function Generation
          1. 6.4.6.2.1 Triangular Waveform Generation
          2. 6.4.6.2.2 Sawtooth Waveform Generation
          3. 6.4.6.2.3 Sine Waveform Generation
      7. 6.4.7 Device Reset and Fault Management
        1. 6.4.7.1 Power-On Reset (POR)
        2. 6.4.7.2 External Reset
        3. 6.4.7.3 Register-Map Lock
        4. 6.4.7.4 NVM Cyclic Redundancy Check (CRC)
          1. 6.4.7.4.1 NVM-CRC-FAIL-USER Bit
          2. 6.4.7.4.2 NVM-CRC-FAIL-INT Bit
      8. 6.4.8 General-Purpose Input/Output (GPIO) Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Programming Mode
      2. 6.5.2 I2C Programming Mode
        1. 6.5.2.1 F/S Mode Protocol
        2. 6.5.2.2 I2C Update Sequence
          1. 6.5.2.2.1 Address Byte
          2. 6.5.2.2.2 Command Byte
        3. 6.5.2.3 I2C Read Sequence
  8. 7 Register Map
    1. 7.1  NOP Register (address = 00h) [reset = 0000h]
    2. 7.2  DAC-0-MARGIN-HIGH Register (address = 0Dh) [reset = 0000h]
    3. 7.3  DAC-1-MARGIN-HIGH Register (address = 13h) [reset = 0000h]
    4. 7.4  DAC-2-MARGIN-HIGH Register (address = 01h) [reset = 0000h]
    5. 7.5  DAC-0-MARGIN-LOW Register (address = 0Eh) [reset = 0000h]
    6. 7.6  DAC-1-MARGIN-LOW Register (address = 14h) [reset = 0000h]
    7. 7.7  DAC-2-MARGIN-LOW Register (address = 02h) [reset = 0000h]
    8. 7.8  DAC-0-GAIN-CONFIG Register (address = 0Fh) [reset = 0000h]
    9. 7.9  DAC-1-GAIN-CMP-CONFIG Register (address = 15h) [reset = 0000h]
    10. 7.10 DAC-2-GAIN-CONFIG Register (address = 03h) [reset = 0000h]
    11. 7.11 DAC-1-CMP-MODE-CONFIG Register (address = 17h) [reset = 0000h]
    12. 7.12 DAC-0-FUNC-CONFIG Register (address = 12h) [reset = 0000h]
    13. 7.13 DAC-1-FUNC-CONFIG Register (address = 18h) [reset = 0000h]
    14. 7.14 DAC-2-FUNC-CONFIG Register (address = 06h) [reset = 0000h]
    15. 7.15 DAC-0-DATA Register (address = 1Bh) [reset = 0000h]
    16. 7.16 DAC-1-DATA Register (address = 1Ch) [reset = 0000h]
    17. 7.17 DAC-2-DATA Register (address = 19h) [reset = 0000h]
    18. 7.18 ADC-CONFIG-TRIG Register (address = 1Dh) [reset = 0000h]
    19. 7.19 ADC-DATA Register (address = 1Eh) [reset = 0001h]
    20. 7.20 COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
    21. 7.21 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
    22. 7.22 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
    23. 7.23 GENERAL-STATUS Register (address = 22h) [reset = 20h, DEVICE-ID, VERSION-ID]
    24. 7.24 CMP-STATUS Register (address = 23h) [reset = 000Ch]
    25. 7.25 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
    26. 7.26 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
    27. 7.27 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
    28. 7.28 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
    29. 7.29 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
    30. 7.30 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.5.2.2.1 Address Byte

Table 6-14 depicts the address byte, the first byte received from the controller device following the start condition. The first four bits (MSBs) of the address are factory preset to 1001b. The next three bits of the address are controlled by the A0 pin. The A0 pin input can be connected to VDD, AGND, SCL, or SDA. The A0 pin is sampled during the first byte of each data frame to determine the address. The device latches the value of the address pin, and consequently responds to that particular address according to Table 6-15.

Table 6-14 Address Byte
COMMENTMSBLSB
—AD6AD5AD4AD3AD2AD1AD0R/W
General address1001See Table 6-15
(target address column)		0 or 1
Broadcast address10001110
Table 6-15 Address Format
TARGET ADDRESSA0 PIN
000AGND
001VDD
010SDA
011SCL

The AFEx32A3W supports broadcast addressing, which is used for synchronously updating or powering down multiple AFEx32A3W devices. When the broadcast address is used, the AFEx32A3W responds regardless of the address pin state. Broadcast is supported only in write mode.