SBASB81 December   2024 AFE5401-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Digital Characteristics
    7. 5.7  Timing Requirements: Output Interface
    8. 5.8  Timing Requirements: RESET
    9. 5.9  Timing Requirements: Serial Interface Operation
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Timing Requirements: Across Output Serialization Modes
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Noise Amplifier (LNA)
      2. 7.3.2 Programmable Gain Amplifier (PGA)
      3. 7.3.3 Antialiasing Filter
      4. 7.3.4 Analog-to-Digital Converter (ADC)
      5. 7.3.5 Digital Gain
      6. 7.3.6 Input Clock Divider
      7. 7.3.7 Data Output Serialization
      8. 7.3.8 Setting the Input Common-Mode Voltage for the Analog Inputs
        1. 7.3.8.1 Main Channels
        2. 7.3.8.2 Auxiliary Channel
    4. 7.4 Device Functional Modes
      1. 7.4.1 Equalizer Mode
      2. 7.4.2 Data Output Mode
        1. 7.4.2.1 Header
        2. 7.4.2.2 Test Pattern Mode
      3. 7.4.3 Parity
      4. 7.4.4 Standby, Power-Down Mode
      5. 7.4.5 Digital Filtering to Improve Stop-Band Attenuation
        1. 7.4.5.1 Decimate-by-2 Mode
        2. 7.4.5.2 Decimate-by-4 Mode
      6. 7.4.6 Diagnostic Mode
      7. 7.4.7 Signal Chain Probe
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Register Initialization
        1. 7.5.2.1 Register Write Mode
        2. 7.5.2.2 Register Read Mode
      3. 7.5.3 CMOS Output Interface
        1. 7.5.3.1 Synchronization and Triggering
    6. 7.6 Register Maps
      1. 7.6.1 Functional Register Map
      2. 7.6.2 Register Descriptions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Sequencing
      2. 8.3.2 Power Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Revision History
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.2.1 Header

Each channel has an associated 12-bit header register. These registers can be written by an SPI write. The content of this register can be read out on the CMOS data output (D[11:0]) by configuring the HEADER_MODE register, as shown in Table 7-18.

Table 7-18 HEADER_MODE Register
HEADER_MODEDESCRIPTION
0ADC data at output
1Header data at output
2[Temperature data, diagnostic data, mean, noise, (-1), (-1), (-1), (-1)]. This data sequence is repeated.
3Header data, temperature data, diagnostic data, mean, noise, ADC data

In HEADER_MODE = 3, the header mode data output is shown in Figure 7-14.

In this mode, header data is transmitted with a latency with respect to the TRIG input. This latency is given by Equation 2:

Equation 2. TRIG to Header Latency (TTRIG_HEADER_LAT) = tAFE_CLK + TTRIG_DSYNC2_LAT
AFE5401-EP Header Mode Data Output (HEADER_MODE = 3)Figure 7-14 Header Mode Data Output (HEADER_MODE = 3)