SBASB81 December   2024 AFE5401-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Digital Characteristics
    7. 5.7  Timing Requirements: Output Interface
    8. 5.8  Timing Requirements: RESET
    9. 5.9  Timing Requirements: Serial Interface Operation
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Timing Requirements: Across Output Serialization Modes
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Noise Amplifier (LNA)
      2. 7.3.2 Programmable Gain Amplifier (PGA)
      3. 7.3.3 Antialiasing Filter
      4. 7.3.4 Analog-to-Digital Converter (ADC)
      5. 7.3.5 Digital Gain
      6. 7.3.6 Input Clock Divider
      7. 7.3.7 Data Output Serialization
      8. 7.3.8 Setting the Input Common-Mode Voltage for the Analog Inputs
        1. 7.3.8.1 Main Channels
        2. 7.3.8.2 Auxiliary Channel
    4. 7.4 Device Functional Modes
      1. 7.4.1 Equalizer Mode
      2. 7.4.2 Data Output Mode
        1. 7.4.2.1 Header
        2. 7.4.2.2 Test Pattern Mode
      3. 7.4.3 Parity
      4. 7.4.4 Standby, Power-Down Mode
      5. 7.4.5 Digital Filtering to Improve Stop-Band Attenuation
        1. 7.4.5.1 Decimate-by-2 Mode
        2. 7.4.5.2 Decimate-by-4 Mode
      6. 7.4.6 Diagnostic Mode
      7. 7.4.7 Signal Chain Probe
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Register Initialization
        1. 7.5.2.1 Register Write Mode
        2. 7.5.2.2 Register Read Mode
      3. 7.5.3 CMOS Output Interface
        1. 7.5.3.1 Synchronization and Triggering
    6. 7.6 Register Maps
      1. 7.6.1 Functional Register Map
      2. 7.6.2 Register Descriptions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Sequencing
      2. 8.3.2 Power Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Revision History
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.2.2 Test Pattern Mode

In order to check the interface between the AFE and the receiver system, a test pattern can be directly programmed on the CMOS output. As shown in Table 7-19, different test patterns can be selected by setting the TST_PAT_MODE register.

Table 7-19 TST_PAT_MODE Register(1)
TST_PAT_MODEDESCRIPTION
0Normal ADC output data
1SYNC pattern (D[11:0] = 111111000000)
2Deskew pattern (D[11:0] = 010101010101)
3Custom pattern as per CUSTOM_PATTERN[11:0] register bits
4All 1s
5Toggle data (output toggles between all 0s and all 1s)
6All 0s
7Full-scale ramp data
(1) In decimate-by-2 mode, alternate samples are dropped and thus output data D0 does not toggle for full-scale ramp data and output data D[11:0] does not toggle for toggle data.
Similarly, in decimate-by-4 mode, three samples are dropped and thus output data D0 and D1 do not toggle for full-scale ramp data and output data D[11:0] does not toggle for toggle data.