SBAS619A March   2014  – June 2017 AFE5401-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Digital Characteristics
    7. 6.7  Timing Requirements: Output Interface
    8. 6.8  Timing Requirements: RESET
    9. 6.9  Timing Requirements: Serial Interface Operation
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Timing Requirements: Across Output Serialization Modes
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Low-Noise Amplifier (LNA)
      2. 9.3.2 Programmable Gain Amplifier (PGA)
      3. 9.3.3 Antialiasing Filter
      4. 9.3.4 Analog-to-Digital Converter (ADC)
      5. 9.3.5 Digital Gain
      6. 9.3.6 Input Clock Divider
      7. 9.3.7 Data Output Serialization
      8. 9.3.8 Setting the Input Common-Mode Voltage for the Analog Inputs
        1. 9.3.8.1 Main Channels
        2. 9.3.8.2 Auxiliary Channel
    4. 9.4 Device Functional Modes
      1. 9.4.1 Equalizer Mode
      2. 9.4.2 Data Output Mode
        1. 9.4.2.1 Header
        2. 9.4.2.2 Test Pattern Mode
      3. 9.4.3 Parity
      4. 9.4.4 Standby, Power-Down Mode
      5. 9.4.5 Digital Filtering to Improve Stop-Band Attenuation
        1. 9.4.5.1 Decimate-by-2 Mode
        2. 9.4.5.2 Decimate-by-4 Mode
      6. 9.4.6 Diagnostic Mode
      7. 9.4.7 Signal Chain Probe
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
      2. 9.5.2 Register Initialization
        1. 9.5.2.1 Register Write Mode
        2. 9.5.2.2 Register Read Mode
      3. 9.5.3 CMOS Output Interface
        1. 9.5.3.1 Synchronization and Triggering
    6. 9.6 Register Maps
      1. 9.6.1 Functional Register Map
      2. 9.6.2 Register Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Sequencing
    2. 11.2 Power Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

13.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E is a trademark of Texas Instruments.

SONAR is a trademark of Cakewalk, Inc.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.