SBASAC1A august   2021  – july 2023 AFE439A2 , AFE539A4 , AFE639D2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Comparator Mode
    7. 6.7  Electrical Characteristics: ADC Input
    8. 6.8  Electrical Characteristics: General
    9. 6.9  Timing Requirements: I2C Standard Mode
    10. 6.10 Timing Requirements: I2C Fast Mode
    11. 6.11 Timing Requirements: I2C Fast Mode Plus
    12. 6.12 Timing Requirements: SPI Write Operation
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 6.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 6.15 Timing Requirements: PWM Output
    16. 6.16 Timing Requirements: I2C Controller
    17. 6.17 Timing Diagrams
    18. 6.18 Typical Characteristics: Voltage Output
    19. 6.19 Typical Characteristics: ADC
    20. 6.20 Typical Characteristics: Comparator
    21. 6.21 Typical Characteristics: General
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Smart Analog Front End (AFE) Architecture
      2. 7.3.2 Programming Interface
      3. 7.3.3 Nonvolatile Memory (NVM)
        1. 7.3.3.1 NVM Cyclic Redundancy Check (CRC)
          1. 7.3.3.1.1 NVM-CRC-FAIL-USER Bit
          2. 7.3.3.1.2 NVM-CRC-FAIL-INT Bit
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 External Reset
      6. 7.3.6 Register-Map Lock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage-Output Mode
      2. 7.4.2 Voltage Reference and DAC Transfer Function
        1. 7.4.2.1 Power-Supply as Reference
        2. 7.4.2.2 Internal Reference
        3. 7.4.2.3 External Reference
      3. 7.4.3 Comparator Mode
      4. 7.4.4 Analog-to-Digital Converter (ADC) Mode
      5. 7.4.5 Pulse-Width Modulation (PWM)
      6. 7.4.6 Proportional-Integral (PI) Control
        1. 7.4.6.1 AFE439A2 PI Control
        2. 7.4.6.2 AFE539A4 PI Control
        3. 7.4.6.3 AFE639D2 PI Control
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
    6. 7.6 Register Maps
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-x-VOUT-CMP-CONFIG Register (address = 03h, 09h, 0Fh, 15h)
      3. 7.6.3  COMMON-CONFIG Register (address = 1Fh)
      4. 7.6.4  COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      5. 7.6.5  COMMON-PWM-TRIG Register (address = 21h) [reset = 0000h]
      6. 7.6.6  GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
      7. 7.6.7  INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      8. 7.6.8  STATE-MACHINE-CONFIG0 Register (address = 27h) [reset = 0003h]
      9. 7.6.9  STATE-MACHINE-CONFIG1 Register (address = 29h) [reset = C800h]
      10. 7.6.10 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      11. 7.6.11 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics: Comparator Mode

all minimum/maximum specifications at –40°C ≤ TA ≤ +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, reference tied to VDD, gain = 1 ×, and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC PERFORMANCE
Offset error(1) (2) 1.7 V ≤ VDD ≤ 5.5 V; DAC at midscale, comparator input at Hi-Z, and DAC operating with external reference. –5 0 5 mV
Offset error time drift(1) VDD = 5.5 V, external reference, TA = 125°C, AIN in Hi-Z mode, DAC at full scale and VAIN at 0 V or DAC at zero scale and VAIN at 1.84 V, drift specified for 10 years of continuous operation 4 mV
OUTPUT
Input voltage VREF connected to VDD, AIN resistor network connected to ground 0 VDD V
VREF connected to VDD, AIN resistor network disconnected from ground 0 VDD (1/3 – 1/100)
VOL Logic low output voltage ILOAD = 100 μA, output in open-drain mode 0.1 V
DYNAMIC PERFORMANCE
tresp Output response time DAC at midscale with 10-bit resolution, AIN input at Hi-Z, and transition step at AIN node is (VDAC – 2 LSB) to (VDAC + 2 LSB), transition time measured between 10% and 90% of output, output current of 100 µA, comparator output configured in push-pull mode, load capacitor at DAC output is 25 pF 10 µs
(1) Specified by design and characterization, not production tested.
(2) This specification does not include the total unadjusted error (TUE) of the DAC.