SBASA44B august   2021  – june 2023 AFE7900

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Transmitter Electrical Characteristics
    6. 5.6  RF ADC Electrical Characteristics
    7. 5.7  PLL/VCO/Clock Electrical Characteristics
    8. 5.8  Digital Electrical Characteristics
    9. 5.9  Power Supply Electrical Characteristics
    10. 5.10 Timing Requirements
    11. 5.11 Switching Characteristics
    12. 5.12 Typical Characteristics
      1. 5.12.1  RX Typical Characteristics 30 MHz and 400 MHz
      2. 5.12.2  RX Typical Characteristics at 800MHz
      3. 5.12.3  RX Typical Characteristics 1.75GHz to 1.9GHz
      4. 5.12.4  RX Typical Characteristics 2.6GHz
      5. 5.12.5  RX Typical Characteristics 3.5GHz
      6. 5.12.6  RX Typical Characteristics 4.9GHz
      7. 5.12.7  TX Typical Characteristics at 30MHz and 400MHz
      8. 5.12.8  TX Typical Characteristics at 800MHz
      9. 5.12.9  TX Typical Characteristics at 1.8GHz
      10. 5.12.10 TX Typical Characteristics at 2.6GHz
      11. 5.12.11 TX Typical Characteristics at 3.5GHz
      12. 5.12.12 TX Typical Characteristics at 4.9GHz
      13. 5.12.13 TX Typical Characteristics at 7.1GHz
      14. 5.12.14 PLL and Clock Typical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) AFE7900 UNIT
FC-BGA
400 PINS
RθJA Junction-to-ambient thermal resistance 16.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.42 °C/W
RθJB Junction-to-board thermal resistance 4.85 °C/W
ΨJT Junction-to-top characterization parameter 0.12 °C/W
ΨJB Junction-to-board characterization parameter 4.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.