SBASAO5A april   2023  – june 2023 AFE7901

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Description (continued)
  6. 5Revision History
  7. 6Pin Configuration and Functions
  8. 7Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information AFE79xx
    5. 7.5  Transmitter Electrical Characteristics
    6. 7.6  RF ADC Electrical Characteristics
    7. 7.7  PLL/VCO/Clock Electrical Characteristics
    8. 7.8  Digital Electrical Characteristics
    9. 7.9  Power Supply Electrical Characteristics
    10. 7.10 Timing Requirements
    11. 7.11 Switching Characteristics
    12. 7.12 Typical Characteristics
      1. 7.12.1  RX Typical Characteristics 30 MHz and 400 MHz
      2. 7.12.2  RX Typical Characteristics at 800 MHz
      3. 7.12.3  RX Typical Characteristics 1.75 GHz to 1.9 GHz
      4. 7.12.4  RX Typical Characteristics 2.6 GHz
      5. 7.12.5  RX Typical Characteristics 3.5 GHz
      6. 7.12.6  RX Typical Characteristics 4.9 GHz
      7. 7.12.7  RX Typical Characteristics 6.8 GHz
      8. 7.12.8  TX Typical Characteristics at 30 MHz and 400 MHz
      9. 7.12.9  TX Typical Characteristics at 800 MHz
      10. 7.12.10 TX Typical Characteristics at 1.8 GHz
      11. 7.12.11 TX Typical Characteristics at 2.6 GHz
      12. 7.12.12 TX Typical Characteristics at 3.5 GHz
      13. 7.12.13 TX Typical Characteristics at 4.9 GHz
      14. 7.12.14 TX Typical Characteristics at 7.1 GHz
      15. 7.12.15 PLL and Clock Typical Characteristics
  9. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.