SBASAG7A March   2024  – August 2024 AFE7950-SP

PRODMIX  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Transmitter Electrical Characteristics
    6. 4.6  RF ADC Electrical Characteristics
    7. 4.7  PLL/VCO/Clock Electrical Characteristics
    8. 4.8  Digital Electrical Characteristics
    9. 4.9  Power Supply Electrical Characteristics
    10. 4.10 Timing Requirements
    11. 4.11 Switching Characteristics
    12. 4.12 Typical Characteristics
      1. 4.12.1  TX Typical Characteristics 800MHz
      2. 4.12.2  TX Typical Characteristics at 1.8GHz
      3. 4.12.3  TX Typical Characteristics at 2.6GHz
      4. 4.12.4  TX Typical Characteristics at 3.5GHz
      5. 4.12.5  TX Typical Characteristics at 4.9GHz
      6. 4.12.6  TX Typical Characteristics at 8.1GHz
      7. 4.12.7  TX Typical Characteristics at 9.6GHz
      8. 4.12.8  RX Typical Characteristics at 800MHz
      9. 4.12.9  RX Typical Characteristics at 1.75-1.9GHz
      10. 4.12.10 RX Typical Characteristics at 2.6GHz
      11. 4.12.11 RX Typical Characteristics at 3.5GHz
      12. 4.12.12 RX Typical Characteristics at 4.9GHz
      13. 4.12.13 RX Typical Characteristics at 8.1GHz
      14. 4.12.14 RX Typical Characteristics at 9.6GHz
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage Range DVDD0P9, VDDT0P9 –0.3 1.2 V
VDD1P2RX, VDD1P2TXCLK, VDD1P2TXENC, VDD1P2PLL, VDD1P2PLLCLKREF, VDD1P2FB, VDD1P2FBCML, VDD1P2RXCML –0.3 1.4 V
VDD1P8RX, VDD1P8RXCLK, VDD1P8TX, VDD1P8TXDAC, VDD1P8TXENC, VDD1P8PLL, VDD1P8PLLVCO, VDD1P8FB, VDD1P8FBCLK, VDD1P8GPIO, VDDA1P8 –0.5 2.1 V
Pin Volatge Range {1/2/3/4}RXIN+/- –0.5 VDDRX1P8+0.3 V
1FBIN+/-, 2FB+/- –0.5 VDDFB1P8+0.3 V
{1/2/3/4}TXOUT+/- –0.5 VDDTX1P8+0.3 V
REFCLK+/-, SYSREF+/- –0.3 1.4 V
{1:8}SRX+/- –0.3 1.4 V
{1:8}STX+/- –0.3 1.4 V
GPIO{B/C/D/E}x, SPICLK, SPISDIO, SPISDO, SPISEN, RESETZ, BISTB0, BISTB1 –0.5 VDD1P8GPIO + 0.3 V
IFORCE, VSENSE –0.3 VDDCLK1P8 + 0.3 V
SRDAMUX1, SRDAMUX2 –0.3 VDDA1P8+0.3 V
Peak Input Current any input 20 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.