SLASF21 December   2022 AFE78101 , AFE88101

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: VOUT DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Reference
    11. 6.11 Typical Characteristics: Power Supply
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 7.3.1.1 DAC Resistor String
        2. 7.3.1.2 DAC Buffer Amplifier
        3. 7.3.1.3 DAC Transfer Function
        4. 7.3.1.4 DAC Gain and Offset Calibration
        5. 7.3.1.5 Programmable Slew Rate
        6. 7.3.1.6 DAC Register Structure and CLEAR State
      2. 7.3.2 Analog-to-Digital Converter (ADC) Overview
        1. 7.3.2.1 ADC Operation
        2. 7.3.2.2 ADC Custom Channel Sequencer
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 ADC Offset Calibration
        5. 7.3.2.5 External Monitoring Inputs
        6. 7.3.2.6 Temperature Sensor
        7. 7.3.2.7 Self-Diagnostic Multiplexer
        8. 7.3.2.8 ADC Bypass
      3. 7.3.3 Programmable Out-of-Range Alarms
        1. 7.3.3.1 Alarm Action Configuration Register
        2. 7.3.3.2 Alarm Voltage Generator
        3. 7.3.3.3 Temperature Sensor Alarm Function
        4. 7.3.3.4 Internal Reference Alarm Function
        5. 7.3.3.5 ADC Alarm Function
        6. 7.3.3.6 Fault Detection
      4. 7.3.4 IRQ
      5. 7.3.5 Internal Reference
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 One-Time Programmable (OTP) Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Power-Down Mode
      2. 7.4.2 Reset
    5. 7.5 Programming
      1. 7.5.1 Communication Setup
        1. 7.5.1.1 SPI Mode
        2. 7.5.1.2 UART Mode
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 SPI Frame Definition
        2. 7.5.2.2 SPI Read and Write
        3. 7.5.2.3 Frame Error Checking
        4. 7.5.2.4 Synchronization
      3. 7.5.3 UART
        1. 7.5.3.1 UART Break Mode (UBM)
      4. 7.5.4 Status Bits
      5. 7.5.5 Watchdog Timer
    6. 7.6 Register Maps
      1. 7.6.1 AFEx8101 Registers
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 4-mA to 20-mA Current Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Start-Up Circuit
          2. 8.2.1.2.2 Current Loop Control
          3. 8.2.1.2.3 Input Protection and Rectification
          4. 8.2.1.2.4 System Current Budget
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

SPI Read and Write

The SDI input bit is latched on the SCLK falling edge. The SDI pin receives right-justified data. At the rising edge of CS, the right-most (last) bits are evaluated as a frame. Extra clock cycles (exceeding frame length) during the frame begin to output on SDO the SDI data delayed by one frame length.

A read operation is started when R/W bit is 1. The data word input for SDI is ignored in the read command frame. Send the subsequent read or write command frame into SDI to clock out the data of the addressed register on SDO. If no other read or write commands are needed, then issue a NOP command to retrieve the requested data. The read register value is output most significant bit first on SDO on successive edges (rising or falling based on CONFIG.FSDO setting) of SCLK.

A write operation starts when R/W bit is 0. The SDO output to a write command, delivered in the next frame, contains status bits, data described in Table 7-8, and if the CRC is enabled, an 8-bit CRC for the output frame.

Table 7-8 Command Functions
COMMAND BIT SDI INPUT DATA WORD SDO RESPONSE DATA WORD(1)
Write (R/W = 0) Data to be written (16b) 0x0000
Read (R/W = 1) Ignored(2) Register output data (16b)
Response data portion in next frame output.
The input bits are included in the calculation for CRC, if enabled (see Section 7.5.2.3).

Valid SDO output is driven only when CS = 0 and CONFIG.DSDO = 0; otherwise, the SDO pin remains Hi-Z to save power. The SDO data bits are left-justified within the frame, meaning the most significant bit is produced on the line (subject to timing details) when CS is asserted low (bit is driven by falling edge of CS). The subsequent bits in the frame are driven by the rising SCLK edge when CONFIG.FSDO = 0 (default). To drive the SDO data on the falling edge of SCLK, set CONFIG.FSDO = 1. This setting effectively gives the SDO data an additional ½ clock period for setup time, but at the expense of hold time.

The frame output on SDO contains the command bit of the input that generated the frame (previous input frame), followed by seven status bits (see Figure 7-19). When an input frame CRC error is detected, the status bit CRC_ERR = 1. If there is no input frame CRC error, then CRC_ERR = 0. See Table 7-9 for details.