SLASF43 December   2023 AFE782H1 , AFE882H1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements
    7. 5.7  Timing Diagrams
    8. 5.8  Typical Characteristics: VOUT DAC
    9. 5.9  Typical Characteristics: ADC
    10. 5.10 Typical Characteristics: Reference
    11. 5.11 Typical Characteristics: HART Modem
    12. 5.12 Typical Characteristics: Power Supply
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Digital-to-Analog Converter (DAC) Overview
        1. 6.3.1.1 DAC Resistor String
        2. 6.3.1.2 DAC Buffer Amplifier
        3. 6.3.1.3 DAC Transfer Function
        4. 6.3.1.4 DAC Gain and Offset Calibration
        5. 6.3.1.5 Programmable Slew Rate
        6. 6.3.1.6 DAC Register Structure and CLEAR State
      2. 6.3.2  Analog-to-Digital Converter (ADC) Overview
        1. 6.3.2.1 ADC Operation
        2. 6.3.2.2 ADC Custom Channel Sequencer
        3. 6.3.2.3 ADC Synchronization
        4. 6.3.2.4 ADC Offset Calibration
        5. 6.3.2.5 External Monitoring Inputs
        6. 6.3.2.6 Temperature Sensor
        7. 6.3.2.7 Self-Diagnostic Multiplexer
        8. 6.3.2.8 ADC Bypass
      3. 6.3.3  Programmable Out-of-Range Alarms
        1. 6.3.3.1 Alarm-Based Interrupts
        2. 6.3.3.2 Alarm Action Configuration Register
        3. 6.3.3.3 Alarm Voltage Generator
        4. 6.3.3.4 Temperature Sensor Alarm Function
        5. 6.3.3.5 Internal Reference Alarm Function
        6. 6.3.3.6 ADC Alarm Function
        7. 6.3.3.7 Fault Detection
      4. 6.3.4  IRQ
      5. 6.3.5  HART Interface
        1. 6.3.5.1  FIFO Buffers
          1. 6.3.5.1.1 FIFO Buffer Access
          2. 6.3.5.1.2 FIFO Buffer Flags
        2. 6.3.5.2  HART Modulator
        3. 6.3.5.3  HART Demodulator
        4. 6.3.5.4  HART Modem Modes
          1. 6.3.5.4.1 Half-Duplex Mode
          2. 6.3.5.4.2 Full-Duplex Mode
        5. 6.3.5.5  HART Modulation and Demodulation Arbitration
          1. 6.3.5.5.1 HART Receive Mode
          2. 6.3.5.5.2 HART Transmit Mode
        6. 6.3.5.6  HART Modulator Timing and Preamble Requirements
        7. 6.3.5.7  HART Demodulator Timing and Preamble Requirements
        8. 6.3.5.8  IRQ Configuration for HART Communication
        9. 6.3.5.9  HART Communication Using the SPI
        10. 6.3.5.10 HART Communication Using UART
        11. 6.3.5.11 Memory Built-In Self-Test (MBIST)
      6. 6.3.6  Internal Reference
      7. 6.3.7  Integrated Precision Oscillator
      8. 6.3.8  Precision Oscillator Diagnostics
      9. 6.3.9  One-Time Programmable (OTP) Memory
      10. 6.3.10 GPIO
      11. 6.3.11 Timer
      12. 6.3.12 Unique Chip Identifier (ID)
      13. 6.3.13 Scratch Pad Register
    4. 6.4 Device Functional Modes
      1. 6.4.1 DAC Power-Down Mode
      2. 6.4.2 Register Built-In Self-Test (RBIST)
      3. 6.4.3 Reset
    5. 6.5 Programming
      1. 6.5.1 Communication Setup
        1. 6.5.1.1 SPI Mode
        2. 6.5.1.2 UART Mode
        3. 6.5.1.3 SPI Plus UART Mode
        4. 6.5.1.4 HART Functionality Setup Options
      2. 6.5.2 GPIO Programming
      3. 6.5.3 Serial Peripheral Interface (SPI)
        1. 6.5.3.1 SPI Frame Definition
        2. 6.5.3.2 SPI Read and Write
        3. 6.5.3.3 Frame Error Checking
        4. 6.5.3.4 Synchronization
      4. 6.5.4 UART Interface
        1. 6.5.4.1 UART Break Mode (UBM)
          1. 6.5.4.1.1 Interface With FIFO Buffers and Register Map
      5. 6.5.5 Status Bits
      6. 6.5.6 Watchdog Timer
  8. Register Maps
    1. 7.1 AFEx82H1 Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 4-mA to 20-mA Current Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Current Loop Control
          2. 8.2.1.2.2 HART Connections
          3. 8.2.1.2.3 Input Protection and Rectification
          4. 8.2.1.2.4 System Current Budget
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRU|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics: VOUT DAC

at TA = 25°C, PVDD = 2.7 V, IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted)

GUID-20230202-SS0I-RZKQ-5JRW-V4HTNK99VTVL-low.png
 
Figure 5-3 DAC DNL vs Digital Input Code
GUID-20230202-SS0I-RS38-LFRT-0X3XHW4PSDH5-low.png
 
Figure 5-5 DAC INL vs Digital Input Code
GUID-20230202-SS0I-R1VL-PQHM-TGTCPSJFNHC2-low.png
 
Figure 5-7 DAC TUE vs Digital Input Code
GUID-20230223-SS0I-CHRK-GFFL-KBXQRXMP2VTW-low.png
 
Figure 5-9 Zero-code Impedance
GUID-20230223-SS0I-NSC0-RCJX-CRCS326BMKMW-low.png
DAC at midcode
Figure 5-11 DAC Source and Sink Current Capability
GUID-20230223-SS0I-DSL5-VNC1-T8ZZLTRV5QQ5-low.png
PVDD = 5.5 V
Figure 5-13 DAC Glitch Impulse Rising Edge
GUID-20230302-SS0I-7CXX-4ZN0-G7M6DBHHS9BP-low.pngFigure 5-15 DAC Gain Error vs Temperature
GUID-20230302-SS0I-2GL2-WTPS-ZQKCMHT4H9BG-low.pngFigure 5-17 DAC Full Scale Error vs Temperature
GUID-20230207-SS0I-19JJ-JQMB-ZQGV96NHMB44-low.png
DAC at midcode PVDD = 5.5 V
Figure 5-19 DAC Output Noise, 0.1 Hz to 10 Hz
GUID-20230202-SS0I-P3HL-CKD6-7GTRPSTBXXMQ-low.png
 
Figure 5-21 DAC Rising Settling Time
GUID-20230202-SS0I-TX0W-XWWN-3FRSMK436SMK-low.png
 
Figure 5-23 DAC Settling Time With Linear Slew Rate Control
GUID-20230202-SS0I-QTNT-KG5X-6TNSVLWSGHVQ-low.png
 
Figure 5-25 DAC RESET Response
GUID-20230207-SS0I-NZJ6-R1R0-FN9SV1NFXBN8-low.png
Internal reference
Figure 5-27 DAC AC PSRR vs Frequency
GUID-20230202-SS0I-WVJ3-C9LZ-650JJ978GLGD-low.png
 
Figure 5-4 MIN and MAX DAC DNL Range vs Temperature
GUID-20230202-SS0I-1T0S-MXDD-R20KJXZ1XDKW-low.png
 
Figure 5-6 MIN and MAX DAC INL Range vs Temperature
GUID-20230202-SS0I-MG9M-W96Z-TMSLSL1Z8RVD-low.png
 
Figure 5-8 MIN and MAX DAC TUE vs Temperature
GUID-20230223-SS0I-G1H5-JR51-VG6XN3K31G9T-low.png
 
Figure 5-10 DAC Footroom Over Temperature and Load
GUID-20220927-SS0I-R0XJ-3SC6-JFRMBXJDMJCG-low.png
Ideal reference
Figure 5-12 DAC Output Voltage Long-Term Stability
GUID-20230223-SS0I-QVVS-KHMW-6TMLNQR3R6TG-low.png
PVDD = 5.5 V
Figure 5-14 DAC Glitch Impulse Falling Edge
GUID-20230302-SS0I-SFNB-RZJX-RZKMLZHRHMVZ-low.pngFigure 5-16 DAC Offset Error vs Temperature
GUID-20230302-SS0I-MBJM-F6TX-XHHJ4BXXSWCG-low.pngFigure 5-18 DAC Zero Scale Error vs Temperature
GUID-20230207-SS0I-Q0QP-THN9-GX4ND6GKSF5G-low.png
DAC at midcode PVDD = 5.5 V
Figure 5-20 DAC Output Noise Density vs Frequency
GUID-20230202-SS0I-P5BV-DVNL-DSVSQXPVHWLS-low.png
 
Figure 5-22 DAC Falling Settling Time
GUID-20230202-SS0I-S6KZ-V1JN-F2HV7RPR466P-low.png
 
Figure 5-24 DAC Settling Time With Sinusoidal Slew Rate Control
GUID-20230202-SS0I-FNVZ-VG0M-PKLFKCC6RSWG-low.png
 
Figure 5-26 DAC Supply Power On, PVDD = 2.7 V