SPRS637E February   2010  – June 2014 AM1707

PRODUCTION DATA.  

  1. 1 AM1707 ARM Microprocessor
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Overview
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 ARM Subsystem
      1. 3.3.1 ARM926EJ-S RISC CPU
      2. 3.3.2 CP15
      3. 3.3.3 MMU
      4. 3.3.4 Caches and Write Buffer
      5. 3.3.5 Advanced High-Performance Bus (AHB)
      6. 3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
      7. 3.3.7 ARM Memory Mapping
    4. 3.4 Memory Map Summary
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Terminal Functions
      1. 3.6.1  Device Reset and JTAG
      2. 3.6.2  High-Frequency Oscillator and PLL
      3. 3.6.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.6.4  External Memory Interface A (ASYNC, SDRAM)
      5. 3.6.5  External Memory Interface B (SDRAM only)
      6. 3.6.6  Serial Peripheral Interface Modules (SPI0, SPI1)
      7. 3.6.7  Enhanced Capture/Auxiliary PWM Modules (eCAP0, eCAP1, eCAP2)
      8. 3.6.8  Enhanced Pulse Width Modulators (eHRPWM0, eHRPWM1, eHRPWM2)
      9. 3.6.9  Enhanced Quadrature Encoder Pulse Module (eQEP)
      10. 3.6.10 Boot
      11. 3.6.11 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      12. 3.6.12 Inter-Integrated Circuit Modules (I2C0, I2C1)
      13. 3.6.13 Timers
      14. 3.6.14 Universal Host-Port Interface (UHPI)
      15. 3.6.15 Multichannel Audio Serial Ports (McASP0, McASP1, McASP2)
      16. 3.6.16 Universal Serial Bus Modules (USB0, USB1)
      17. 3.6.17 Ethernet Media Access Controller (EMAC)
      18. 3.6.18 Multimedia Card/Secure Digital (MMC/SD)
      19. 3.6.19 Liquid Crystal Display Controller (LCD)
      20. 3.6.20 Reserved and No Connect
      21. 3.6.21 Supply and Ground
      22. 3.6.22 Unused USB0 (USB2.0) and USB1 (USB1.1) Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
    4. 4.4 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    5. 4.5 Handling Ratings
    6. 4.6 Recommended Operating Conditions
    7. 4.7 Notes on Recommended Power-On Hours (POH)
    8. 4.8 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  5. 5Peripheral Information and Electrical Specifications
    1. 5.1  Parameter Information
      1. 5.1.1 Parameter Information Device-Specific Information
        1. 5.1.1.1 Signal Transition Levels
    2. 5.2  Recommended Clock and Control Signal Transition Behavior
    3. 5.3  Power Supplies
      1. 5.3.1 Power-on Sequence
      2. 5.3.2 Power-off Sequence
    4. 5.4  Reset
      1. 5.4.1 Power-On Reset (POR)
      2. 5.4.2 Warm Reset
      3. 5.4.3 Reset Electrical Data Timings
    5. 5.5  Crystal Oscillator or External Clock Input
    6. 5.6  Clock PLLs
      1. 5.6.1 PLL Device-Specific Information
      2. 5.6.2 Device Clock Generation
      3. 5.6.3 PLL Controller 0 Registers
    7. 5.7  Interrupts
      1. 5.7.1 ARM CPU Interrupts
        1. 5.7.1.1 ARM Interrupt Controller (AINTC) Interrupt Signal Hierarchy
        2. 5.7.1.2 AINTC Hardware Vector Generation
        3. 5.7.1.3 AINTC Hardware Interrupt Nesting Support
        4. 5.7.1.4 AINTC System Interrupt Assignments on the device
        5. 5.7.1.5 AINTC Memory Map
    8. 5.8  General-Purpose Input/Output (GPIO)
      1. 5.8.1 GPIO Register Description(s)
      2. 5.8.2 GPIO Peripheral Input/Output Electrical Data/Timing
      3. 5.8.3 GPIO Peripheral External Interrupts Electrical Data/Timing
    9. 5.9  EDMA
    10. 5.10 External Memory Interface A (EMIFA)
      1. 5.10.1 EMIFA Asynchronous Memory Support
      2. 5.10.2 EMIFA Synchronous DRAM Memory Support
      3. 5.10.3 EMIFA SDRAM Loading Limitations
      4. 5.10.4 EMIFA Connection Examples
      5. 5.10.5 External Memory Interface A (EMIFA) Registers
      6. 5.10.6 EMIFA Electrical Data/Timing
    11. 5.11 External Memory Interface B (EMIFB)
      1. 5.11.1 EMIFB SDRAM Loading Limitations
      2. 5.11.2 Interfacing to SDRAM
      3. 5.11.3 EMIFB Registers
      4. 5.11.4 EMIFB Electrical Data/Timing
    12. 5.12 Memory Protection Units
    13. 5.13 MMC / SD / SDIO (MMCSD)
      1. 5.13.1 MMCSD Peripheral Description
      2. 5.13.2 MMCSD Peripheral Register Description(s)
      3. 5.13.3 MMC/SD Electrical Data/Timing
    14. 5.14 Ethernet Media Access Controller (EMAC)
      1. 5.14.1 EMAC Peripheral Register Description(s)
    15. 5.15 Management Data Input/Output (MDIO)
      1. 5.15.1 MDIO Registers
      2. 5.15.2 Management Data Input/Output (MDIO) Electrical Data/Timing
    16. 5.16 Multichannel Audio Serial Ports (McASP0, McASP1, and McASP2)
      1. 5.16.1 McASP Peripheral Registers Description(s)
      2. 5.16.2 McASP Electrical Data/Timing
        1. 5.16.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
        2. 5.16.2.2 Multichannel Audio Serial Port 1 (McASP1) Timing
        3. 5.16.2.3 Multichannel Audio Serial Port 2 (McASP2) Timing
    17. 5.17 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 5.17.1 SPI Peripheral Registers Description(s)
      2. 5.17.2 SPI Electrical Data/Timing
        1. 5.17.2.1 Serial Peripheral Interface (SPI) Timing
    18. 5.18 Enhanced Capture (eCAP) Peripheral
    19. 5.19 Enhanced Quadrature Encoder (eQEP) Peripheral
    20. 5.20 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 5.20.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
      2. 5.20.2 Trip-Zone Input Timing
    21. 5.21 LCD Controller
      1. 5.21.1 LCD Interface Display Driver (LIDD Mode)
      2. 5.21.2 LCD Raster Mode
    22. 5.22 Timers
      1. 5.22.1 Timer Electrical Data/Timing
    23. 5.23 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
      1. 5.23.1 I2C Device-Specific Information
      2. 5.23.2 I2C Peripheral Registers Description(s)
      3. 5.23.3 I2C Electrical Data/Timing
        1. 5.23.3.1 Inter-Integrated Circuit (I2C) Timing
    24. 5.24 Universal Asynchronous Receiver/Transmitter (UART)
      1. 5.24.1 UART Peripheral Registers Description(s)
      2. 5.24.2 UART Electrical Data/Timing
    25. 5.25 USB1 Host Controller Registers (USB1.1 OHCI)
      1. 5.25.1 USB1 Unused Signal Configuration
    26. 5.26 USB0 OTG (USB2.0 OTG)
      1. 5.26.1 USB2.0 (USB0) Electrical Data/Timing
      2. 5.26.2 USB0 Unused Signal Configuration
    27. 5.27 Host-Port Interface (UHPI)
      1. 5.27.1 HPI Device-Specific Information
      2. 5.27.2 HPI Peripheral Register Description(s)
      3. 5.27.3 HPI Electrical Data/Timing
    28. 5.28 Power and Sleep Controller (PSC)
      1. 5.28.1 Power Domain and Module Topology
        1. 5.28.1.1 Power Domain States
        2. 5.28.1.2 Module States
    29. 5.29 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 5.29.1 PRUSS Register Descriptions
    30. 5.30 Emulation Logic
      1. 5.30.1 JTAG Port Description
      2. 5.30.2 Scan Chain Configuration Parameters
      3. 5.30.3 Initial Scan Chain Configuration
        1. 5.30.3.1 Adding TAPS to the Scan Chain
      4. 5.30.4 JTAG 1149.1 Boundary Scan Considerations
    31. 5.31 IEEE 1149.1 JTAG
      1. 5.31.1 JTAG Peripheral Register Description(s) - JTAG ID Register (DEVIDR0)
      2. 5.31.2 JTAG Test-Port Electrical Data/Timing
    32. 5.32 Real Time Clock (RTC)
      1. 5.32.1 Clock Source
      2. 5.32.2 Registers
  6. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
      2. 6.1.2 Device and Development-Support Tool Nomenclature
    2. 6.2 Documentation Support
    3. 6.3 Community Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  7. 7Mechanical Packaging and Orderable Information
    1. 7.1 Thermal Data for ZKB
    2. 7.2 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZKB|256
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical Packaging and Orderable Information

This section describes the device orderable part numbers, packaging options, materials, thermal and mechanical parameters.

7.1 Thermal Data for ZKB

The following table(s) show the thermal resistance characteristics for the PBGA–ZKB mechanical package.

Table 7-1 Thermal Resistance Characteristics (PBGA Package) [ZKB]

PARAMETER °C/W(1) °C/W(2) AIR FLOW (m/s)(3)
RΘJC Junction-to-case 12.8 13.5 N/A
RΘJB Junction-to-board 15.1 19.7 N/A
RΘJA Junction-to-free air 24.5 33.8 0.00
RΘJMA Junction-to-moving air 21.9 30 0.50
21.1 28.7 1.00
20.4 27.4 2.00
19.6 26 4.00
PsiJT Junction-to-package top 0.6 0.8 0.00
0.8 1 0.50
0.9 1.2 1.00
1.1 1.4 2.00
1.3 1.8 4.00
PsiJB Junction-to-board 14.9 19.1 0.00
14.4 18.2 0.50
14.4 18 1.00
14.3 17.7 2.00
14.1 17.4 4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application. For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and 1.5oz (50um) inner copper thickness
(2) Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness. Power dissipation of 1W and ambient temp of 70C assumed.
(3) m/s = meters per second

7.2 Packaging Information

The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document.