SPRS710E November   2010  – March 2014 AM1802

PRODUCTION DATA.  

  1. 1AM1802 ARM Microprocessor
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Overview
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 ARM Subsystem
      1. 3.3.1 ARM926EJ-S RISC CPU
      2. 3.3.2 CP15
      3. 3.3.3 MMU
      4. 3.3.4 Caches and Write Buffer
      5. 3.3.5 Advanced High-Performance Bus (AHB)
      6. 3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
      7. 3.3.7 ARM Memory Mapping
    4. 3.4 Memory Map Summary
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Pin Multiplexing Control
    7. 3.7 Terminal Functions
      1. 3.7.1  Device Reset and JTAG
      2. 3.7.2  High-Frequency Oscillator and PLL
      3. 3.7.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.7.4  DEEPSLEEP Power Control
      5. 3.7.5  External Memory Interface A (EMIFA)
      6. 3.7.6  DDR2/mDDR Memory Controller
      7. 3.7.7  Serial Peripheral Interface Modules (SPI)
      8. 3.7.8  Boot
      9. 3.7.9  Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      10. 3.7.10 Inter-Integrated Circuit Modules (I2C0)
      11. 3.7.11 Timers
      12. 3.7.12 Multichannel Audio Serial Ports (McASP)
      13. 3.7.13 Universal Serial Bus Modules (USB0)
      14. 3.7.14 Ethernet Media Access Controller (EMAC)
      15. 3.7.15 Multimedia Card/Secure Digital (MMC/SD)
      16. 3.7.16 General Purpose Input Output
      17. 3.7.17 Reserved and No Connect
      18. 3.7.18 Supply and Ground
    8. 3.8 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 ARM CPU Interrupts
        1. 6.7.1.1 ARM Interrupt Controller (AINTC) Interrupt Signal Hierarchy
        2. 6.7.1.2 AINTC Hardware Vector Generation
        3. 6.7.1.3 AINTC Hardware Interrupt Nesting Support
        4. 6.7.1.4 AINTC System Interrupt Assignments
        5. 6.7.1.5 AINTC Memory Map
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Module States
    9. 6.9  EDMA
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 External Memory Interface Register Descriptions
      5. 6.10.5 EMIFA Electrical Data/Timing
    11. 6.11 DDR2/mDDR Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 MDDR/DDR2 Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD0)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
    14. 6.14 Multichannel Audio Serial Port (McASP)
      1. 6.14.1 McASP Peripheral Registers Description(s)
      2. 6.14.2 McASP Electrical Data/Timing
        1. 6.14.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
    15. 6.15 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.15.1 SPI Peripheral Registers Description(s)
      2. 6.15.2 SPI Electrical Data/Timing
        1. 6.15.2.1 Serial Peripheral Interface (SPI) Timing
    16. 6.16 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.16.1 I2C Device-Specific Information
      2. 6.16.2 I2C Peripheral Registers Description(s)
      3. 6.16.3 I2C Electrical Data/Timing
        1. 6.16.3.1 Inter-Integrated Circuit (I2C) Timing
    17. 6.17 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.17.1 UART Peripheral Registers Description(s)
      2. 6.17.2 UART Electrical Data/Timing
    18. 6.18 Universal Serial Bus OTG Controller (USB0) [USB2.0 OTG]
      1. 6.18.1 USB0 [USB2.0] Electrical Data/Timing
    19. 6.19 Ethernet Media Access Controller (EMAC)
      1. 6.19.1 EMAC Peripheral Register Description(s)
        1. 6.19.1.1 EMAC Electrical Data/Timing
    20. 6.20 Management Data Input/Output (MDIO)
      1. 6.20.1 MDIO Registers
      2. 6.20.2 Management Data Input/Output (MDIO) Electrical Data/Timing
    21. 6.21 Timers
      1. 6.21.1 Timer Electrical Data/Timing
    22. 6.22 Real Time Clock (RTC)
      1. 6.22.1 Clock Source
      2. 6.22.2 Real-Time Clock Register Descriptions
    23. 6.23 General-Purpose Input/Output (GPIO)
      1. 6.23.1 GPIO Register Description(s)
      2. 6.23.2 GPIO Peripheral Input/Output Electrical Data/Timing
      3. 6.23.3 GPIO Peripheral External Interrupts Electrical Data/Timing
    24. 6.24 Emulation Logic
      1. 6.24.1 JTAG Port Description
      2. 6.24.2 Scan Chain Configuration Parameters
      3. 6.24.3 Initial Scan Chain Configuration
        1. 6.24.3.1 Adding TAPS to the Scan Chain
      4. 6.24.4 IEEE 1149.1 JTAG
        1. 6.24.4.1 JTAG Peripheral Register Description(s) - JTAG ID Register (DEVIDR0)
        2. 6.24.4.2 JTAG Test-Port Electrical Data/Timing
      5. 6.24.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZCE Package
    2. 8.2 Thermal Data for ZWT Package
    3. 8.3 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZCE|361
  • ZWT|361
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Device Overview

3.1 Device Characteristics

Table 3-1 provides an overview of the device. The table shows significant features of the device, including the capacity of on-chip RAM, peripherals, and the package type with pin count.

Table 3-1 Characteristics of the Device

HARDWARE FEATURES AM1802
Peripherals
Not all peripherals pins are available at the same time (for more detail, see the Device Configurations section). 		DDR2/mDDR Controller DDR2, 16-bit bus width, up to 156 MHz
Mobile DDR, 16-bit bus width, up to 150 MHz
EMIFA Asynchronous (8/16-bit bus width) RAM, Flash,
16-bit SDRAM, NOR, NAND
Flash Card Interface MMC and SD cards supported
EDMA3 64 independent channels, 16 QDMA channels,
2 channel controllers, 3 transfer controllers
Timers 4 64-Bit General Purpose (each configurable as 2 separate 32-bit timers, one configurable as Watch Dog)
UART 3 (each with RTS and CTS flow control)
SPI 2 (Each with multiple chip selects)
I2C 1 (Master/Slave)
Multichannel Audio Serial Port [McASP] 1 (each with transmit/receive, FIFO buffer, 16 serializers)
10/100 Ethernet MAC with Management Data I/O 1 (MII or RMII Interface)
USB 2.0 (USB0) High-Speed OTG Controller with on-chip OTG PHY
General-Purpose Input/Output Port 9 banks of 16-bit
On-Chip Memory Size (Bytes) 168KB RAM
Organization
ARM
16KB I-Cache
16KB D-Cache
8KB RAM (Vector Table)
64KB ROM
ADDITIONAL MEMORY
128KB RAM
JTAG BSDL_ID DEVIDR0 Register 0x0B7D_102F
CPU Frequency MHz ARM926 300 MHz (1.2V)
Voltage Core (V) 1.2 V nominal for 300 MHz
I/O (V) 1.8 V or 3.3 V
Packages 13 mm x 13 mm, 361-Ball 0.65 mm pitch, PBGA (ZCE)
16 mm x 16 mm, 361-Ball 0.80 mm pitch, PBGA (ZWT)
Product Status(1) Product Preview (PP),
Advance Information (AI),
or Production Data (PD)		 PD
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

3.2 Device Compatibility

The ARM926EJ-S RISC CPU is compatible with other ARM9 CPUs from ARM Holdings plc.

3.3 ARM Subsystem

The ARM Subsystem includes the following features:

  • ARM926EJ-S RISC processor
  • ARMv5TEJ (32/16-bit) instruction set
  • Little endian
  • System Control Co-Processor 15 (CP15)
  • MMU
  • 16KB Instruction cache
  • 16KB Data cache
  • Write Buffer
  • Embedded Trace Module and Embedded Trace Buffer (ETM/ETB)
  • ARM Interrupt controller

3.3.1 ARM926EJ-S RISC CPU

The ARM Subsystem integrates the ARM926EJ-S processor. The ARM926EJ-S processor is a member of ARM9 family of general-purpose microprocessors. This processor is targeted at multi-tasking applications where full memory management, high performance, low die size, and low power are all important. The ARM926EJ-S processor supports the 32-bit ARM and 16 bit THUMB instruction sets, enabling the user to trade off between high performance and high code density. Specifically, the ARM926EJ-S processor supports the ARMv5TEJ instruction set, which includes features for efficient execution of Java byte codes, providing Java performance similar to Just in Time (JIT) Java interpreter, but without associated code overhead.

The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both hardware and software debug. The ARM926EJ-S processor has a Harvard architecture and provides a complete high performance subsystem, including:

  • ARM926EJ -S integer core
  • CP15 system control coprocessor
  • Memory Management Unit (MMU)
  • Separate instruction and data caches
  • Write buffer
  • Separate instruction and data (internal RAM) interfaces
  • Separate instruction and data AHB bus interfaces
  • Embedded Trace Module and Embedded Trace Buffer (ETM/ETB)

For more complete details on the ARM9, refer to the ARM926EJ-S Technical Reference Manual, available at http://www.arm.com

3.3.2 CP15

The ARM926EJ-S system control coprocessor (CP15) is used to configure and control instruction and data caches, Memory Management Unit (MMU), and other ARM subsystem functions. The CP15 registers are programmed using the MRC and MCR ARM instructions, when the ARM in a privileged mode such as supervisor or system mode.

3.3.3 MMU

A single set of two level page tables stored in main memory is used to control the address translation, permission checks and memory region attributes for both data and instruction accesses. The MMU uses a single unified Translation Lookaside Buffer (TLB) to cache the information held in the page tables. The MMU features are:

  • Standard ARM architecture v4 and v5 MMU mapping sizes, domains and access protection scheme.
  • Mapping sizes are:
    • 1MB (sections)
    • 64KB (large pages)
    • 4KB (small pages)
    • 1KB (tiny pages)
  • Access permissions for large pages and small pages can be specified separately for each quarter of the page (subpage permissions)
  • Hardware page table walks
  • Invalidate entire TLB, using CP15 register 8
  • Invalidate TLB entry, selected by MVA, using CP15 register 8
  • Lockdown of TLB entries, using CP15 register 10

3.3.4 Caches and Write Buffer

The size of the Instruction cache is 16KB, Data cache is 16KB. Additionally, the caches have the following features:

  • Virtual index, virtual tag, and addressed using the Modified Virtual Address (MVA)
  • Four-way set associative, with a cache line length of eight words per line (32-bytes per line) and with two dirty bits in the Dcache
  • Dcache supports write-through and write-back (or copy back) cache operation, selected by memory region using the C and B bits in the MMU translation tables
  • Critical-word first cache refilling
  • Cache lockdown registers enable control over which cache ways are used for allocation on a line fill, providing a mechanism for both lockdown, and controlling cache corruption
  • Dcache stores the Physical Address TAG (PA TAG) corresponding to each Dcache entry in the TAG RAM for use during the cache line write-backs, in addition to the Virtual Address TAG stored in the TAG RAM. This means that the MMU is not involved in Dcache write-back operations, removing the possibility of TLB misses related to the write-back address.
  • Cache maintenance operations provide efficient invalidation of, the entire Dcache or Icache, regions of the Dcache or Icache, and regions of virtual memory.

The write buffer is used for all writes to a noncachable bufferable region, write-through region and write misses to a write-back region. A separate buffer is incorporated in the Dcache for holding write-back for cache line evictions or cleaning of dirty cache lines. The main write buffer has 16-word data buffer and a four-address buffer. The Dcache write-back has eight data word entries and a single address entry.

3.3.5 Advanced High-Performance Bus (AHB)

The ARM Subsystem uses the AHB port of the ARM926EJ-S to connect the ARM to the Config bus and the external memories. Arbiters are employed to arbitrate access to the separate D-AHB and I-AHB by the Config Bus and the external memories bus.

3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)

To support real-time trace, the ARM926EJ-S processor provides an interface to enable connection of an Embedded Trace Macrocell (ETM). The ARM926ES-J Subsystem in the device also includes the Embedded Trace Buffer (ETB). The ETM consists of two parts:

  • Trace Port provides real-time trace capability for the ARM9.
  • Triggering facilities provide trigger resources, which include address and data comparators, counter, and sequencers.

The device trace port is not pinned out and is instead only connected to the Embedded Trace Buffer. The ETB has a 4KB buffer memory. ETB enabled debug tools are required to read/interpret the captured trace data.

3.3.7 ARM Memory Mapping

By default the ARM has access to most on and off chip memory areas, including EMIFA, DDR2, and the additional 128K byte on chip SRAM. Likewise almost all of the on chip peripherals are accessible to the ARM by default.

See Table 3-2 for a detailed top level device memory map that includes the ARM memory space.

3.4 Memory Map Summary

Note: Read/Write accesses to illegal or reserved addresses in the memory map may cause undefined behavior.

Table 3-2 AM1802 Top Level Memory Map

Start Address End Address Size ARM Mem Map EDMA Mem Map Master Peripheral Mem Map
0x0000 0000 0x01BB FFFF
0x01BC 0000 0x01BC 0FFF 4K ARM ETB memory
0x01BC 1000 0x01BC 17FF 2K ARM ETB reg
0x01BC 1800 0x01BC 18FF 256 ARM Ice Crusher
0x01BC 1900 0x01BF FFFF
0x01C0 0000 0x01C0 7FFF 32K EDMA3 CC
0x01C0 8000 0x01C0 83FF 1K EDMA3 TC0
0x01C0 8400 0x01C0 87FF 1K EDMA3 TC1
0x01C0 8800 0x01C0 FFFF
0x01C1 0000 0x01C1 0FFF 4K PSC 0
0x01C1 1000 0x01C1 1FFF 4K PLL Controller 0
0x01C1 2000 0x01C1 3FFF
0x01C1 4000 0x01C1 4FFF 4K SYSCFG0
0x01C1 5000 0x01C1 FFFF
0x01C2 0000 0x01C2 0FFF 4K Timer0
0x01C2 1000 0x01C2 1FFF 4K Timer1
0x01C2 2000 0x01C2 2FFF 4K I2C 0
0x01C2 3000 0x01C2 3FFF 4K RTC
0x01C2 4000 0x01C3 FFFF
0x01C4 0000 0x01C4 0FFF 4K MMC/SD 0
0x01C4 1000 0x01C4 1FFF 4K SPI 0
0x01C4 2000 0x01C4 2FFF 4K UART 0
0x01C4 3000 0x01CF FFFF
0x01D0 0000 0x01D0 0FFF 4K McASP 0 Control
0x01D0 1000 0x01D0 1FFF 4K McASP 0 AFIFO Ctrl
0x01D0 2000 0x01D0 2FFF 4K McASP 0 Data
0x01D0 3000 0x01D0 BFFF
0x01D0 C000 0x01D0 CFFF 4K UART 1
0x01D0 D000 0x01D0 DFFF 4K UART 2
0x01D0 E000 0x01DF FFFF
0x01E0 0000 0x01E0 FFFF 64K USB0
0x01E1 0000 0x01E1 3FFF
0x01E1 4000 0x01E1 4FFF 4K Memory Protection Unit 1 (MPU 1)
0x01E1 5000 0x01E1 5FFF 4K Memory Protection Unit 2 (MPU 2)
0x01E1 6000 0x01E1 9FFF
0x01E1 A000 0x01E1 AFFF 4K PLL Controller 1
0x01E1 B000 0x01E1 FFFF
0x01E2 0000 0x01E2 1FFF 8K EMAC Control Module RAM
0x01E2 2000 0x01E2 2FFF 4K EMAC Control Module Registers
0x01E2 3000 0x01E2 3FFF 4K EMAC Control Registers
0x01E2 4000 0x01E2 4FFF 4K EMAC MDIO port
0x01E2 5000 0x01E2 5FFF
0x01E2 6000 0x01E2 6FFF 4K GPIO
0x01E2 7000 0x01E2 7FFF 4K PSC 1
0x01E2 8000 0x01E2 BFFF
0x01E2 C000 0x01E2 CFFF 4K SYSCFG1
0x01E2 D000 0x01E2 FFFF
0x01E3 0000 0x01E3 7FFF 32K EDMA3 CC1
0x01E3 8000 0x01E3 83FF 1K EDMA3 TC2
0x01E3 8400 0x01F0 BFFF
0x01F0 C000 0x01F0 CFFF 4K Timer2
0x01F0 D000 0x01F0 DFFF 4K Timer3
0x01F0 E000 0x01F0 EFFF 4K SPI1
0x01F0 F000 0x3FFF FFFF
0x4000 0000 0x5FFF FFFF 512M EMIFA SDRAM data (CS0)
0x6000 0000 0x61FF FFFF 32M EMIFA async data (CS2)
0x6200 0000 0x63FF FFFF 32M EMIFA async data (CS3)
0x6400 0000 0x65FF FFFF 32M EMIFA async data (CS4)
0x6600 0000 0x67FF FFFF 32M EMIFA async data (CS5)
0x6800 0000 0x6800 7FFF 32K EMIFA Control Regs
0x6800 8000 0x7FFF FFFF
0x8000 0000 0x8001 FFFF 128K On-Chip RAM
0x8002 0000 0xAFFF FFFF
0xB000 0000 0xB000 7FFF 32K DDR2/mDDR Control Regs
0xB000 8000 0xBFFF FFFF
0xC000 0000 0xCFFF FFFF 256M DDR2/mDDR Data
0xD000 0000 0xE000 0000
0xFFFD 0000 0xFFFD FFFF 64K ARM local ROM
0xFFFE 0000 0xFFFE DFFF
0xFFFE E000 0xFFFE FFFF 8K ARM Interrupt Controller
0xFFFF 0000 0xFFFF 1FFF 8K ARM local RAM
0xFFFF 2000 0xFFFF FFFF

3.5 Pin Assignments

Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in the smallest possible package. Pin multiplexing is controlled using a combination of hardware configuration at device reset and software programmable register settings.

3.5.1 Pin Map (Bottom View)

The following graphics show the bottom view of the ZCE and ZWT package pin assignments in four quadrants (A, B, C, and D). The pin assignments for both packages are identical.

pinmap_AM1802_quada.gifFigure 3-1 Pin Map (Quad A)
pinmap_AM1802_quadb.gifFigure 3-2 Pin Map (Quad B)
pinmap_AM1802_quadc.gifFigure 3-3 Pin Map (Quad C)
pinmap_AM1802_quadd.gifFigure 3-4 Pin Map (Quad D)

3.6 Pin Multiplexing Control

Device level pin multiplexing is controlled by registers PINMUX0 - PINMUX19 in the SYSCFG module.

For the device family, pin multiplexing can be controlled on a pin-by-pin basis. Each pin that is multiplexed with several different functions has a corresponding 4-bit field in one of the PINMUX registers.

Pin multiplexing selects which of several peripheral pin functions controls the pin's IO buffer output data and output enable values only. The default pin multiplexing control for almost every pin is to select 'none' of the peripheral functions in which case the pin's IO buffer is held tri-stated.

Note that the input from each pin is always routed to all of the peripherals that share the pin; the PINMUX registers have no effect on input from a pin.

3.7 Terminal Functions

Table 3-3 to Table 3-20 identify the external signal names, the associated pin/ball numbers along with the mechanical package designator, the pin type (I, O, IO, OZ, or PWR), whether the pin/ball has any internal pullup/pulldown resistors, whether the pin/ball is configurable as an IO in GPIO mode, and a functional pin description.

3.7.1 Device Reset and JTAG

Table 3-3 Reset and JTAG Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(4)		 DESCRIPTION
NAME NO.
RESET
RESET K14 I IPU B Device reset input
RESETOUT / GP6[15] T17 O(3) CP[21] C Reset output
JTAG
TMS L16 I IPU B JTAG test mode select
TDI M16 I IPU B JTAG test data input
TDO J18 O IPU B JTAG test data output
TCK J15 I IPU B JTAG test clock
TRST L17 I IPD B JTAG test reset
EMU0 J16 I/O IPU B Emulation pin
EMU1 K16 I/O IPU B Emulation pin
RTCK/ GP8[0] (5) K17 I/O IPD B JTAG Test Clock Return Clock Output General-purpose input/output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor, IPU = Internal Pullup resistor. CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) Open drain mode for RESETOUT function.
(4) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.
(5) GP8[0] is initially configured as a reserved function after reset and will not be in a predictable state. This signal will only be stable after the GPIO configuration for this pin has been completed. Users should carefully consider the system implications of this pin being in an unknown state after reset.

3.7.2 High-Frequency Oscillator and PLL

Table 3-4 High-Frequency Oscillator and PLL Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
CLKOUT / GP6[14] T18 O CP[22] C PLL Observation Clock
1.2-V OSCILLATOR
OSCIN L19 I — — Oscillator input
OSCOUT K19 O — — Oscillator output
OSCVSS L18 GND — — Oscillator ground
1.2-V PLL0
PLL0_VDDA L15 PWR — — PLL analog VDD (1.2-V filtered supply)
PLL0_VSSA M17 GND — — PLL analog VSS (for filter)
1.2-V PLL1
PLL1_VDDA N15 PWR — — PLL analog VDD (1.2-V filtered supply)
PLL1_VSSA M15 GND — — PLL analog VSS (for filter)
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.3 Real-Time Clock and 32-kHz Oscillator

Table 3-5 Real-Time Clock (RTC) and 1.2-V, 32-kHz Oscillator Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
RTC_XI J19 I — — RTC 32-kHz oscillator input
RTC_XO H19 O — — RTC 32-kHz oscillator output
RTC_ALARM / UART2_CTS / GP0[8] / DEEPSLEEP F4 O CP[0] A RTC Alarm
RTC_CVDD L14 PWR — — RTC module core power
(isolated from chip CVDD)
RTC_Vss H18 GND — — Oscillator ground
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.4 DEEPSLEEP Power Control

Table 3-6 DEEPSLEEP Power Control Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
RTC_ALARM / UART2_CTS / GP0[8] /DEEPSLEEP F4 I CP[0] A DEEPSLEEP power control output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.5 External Memory Interface A (EMIFA)

Table 3-7 External Memory Interface A (EMIFA) Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
EMA_D[15] / GP3[7] E6 I/O CP[17] B EMIFA data bus
EMA_D[14] / GP3[6] C7 I/O CP[17] B
EMA_D[13] / GP3[5] B6 I/O CP[17] B
EMA_D[12] / GP3[4] A6 I/O CP[17] B
EMA_D[11] / GP3[3] D6 I/O CP[17] B
EMA_D[10] / GP3[2] A7 I/O CP[17] B
EMA_D[9] / GP3[1] D9 I/O CP[17] B
EMA_D[8] / GP3[0] E10 I/O CP[17] B
EMA_D[7] / GP4[15] D7 I/O CP[17] B
EMA_D[6] / GP4[14] C6 I/O CP[17] B
EMA_D[5] / GP4[13] E7 I/O CP[17] B
EMA_D[4] / GP4[12] B5 I/O CP[17] B
EMA_D[3] / GP4[11] E8 I/O CP[17] B
EMA_D[2] / GP4[10] B8 I/O CP[17] B
EMA_D[1] / GP4[9] A8 I/O CP[17] B
EMA_D[0] / GP4[8] C9 I/O CP[17] B
EMA_A[22] / MMCSD0_CMD / GP4[6] A10 O CP[18] B EMIFA address bus
EMA_A[21] / MMCSD0_DAT[0] / GP4[5] B10 O CP[18] B
EMA_A[20] / MMCSD0_DAT[1] / GP4[4] A11 O CP[18] B
EMA_A[19] / MMCSD0_DAT[2] /GP4[3] C10 O CP[18] B
EMA_A[18] / MMCSD0_DAT[3] / GP4[2] E11 O CP[18] B
EMA_A[17] / MMCSD0_DAT[4] /GP4[1] B11 O CP[18] B
EMA_A[16] / MMCSD0_DAT[5] / GP4[0] E12 O CP[18] B
EMA_A[15] / MMCSD0_DAT[6] / GP5[15] C11 O CP[19] B
EMA_A[14] / MMCSD0_DAT[7] / GP5[14] A12 O CP[19] B
EMA_A[13] / GP5[13] D11 O CP[19] B
EMA_A[12] / GP5[12] D13 O CP[19] B
EMA_A[11] / GP5[11] B12 O CP[19] B
EMA_A[10] / GP5[10] C12 O CP[19] B
EMA_A[9] / GP5[9] D12 O CP[19] B
EMA_A[8] / GP5[8] A13 O CP[19] B
EMA_A[7] / GP5[7] B13 O CP[20] B
EMA_A[6] / GP5[6] E13 O CP[20] B
EMA_A[5] / GP5[5] C13 O CP[20] B
EMA_A[4] / GP5[4] A14 O CP[20] B
EMA_A[3] / GP5[3] D14 O CP[20] B
EMA_A[2] / GP5[2] B14 O CP[20] B
EMA_A[1] / GP5[1] D15 O CP[20] B
EMA_A[0] / GP5[0] C14 O CP[20] B
EMA_BA[0] / GP2[8] C15 O CP[16] B EMIFA bank address
EMA_BA[1] / GP2[9] A15 O CP[16] B
EMA_CLK / GP2[7] B7 O CP[16] B EMIFA clock
EMA_SDCKE / GP2[6] D8 O CP[16] B EMIFA SDRAM clock enable
EMA_RAS / GP2[5] A16 O CP[16] B EMIFA SDRAM row address strobe
EMA_CAS / GP2[4] A9 O CP[16] B EMIFA SDRAM column address strobe
EMA_CS[0] / GP2[0] A18 O CP[16] B EMIFA SDRAM Chip Select
EMA_CS[2] / GP3[15] B17 O CP[16] B EMIFA Async Chip Select
EMA_CS[3] / GP3[14] A17 O CP[16] B
EMA_CS[4] / GP3[13] F9 O CP[16] B
EMA_CS[5] / GP3[12] B16 O CP[16] B
EMA_A_RW / GP3[9] D10 O CP[16] B EMIFA Async Read/Write control
EMA_WE / GP3[11] B9 O CP[16] B EMIFA SDRAM write enable
EMA_WEN_DQM[1] / GP2[2] A5 O CP[16] B EMIFA write enable/data mask for EMA_D[15:8]
EMA_WEN_DQM[0] / GP2[3] C8 O CP[16] B EMIFA write enable/data mask for EMA_D[7:0]
EMA_OE / GP3[10] B15 O CP[16] B EMIFA output enable
EMA_WAIT[0] / GP3[8] B18 I CP[16] B EMIFA wait input/interrupt
EMA_WAIT[1] / GP2[1] B19 I CP[16] B
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.6 DDR2/mDDR Memory Controller

Table 3-8 DDR2/mDDR Terminal Functions

SIGNAL TYPE(1) PULL(2) DESCRIPTION
NAME NO.
DDR_D[15] W10 I/O IPD DDR2 SDRAM data bus
DDR_D[14] U11 I/O IPD
DDR_D[13] V10 I/O IPD
DDR_D[12] U10 I/O IPD
DDR_D[11] T12 I/O IPD
DDR_D[10] T10 I/O IPD
DDR_D[9] T11 I/O IPD
DDR_D[8] T13 I/O IPD
DDR_D[7] W11 I/O IPD
DDR_D[6] W12 I/O IPD
DDR_D[5] V12 I/O IPD
DDR_D[4] V13 I/O IPD
DDR_D[3] U13 I/O IPD
DDR_D[2] V14 I/O IPD
DDR_D[1] U14 I/O IPD
DDR_D[0] U15 I/O IPD
DDR_A[13] T5 O IPD DDR2 row/column address
DDR_A[12] V4 O IPD
DDR_A[11] T4 O IPD
DDR_A[10] W4 O IPD
DDR_A[9] T6 O IPD
DDR_A[8] U4 O IPD
DDR_A[7] U6 O IPD
DDR_A[6] W5 O IPD
DDR_A[5] V5 O IPD
DDR_A[4] U5 O IPD
DDR_A[3] V6 O IPD
DDR_A[2] W6 O IPD
DDR_A[1] T7 O IPD
DDR_A[0] U7 O IPD
DDR_CLKP W8 O IPD DDR2 clock (positive)
DDR_CLKN W7 O IPD DDR2 clock (negative)
DDR_CKE V7 O IPD DDR2 clock enable
DDR_WE T8 O IPD DDR2 write enable
DDR_RAS W9 O IPD DDR2 row address strobe
DDR_CAS U9 O IPD DDR2 column address strobe
DDR_CS V9 O IPD DDR2 chip select
DDR_DQM[0] W13 O IPD DDR2 data mask outputs
DDR_DQM[1] R10 O IPD
DDR_DQS[0] T14 I/O IPD DDR2 data strobe inputs/outputs
DDR_DQS[1] V11 I/O IPD
DDR_BA[2] U8 O IPD DDR2 SDRAM bank address
DDR_BA[1] T9 O IPD
DDR_BA[0] V8 O IPD
DDR_DQGATE0 R11 O IPD DDR2 loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE1 with same constraints as used for DDR clock and data.
DDR_DQGATE1 R12 I IPD DDR2 loopback signal for external DQS gating. Route to DDR and back to DDR_DQGATE0 with same constraints as used for DDR clock and data.
DDR_ZP U12 O — DDR2 reference output for drive strength calibration of N and P channel outputs. Tie to ground via 50 ohm resistor @ 5% tolerance.
DDR_VREF R6 I — DDR voltage input for the DDR2/mDDR I/O buffers. Note even in the case of mDDR an external resistor divider connected to this pin is necessary.
DDR_DVDD18 N10, P10, N9, P9, R9, P8, R8, P7, R7, N6 PWR — DDR PHY 1.8V power supply pins
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.

3.7.7 Serial Peripheral Interface Modules (SPI)

Table 3-9 Serial Peripheral Interface (SPI) Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
SPI0
SPI0_CLK / GP1[8] / MII_RXCLK D19 I/O CP[7] A SPI0 clock
SPI0_ENA / MII_RXDV C17 I/O CP[7] A SPI0 enable
SPI0_SCS[0] / TM64P1_OUT12 / GP1[6] / MDIO / TM64P1_IN12 D17 I/O CP[10] A SPI0 chip selects
SPI0_SCS[1] / TM64P0_OUT12 / GP1[7] / MDCLK / TM64P0_IN12 E16 I/O CP[10] A
SPI0_SCS[2] / UART0_RTS / GP8[1] / MII_RXD[0] D16 I/O CP[9] A
SPI0_SCS[3] / UART0_CTS / GP8[2] / MII_RXD[1] E17 I/O CP[9] A
SPI0_SCS[4] / UART0_TXD / GP8[3] / MII_RXD[2] D18 I/O CP[8] A
SPI0_SCS[5] / UART0_RXD / GP8[4] / MII_RXD[3] C19 I/O CP[8] A
SPI0_SIMO / GP8[5] / MII_CRS C18 I/O CP[7] A SPI0 data slave-in-master-out
SPI0_SOMI / GP8[6] / MII_RXER C16 I/O CP[7] A SPI0 data slave-out-master-in
SPI1
SPI1_CLK / GP2[13] G19 I/O CP[15] A SPI1 clock
SPI1_ENA / GP2[12] H16 I/O CP[15] A SPI1 enable
SPI1_SCS[0] /GP2[14] / TM64P3_IN12 E19 I/O CP[14] A SPI1 chip selects
SPI1_SCS[1] / GP2[15] / TM64P2_IN12 F18 I/O CP[14] A
SPI1_SCS[2] / UART1_TXD / GP1[0] F19 I/O CP[13] A
SPI1_SCS[3] / UART1_RXD / GP1[1] E18 I/O CP[13] A
SPI1_SCS[4] / UART2_TXD / GP1[2] F16 I/O CP[12] A
SPI1_SCS[5] / UART2_RXD / GP1[3] F17 I/O CP[12] A
SPI1_SCS[6] / I2C0_SDA / TM64P3_OUT12 / GP1[4] G18 I/O CP[11] A
SPI1_SCS[7] / I2C0_SCL / TM64P2_OUT12 / GP1[5] G16 I/O CP[11] A
SPI1_SIMO / GP2[10] G17 I/O CP[15] A SPI1 data slave-in-master-out
SPI1_SOMI / GP2[11] H17 I/O CP[15] A SPI1 data slave-out-master-in
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.8 Boot

Table 3-10 Boot Mode Selection Terminal Functions(3)

SIGNAL TYPE(1) PULL(2) POWER
GROUP(4)		 DESCRIPTION
NAME NO.
GP7[7] / BOOT[7] P4 I CP[29] C Boot Mode Selection Pins
GP7[6] / BOOT[6] R3 I CP[29] C
GP7[5] / BOOT[5] R2 I CP[29] C
GP7[4] / BOOT[4] R1 I CP[29] C
GP7[3] / BOOT[3] T3 I CP[29] C
GP7[2] / BOOT[2] T2 I CP[29] C
GP7[1] / BOOT[1] T1 I CP[29] C
GP7[0] / BOOT[0] U3 I CP[29] C
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) Boot decoding is defined in the bootloader application report.
(4) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.9 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)

Table 3-11 Universal Asynchronous Receiver/Transmitter (UART) Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
UART0
SPI0_SCS[5] / UART0_RXD / GP8[4] / MII_RXD[3] C19 I CP[8] A UART0 receive data
SPI0_SCS[4] / UART0_TXD / GP8[3] / MII_RXD[2] D18 O CP[8] A UART0 transmit data
SPI0_SCS[2] / UART0_RTS / GP8[1] D16 O CP[9] A UART0 ready-to-send output
SPI0_SCS[3] / UART0_CTS / GP8[2] E17 I CP[9] A UART0 clear-to-send input
UART1
SPI1_SCS[3] / UART1_RXD / GP1[1] E18 I CP[13] A UART1 receive data
SPI1_SCS[2] / UART1_TXD / GP1[0] F19 O CP[13] A UART1 transmit data
AHCLKR / UART1_RTS / GP0[11] A2 O CP[0] A UART1 ready-to-send output
AHCLKX / USB_REFCLKIN / UART1_CTS / GP0[10] A3 I CP[0] A UART1 clear-to-send input
UART2
SPI1_SCS[5] / UART2_RXD / GP1[3] F17 I CP[12] A UART2 receive data
SPI1_SCS[4] / UART2_TXD / GP1[2] F16 O CP[12] A UART2 transmit data
AMUTE / UART2_RTS / GP0[9] D5 O CP[0] A UART2 ready-to-send output
RTC_ALARM / UART2_CTS / GP0[8] / DEEPSLEEP F4 I CP[0] A UART2 clear-to-send input
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module.The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.10 Inter-Integrated Circuit Modules (I2C0)

Table 3-12 Inter-Integrated Circuit (I2C) Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
I2C0
SPI1_SCS[6] / I2C0_SDA / TM64P3_OUT12 / GP1[4] G18 I/O CP[11] A I2C0 serial data
SPI1_SCS[7] / I2C0_SCL / TM64P2_OUT12 / GP1[5] G16 I/O CP[11] A I2C0 serial clock
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module.The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.11 Timers

Table 3-13 Timers Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
TIMER0
SPI0_SCS[1] / TM64P0_OUT12 / GP1[7] / MDCLK / TM64P0_IN12 E16 I CP[10] A Timer0 lower input
SPI0_SCS[1] / TM64P0_OUT12 / GP1[7] / MDCLK / TM64P0_IN12 E16 O CP[10] A Timer0 lower output
TIMER1 (Watchdog)
SPI0_SCS[0] / TM64P1_OUT12 / GP1[6] / MDIO / TM64P1_IN12 D17 I CP[10] A Timer1 lower input
SPI0_SCS[0] / TM64P1_OUT12 / GP1[6] / MDIO /TM64P1_IN12 D17 O CP[10] A Timer1 lower output
TIMER2
SPI1_SCS[1] / GP2[15] / TM64P2_IN12 F18 I CP[14] A Timer2 lower input
SPI1_SCS[7] / I2C0_SCL / TM64P2_OUT12 / GP1[5] G16 O CP[11] A Timer2 lower output
TIMER3
SPI1_SCS[0] / GP2[14] / TM64P3_IN12 E19 I CP[14] A Timer3 lower input
SPI1_SCS[6] / I2C0_SDA / TM64P3_OUT12 / GP1[4] G18 O CP[11] A Timer3 lower output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.12 Multichannel Audio Serial Ports (McASP)

Table 3-14 Multichannel Audio Serial Ports Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
McASP0
AXR15 / GP0[7] A4 I/O CP[1] A McASP0 serial data
AXR14 / GP0[6] B4 I/O CP[2] A
AXR13 / GP0[5] B3 I/O CP[2] A
AXR12 / GP0[4] C4 I/O CP[2] A
AXR11 / GP0[3] C5 I/O CP[2] A
AXR10 / GP0[2] D4 I/O CP[2] A
AXR9 / GP0[1] C3 I/O CP[2] A
AXR8 / GP0[0] E4 I/O CP[3] A
AXR7 / GP1[15] D2 I/O CP[4] A
AXR6 / GP1[14] / MII_TXEN C1 I/O CP[5] A
AXR5 / GP1[13] / MII_TXCLK D3 I/O CP[5] A
AXR4 / GP1[12] / MII_COL D1 I/O CP[5] A
AXR3 / GP1[11] / MII_TXD[3] E3 I/O CP[5] A
AXR2 / GP1[10] / MII_TXD[2] E2 I/O CP[5] A
AXR1 / GP1[9] / MII_TXD[1] E1 I/O CP[5] A
AXR0 / GP8[7] / MII_TXD[0] F3 I/O CP[6] A
AHCLKX / USB_REFCLKIN / UART1_CTS / GP0[10] A3 I/O CP[0] A McASP0 transmit master clock
ACLKX / GP0[14] B1 I/O CP[0] A McASP0 transmit bit clock
AFSX / GP0[12] B2 I/O CP[0] A McASP0 transmit frame sync
AHCLKR / UART1_RTS /GP0[11] A2 I/O CP[0] A McASP0 receive master clock
ACLKR / GP0[15] A1 I/O CP[0] A McASP0 receive bit clock
AFSR / GP0[13] C2 I/O CP[0] A McASP0 receive frame sync
AMUTE / UART2_RTS / GP0[9] D5 I/O CP[0] A McASP0 mute output
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.13 Universal Serial Bus Modules (USB0)

Table 3-15 Universal Serial Bus (USB) Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
USB0 2.0 OTG (USB0)
USB0_DM M18 A IPD — USB0 PHY data minus
USB0_DP M19 A IPD — USB0 PHY data plus
USB0_VDDA33 N18 PWR — — USB0 PHY 3.3-V supply
USB0_ID P16 A — — USB0 PHY identification
(mini-A or mini-B plug)
USB0_VBUS N19 A — — USB0 bus voltage
USB0_DRVVBUS K18 O IPD B USB0 controller VBUS control output.
AHCLKX / USB_REFCLKIN / UART1_CTS / GP0[10] A3 I CP[0] A USB_REFCLKIN. Optional clock input
USB0_VDDA18 N14 PWR — — USB0 PHY 1.8-V supply input
USB0_VDDA12 N17 A — — USB0 PHY 1.2-V LDO output for bypass cap
For proper device operation, this pin must always be connected via a 0.22-μF capacitor to VSS (GND), even if USB0 is not being used.
USB_CVDD M12 PWR — — USB0 core logic 1.2-V supply input
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.14 Ethernet Media Access Controller (EMAC)

Table 3-16 Ethernet Media Access Controller (EMAC) Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
MII
AXR6 / GP1[14] / MII_TXEN C1 O CP[5] A EMAC MII Transmit enable output
AXR5 / GP1[13] / MII_TXCLK D3 I CP[5] A EMAC MII Transmit clock input
AXR4 / GP1[12] / MII_COL D1 I CP[5] A EMAC MII Collision detect input
AXR3 / GP1[11] / MII_TXD[3] E3 O CP[5] A EMAC MII transmit data
AXR2 / GP1[10] / MII_TXD[2] E2 O CP[5] A
AXR1 / GP1[9] / MII_TXD[1] E1 O CP[5] A
AXR0 / GP8[7] / MII_TXD[0] F3 O CP[6] A
SPI0_SOMI / GP8[6] / MII_RXER C16 I CP[7] A EMAC MII receive error input
SPI0_SIMO / GP8[5] / MII_CRS C18 I CP[7] A EMAC MII carrier sense input
SPI0_CLK / GP1[8] / MII_RXCLK D19 I CP[7] A EMAC MII receive clock input
SPI0_ENA / MII_RXDV C17 I CP[7] A EMAC MII receive data valid input
SPI0_SCS[5] / UART0_RXD / GP8[4] / MII_RXD[3] C19 I CP[8] A EMAC MII receive data
SPI0_SCS[4] / UART0_TXD / GP8[3] / MII_RXD[2] D18 I CP[8] A
SPI0_SCS[3] / UART0_CTS / GP8[2] / MII_RXD[1] E17 I CP[9] A
SPI0_SCS[2] / UART0_RTS / GP8[1] / MII_RXD[0] D16 I CP[9] A
RMII
RMII_MHZ_50_CLK W18 I/O CP[26] C EMAC 50-MHz clock input or output
RMII_RXER W17 I CP[26] C EMAC RMII receiver error
RMII_RXD[0] V17 I CP[26] C EMAC RMII receive data
RMII_RXD[1] W16 I CP[26] C
RMII_CRS_DV W19 I CP[26] C EMAC RMII carrier sense data valid
RMII_TXEN R14 O CP[26] C EMAC RMII transmit enable
RMII_TXD[0] V16 O CP[26] C EMAC RMII transmit data
RMII_TXD[1] U18 O CP[26] C
MDIO
SPI0_SCS[0] / TM64P1_OUT12 / GP1[6] / MDIO / TM64P1_IN12 D17 I/O CP[10] A MDIO serial data
SPI0_SCS[1] / TM64P0_OUT12 / GP1[7] / MDCLK / TM64P0_IN12 E16 O CP[10] A MDIO clock
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.15 Multimedia Card/Secure Digital (MMC/SD)

Table 3-17 Multimedia Card/Secure Digital (MMC/SD) Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
MMCSD0
MMCSD0_CLK / GP4[7] E9 O CP[18] B MMCSD0 Clock
EMA_A[22] / MMCSD0_CMD / GP4[6] A10 I/O CP[18] B MMCSD0 Command
EMA_A[14] / MMCSD0_DAT[7] / GP5[14] A12 I/O CP[19] B MMC/SD0 data
EMA_A[15] / MMCSD0_DAT[6] / GP5[15] C11 I/O CP[19] B
EMA_A[16] / MMCSD0_DAT[5] / GP4[0] E12 I/O CP[18] B
EMA_A[17] / MMCSD0_DAT[4] / GP4[1] B11 I/O CP[18] B
EMA_A[18] / MMCSD0_DAT[3] / GP4[2] E11 I/O CP[18] B
EMA_A[19] / MMCSD0_DAT[2] / GP4[3] C10 I/O CP[18] B
EMA_A[20] / MMCSD0_DAT[1] / GP4[4] A11 I/O CP[18] B
EMA_A[21] / MMCSD0_DAT[0] / GP4[5] B10 I/O CP[18] B
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.16 General Purpose Input Output

Table 3-18 General Purpose Input Output Terminal Functions

SIGNAL TYPE(1) PULL(2) POWER
GROUP(3)		 DESCRIPTION
NAME NO.
GP0
ACLKR / GP0[15] A1 I/O CP[0] A GPIO Bank 0
ACLKX / GP0[14] B1 I/O CP[0] A
AFSR / GP0[13] C2 I/O CP[0] A
AFSX / GP0[12] B2 I/O CP[0] A
AHCLKR / UART1_RTS / GP0[11] A2 I/O CP[0] A
AHCLKX / USB_REFCLKIN / UART1_CTS / GP0[10] A3 I/O CP[0] A
AMUTE / UART2_RTS / GP0[9] D5 I/O CP[0] A
RTC_ALARM / UART2_CTS / GP0[8] / DEEPSLEEP F4 I/O CP[0] A
AXR15 / GP0[7] A4 I/O CP[1] A
AXR14 / GP0[6] B4 I/O CP[2] A
AXR13 / GP0[5] B3 I/O CP[2] A
AXR12 / GP0[4] C4 I/O CP[2] A
AXR11 / GP0[3] C5 I/O CP[2] A
AXR10 / GP0[2] D4 I/O CP[2] A
AXR9 / GP0[1] C3 I/O CP[2] A
AXR8 / GP0[0] E4 I/O CP[3] A
GP1
AXR7 / GP1[15] D2 I/O CP[4] A GPIO Bank 1
AXR6 / GP1[14] / MII_TXEN C1 I/O CP[5] A
AXR5 / GP1[13] / MII_TXCLK D3 I/O CP[5] A
AXR4 / GP1[12] / MII_COL D1 I/O CP[5] A
AXR3 / GP1[11] / MII_TXD[3] E3 I/O CP[5] A
AXR2 / GP1[10] / MII_TXD[2] E2 I/O CP[5] A
AXR1 / GP1[9] / MII_TXD[1] E1 I/O CP[5] A
SPI0_CLK / GP1[8] / MII_RXCLK D19 I/O CP[7] A
SPI0_SCS[1] / TM64P0_OUT12 / GP1[7] / MDCLK / TM64P0_IN12 E16 I/O CP[10] A
SPI0_SCS[0] / TM64P1_OUT12 / GP1[6] / MDIO / TM64P1_IN12 D17 I/O CP[10] A
SPI1_SCS[7] / I2C0_SCL / TM64P2_OUT12 / GP1[5] G16 I/O CP[11] A
SPI1_SCS[6] / I2C0_SDA / TM64P3_OUT12 / GP1[4] G18 I/O CP[11] A
SPI1_SCS[5] / UART2_RXD / GP1[3] F17 I/O CP[12] A
SPI1_SCS[4] / UART2_TXD / GP1[2] F16 I/O CP[12] A
SPI1_SCS[3] / UART1_RXD / GP1[1] E18 I/O CP[13] A
SPI1_SCS[2] / UART1_TXD / GP1[0] F19 I/O CP[13] A
GP2
SPI1_SCS[1] / GP2[15] / TM64P2_IN12 F18 I/O CP[14] A GPIO Bank 2
SPI1_SCS[0] / GP2[14] / TM64P3_IN12 E19 I/O CP[14] A
SPI1_CLK / GP2[13] G19 I/O CP[15] A
SPI1_ENA / GP2[12] H16 I/O CP[15] A
SPI1_SOMI / GP2[11] H17 I/O CP[15] A
SPI1_SIMO / GP2[10] G17 I/O CP[15] A
EMA_BA[1] / GP2[9] A15 I/O CP[16] B
EMA_BA[0] / GP2[8] C15 I/O CP[16] B
EMA_CLK / GP2[7] B7 I/O CP[16] B
EMA_SDCKE / GP2[6] D8 I/O CP[16] B
EMA_RAS / GP2[5] A16 I/O CP[16] B
EMA_CAS / GP2[4] A9 I/O CP[16] B
EMA_WEN_DQM[0] / GP2[3] C8 I/O CP[16] B
EMA_WEN_DQM[1] / GP2[2] A5 I/O CP[16] B
EMA_WAIT[1] / GP2[1] B19 I/O CP[16] B
EMA_CS[0] / GP2[0] A18 I/O CP[16] B
GP3
EMA_CS[2] / GP3[15] B17 I/O CP[16] B GPIO Bank 3
EMA_CS[3] / GP3[14] A17 I/O CP[16] B
EMA_CS[4] / GP3[13] F9 I/O CP[16] B
EMA_CS[5] / GP3[12] B16 I/O CP[16] B
EMA_WE / GP3[11] B9 I/O CP[16] B
EMA_OE / GP3[10] B15 I/O CP[16] B
EMA_A_RW / GP3[9] D10 I/O CP[16] B
EMA_WAIT[0] / GP3[8] B18 I/O CP[16] B
EMA_D[15] / GP3[7] E6 I/O CP[17] B
EMA_D[14] / GP3[6] C7 I/O CP[17] B
EMA_D[13] / GP3[5] B6 I/O CP[17] B
EMA_D[12] / GP3[4] A6 I/O CP[17] B
EMA_D[11] / GP3[3] D6 I/O CP[17] B
EMA_D[10] / GP3[2] A7 I/O CP[17] B
EMA_D[9] / GP3[1] D9 I/O CP[17] B
EMA_D[8] / GP3[0] E10 I/O CP[17] B
GP4
EMA_D[7] / GP4[15] D7 I/O CP[17] B GPIO Bank 4
EMA_D[6] / GP4[14] C6 I/O CP[17] B
EMA_D[5] / GP4[13] E7 I/O CP[17] B
EMA_D[4] / GP4[12] B5 I/O CP[17] B
EMA_D[3] / GP4[11] E8 I/O CP[17] B
EMA_D[2] / GP4[10] B8 I/O CP[17] B
EMA_D[1] / GP4[9] A8 I/O CP[17] B
EMA_D[0] / GP4[8] C9 I/O CP[17] B
MMCSD0_CLK / GP4[7] E9 I/O CP[18] B
EMA_A[22] / MMCSD0_CMD / GP4[6] A10 I/O CP[18] B
EMA_A[21] / MMCSD0_DAT[0] / GP4[5] B10 I/O CP[18] B
EMA_A[20] / MMCSD0_DAT[1] / GP4[4] A11 I/O CP[18] B
EMA_A[19] / MMCSD0_DAT[2] / GP4[3] C10 I/O CP[18] B
EMA_A[18] / MMCSD0_DAT[3] / GP4[2] E11 I/O CP[18] B
EMA_A[17] / MMCSD0_DAT[4] / GP4[1] B11 I/O CP[18] B
EMA_A[16] / MMCSD0_DAT[5] / GP4[0] E12 I/O CP[18] B
GP5
EMA_A[15] / MMCSD0_DAT[6] / GP5[15] C11 I/O CP[19] B GPIO Bank 5
EMA_A[14] / MMCSD0_DAT[7] / GP5[14] A12 I/O CP[19] B
EMA_A[13] / GP5[13] D11 I/O CP[19] B
EMA_A[12] / GP5[12] D13 I/O CP[19] B
EMA_A[11] / GP5[11] B12 I/O CP[19] B
EMA_A[10] / GP5[10] C12 I/O CP[19] B
EMA_A[9] / GP5[9] D12 I/O CP[19] B
EMA_A[8] / GP5[8] A13 I/O CP[19] B
EMA_A[7] / GP5[7] B13 I/O CP[20] B
EMA_A[6] / GP5[6] E13 I/O CP[20] B
EMA_A[5] / GP5[5] C13 I/O CP[20] B
EMA_A[4] / GP5[4] A14 I/O CP[20] B
EMA_A[3] / GP5[3] D14 I/O CP[20] B
EMA_A[2] / GP5[2] B14 I/O CP[20] B
EMA_A[1] / GP5[1] D15 I/O CP[20] B
EMA_A[0] / GP5[0] C14 I/O CP[20] B
GP6
RESETOUT / GP6[15] T17 I/O CP[21] C GPIO Bank 6
CLKOUT / GP6[14] T18 I/O CP[22] C
GP6[13] R17 I/O CP[23] C
GP6[12] R16 I/O CP[23] C
GP6[11] U17 I/O CP[24] C
GP6[10] W15 I/O CP[24] C
GP6[9] U16 I/O CP[24] C
GP6[8] T15 I/O CP[24] C
GP6[7] W14 I/O CP[25] C
GP6[6] V15 I/O CP[25] C
GP6[5] P17 I/O CP[27] C
GP6[4] H3 I/O CP[30] C
GP6[3] K3 I/O CP[30] C
GP6[2] J3 I/O CP[30] C
GP6[1] K4 I/O CP[30] C
GP6[0] R5 I/O CP[31] C
GP7
GP7[15] U2 I/O CP[28] C GPIO Bank 7
GP7[14] U1 I/O CP[28] C
GP7[13] V3 I/O CP[28] C
GP7[12] V2 I/O CP[28] C
GP7[11] V1 I/O CP[28] C
GP7[10] W3 I/O CP[28] C
GP7[9] W2 I/O CP[28] C
GP7[8] W1 I/O CP[28] C
GP7[7] / BOOT[7] P4 I/O CP[29] C
GP7[6] / BOOT[6] R3 I/O CP[29] C
GP7[5] / BOOT[5] R2 I/O CP[29] C
GP7[4] / BOOT[4] R1 I/O CP[29] C
GP7[3] / BOOT[3] T3 I/O CP[29] C
GP7[2] / BOOT[2] T2 I/O CP[29] C
GP7[1] / BOOT[1] T1 I/O CP[29] C
GP7[0] / BOOT[0] U3 I/O CP[29] C
GP8
GP8[15] G1 I/O CP30] C GPIO Bank 8
GP8[14] G2 I/O CP[30] C
GP8[13] J4 I/O CP[30] C
GP8[12] G3 I/O CP[30] C
GP8[11] F1 I/O CP[31] C
GP8[10] F2 I/O CP[31] C
GP8[9] H4 I/O CP[31] C
GP8[8] G4 I/O CP[31] C
AXR0 / GP8[7] / MII_TXD[0] F3 I/O CP[6] A
SPI0_SOMI / GP8[6] / MII_RXER C16 I/O CP[7] A
SPI0_SIMO / GP8[5] / MII_CR C18 I/O CP[7] A
SPI0_SCS[5] / UART0_RXD / GP8[4] / MII_RXD[3] C19 I/O CP[8] A
SPI0_SCS[4] / UART0_TXD / GP8[3] / MII_RXD[2] D18 I/O CP[8] A
SPI0_SCS[3] / UART0_CTS / GP8[2] / MII_RXD[1] E17 I/O CP[9] A
SPI0_SCS[2] / UART0_RTS / GP8[1] / MII_RXD[0] D16 I/O CP[9] A
RTCK / GP8[0](5) K17 I/O IPD B
(1) I = Input, O = Output, I/O = Bidirectional, Z = High impedance, PWR = Supply voltage, GND = Ground, A = Analog signal.
Note: The pin type shown refers to the input, output or high-impedance state of the pin function when configured as the signal name highlighted in bold. All multiplexed signals may enter a high-impedance state when the configured function is input-only or the configured function supports high-Z operation. All GPIO signals can be used as input or output. For multiplexed pins where functions have different types (ie., input versus output), the table reflects the pin function direction for that particular peripheral.
(2) IPD = Internal Pulldown resistor; IPU = Internal Pullup resistor; CP[n] = configurable pull-up/pull-down (where n is the pin group) using the PUPDENA and PUPDSEL registers in the System Module. The pull-up and pull-down control of these pins is not active until the device is out of reset. During reset, all of the pins associated with these registers are pulled down. If the application requires a pull-up, an external pull-up can be used. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see the Device Configuration section. For electrical specifications on pullup and internal pulldown circuits, see the Device Operating Conditions section.
(3) This signal is part of a dual-voltage IO group (A, B or C). These groups can be operated at 3.3V or 1.8V nominal. The three groups can be operated at independent voltages but all pins withina group will operate at the same voltage. Group A operates at the voltage of power supply DVDD3318_A. Group B operates at the voltage of power supply DVDD3318_B. Group C operates at the voltage of power supply DVDD3318_C.

3.7.17 Reserved and No Connect

Table 3-19 Reserved and No Connect Terminal Functions

SIGNAL TYPE(1) DESCRIPTION
NAME NO.
RSV2 T19 PWR Reserved. For proper device operation, this pin must be tied either directly to CVDD or left unconnected (do not connect to ground).
NC_J1 J1 — These signals should be left unconnected (do not connect to connect to power or ground).
NC_J2 J2 —
NC_L1 L1 —
NC_L2 L2 —
NC_M2 M2 —
NC_M3 M3 —
NC_M14 M14 —
NC_N1 N1 —
NC_N2 N2 —
NC_N3 N3 —
NC_N4 N4 —
NC_N16 N16 —
NC_P1 P1 —
NC_P2 P2 —
NC_P3 P3 —
NC_P14 P14 —
NC_P15 P15 —
NC_P18 P18 —
NC_P19 P19 —
NC_R15 R15 —
NC_R18 R18 —
NC_R19 R19 —
NC_T16 T16 —
NC_U19 U19 —
NC_V18 V18 —
NC_V19 V19 —
RSVDN J17 I Reserved. For proper device operation, the pin must be pulled up to supply DVDD3318_B.
(1) PWR = Supply voltage.

3.7.18 Supply and Ground

Table 3-20 Supply and Ground Terminal Functions

SIGNAL TYPE(1) DESCRIPTION
NAME NO.
CVDD (Core supply) E15, G7, G8, G13, H6, H7, H10, H11, H12, H13, J6, J12, K6, K12, L12, M8, M9, N8 PWR Variable (1.2V - 1.0V) core supply voltage pins
RVDD (Internal RAM supply) E5, H14, N7 PWR 1.2V internal ram supply voltage pins
DVDD18 (I/O supply) F14, G6, G10, G11, G12, J13, K5, L6, P13, R13 PWR 1.8V I/O supply voltage pins. DVDD18 must be powered even if all of the DVDD3318_x supplies are operated at 3.3V.
DVDD3318_A (I/O supply) F5, F15, G5, G14, G15, H5 PWR 1.8V or 3.3-V dual-voltage LVCMOS I/O supply voltage pins, Group A
DVDD3318_B (I/O supply) E14, F6, F7, F8, F10, F11, F12, F13, G9, J14, K15 PWR 1.8V or 3.3-V dual-voltage LVCMOS I/O supply voltage pins, Group B
DVDD3318_C (I/O supply) J5, K13, L4, L13, M13, N13, P5, P6, P12, R4 PWR 1.8V or 3.3-V dual-voltage LVCMOS I/O supply voltage pins, Group C
VSS (Ground) A19, H1, H2, H8, H9, H15, J7, J8, J9, J10, J11, K1, K2, K7, K8, K9, K10, K11, L3, L5, L7, L8, L9, L10, L11, M1, M4, M5, M6, M7, M10, M11, N5, N11, N12, P11 GND Ground pins.
USB0_VDDA33 N18 PWR USB0 PHY 3.3-V supply
USB0_VDDA18 N14 PWR USB0 PHY 1.8-V supply input
USB0_VDDA12 N17 A USB0 PHY 1.2-V LDO output for bypass cap
USB_CVDD M12 PWR USB0 core logic 1.2-V supply input
DDR_DVDD18 N10, P10, N9, P9, R9, P8, R8, P7, R7, N6 PWR DDR PHY 1.8V power supply pins
(1) PWR = Supply voltage, GND - Ground.

3.8 Unused Pin Configurations

All signals multiplexed with multiple functions may be used as an alternate function if a given peripheral is not used. Unused non-multiplexed signals and some other specific signals should be handled as specified in the tables below.

Table 3-21 Unused USB0 Signal Configurations

SIGNAL NAME Configuration (When USB0 is not used)
USB0_DM No Connect
USB0_DP No Connect
USB0_ID No Connect
USB0_VBUS No Connect
USB0_DRVVBUS No Connect
USB0_VDDA33 No Connect
USB0_VDDA18 No Connect
USB0_VDDA12 Internal USB PHY output connected to an external 0.22-μF filter capacitor
USB_REFCLKIN No Connect or other peripheral function
USB_CVDD 1.2V

Table 3-22 Unused RTC Signal Configuration

SIGNAL NAME Configuration
RTC_XI May be held high (CVDD) or low
RTC_XO No Connect
RTC_ALARM May be used as GPIO or other peripheral function
RTC_CVDD Connect to CVDD
RTC_VSS VSS

Table 3-23 Unused DDR2/mDDR Controller Signal Configuration

SIGNAL NAME Configuration (1)
DDR_D[15:0] No Connect
DDR_A[13:0] No Connect
DDR_CLKP No Connect
DDR_CLKN No Connect
DDR_CKE No Connect
DDR_WE No Connect
DDR_RAS No Connect
DDR_CAS No Connect
DDS_CS No Connect
DDR_DQM[1:0] No Connect
DDR_DQS[1:0] No Connect
DDR_BA[2:0] No Connect
DDR_DQGATE0 No Connect
DDR_DQGATE1 No Connect
DDR_ZP No Connect
DDR_VREF No Connect
DDR_DVDD18 No Connect
(1) The DDR2/mDDR input buffers are enabled by default on device power up and a maximum current draw of 25mA can result on the 1.8V supply. To minimize power consumption, the DDR2/mDDR controller input receivers should be placed in power-down mode by setting VTPIO[14] = 1.