SPRSP65G April   2021  – May 2024 AM2431 , AM2432 , AM2434

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM243x ALV Pin Diagram
      2. 5.1.2 AM243x ALX Pin Diagram
    2. 5.2 Pin Attributes
      1.      13
      2.      14
      3. 5.2.1 AM243x Package Comparison Table (ALV vs. ALX)
    3. 5.3 Signal Descriptions
      1.      17
      2. 5.3.1  AM243x_ALX Package - Unsupported Interfaces and Signals
      3. 5.3.2  ADC
        1.       MAIN Domain Instances
          1.        21
      4. 5.3.3  CPSW
        1.       MAIN Domain Instances
          1.        24
          2.        25
          3.        26
          4.        27
          5. 5.3.3.1.1 CPSW3G IOSETs
      5. 5.3.4  CPTS
        1.       MAIN Domain Instances
          1.        31
          2.        32
      6. 5.3.5  DDRSS
        1.       MAIN Domain Instances
          1.        35
      7. 5.3.6  ECAP
        1.       MAIN Domain Instances
          1.        38
          2.        39
          3.        40
      8. 5.3.7  Emulation and Debug
        1.       MAIN Domain Instances
          1.        43
        2.       MCU Domain Instances
          1.        45
      9. 5.3.8  EPWM
        1.       MAIN Domain Instances
          1.        48
          2.        49
          3.        50
          4.        51
          5.        52
          6.        53
          7.        54
          8.        55
          9.        56
          10.        57
      10. 5.3.9  EQEP
        1.       MAIN Domain Instances
          1.        60
          2.        61
          3.        62
      11. 5.3.10 FSI
        1.       MAIN Domain Instances
          1.        65
          2.        66
          3.        67
          4.        68
          5.        69
          6.        70
          7.        71
          8.        72
      12. 5.3.11 GPIO
        1.       MAIN Domain Instances
          1.        75
          2.        76
        2.       MCU Domain Instances
          1.        78
      13. 5.3.12 GPMC
        1.       MAIN Domain Instances
          1.        81
          2. 5.3.12.1.1 GPMC0 IOSETs (ALV)
      14. 5.3.13 I2C
        1.       MAIN Domain Instances
          1.        85
          2.        86
          3.        87
          4.        88
        2.       MCU Domain Instances
          1.        90
          2.        91
      15. 5.3.14 MCAN
        1.       MAIN Domain Instances
          1.        94
          2.        95
      16. 5.3.15 SPI (MCSPI)
        1.       MAIN Domain Instances
          1.        98
          2.        99
          3.        100
          4.        101
          5.        102
        2.       MCU Domain Instances
          1.        104
          2.        105
      17. 5.3.16 MMC
        1.       MAIN Domain Instances
          1.        108
          2.        109
      18. 5.3.17 OSPI
        1.       MAIN Domain Instances
          1.        112
      19. 5.3.18 Power Supply
        1.       114
      20. 5.3.19 PRU_ICSSG
        1.       MAIN Domain Instances
          1.        117
          2.        118
      21. 5.3.20 Reserved
        1.       120
      22. 5.3.21 SERDES
        1.       MAIN Domain Instances
          1.        123
      23. 5.3.22 System and Miscellaneous
        1. 5.3.22.1 Boot Mode Configuration
          1.        MAIN Domain Instances
            1.         127
        2. 5.3.22.2 Clocking
          1.        MCU Domain Instances
            1.         130
        3. 5.3.22.3 SYSTEM
          1.        MAIN Domain Instances
            1.         133
          2.        MCU Domain Instances
            1.         135
        4. 5.3.22.4 VMON
          1.        137
      24. 5.3.23 TIMER
        1.       MAIN Domain Instances
          1.        140
        2.       MCU Domain Instances
          1.        142
      25. 5.3.24 UART
        1.       MAIN Domain Instances
          1.        145
          2.        146
          3.        147
          4.        148
          5.        149
          6.        150
          7.        151
        2.       MCU Domain Instances
          1.        153
          2.        154
      26. 5.3.25 USB
        1.       MAIN Domain Instances
          1.        157
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Consumption Summary
    7. 6.7  Electrical Characteristics
      1. 6.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.7.4  eMMCPHY Electrical Characteristics
      5. 6.7.5  SDIO Electrical Characteristics
      6. 6.7.6  LVCMOS Electrical Characteristics
      7. 6.7.7  ADC12B Electrical Characteristics (ALV package)
      8. 6.7.8  ADC10B Electrical Characteristics (ALX package)
      9. 6.7.9  USB2PHY Electrical Characteristics
      10. 6.7.10 SerDes PHY Electrical Characteristics
      11. 6.7.11 DDR Electrical Characteristics
    8. 6.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.8.2 Hardware Requirements
      3. 6.8.3 Programming Sequence
      4. 6.8.4 Impact to Your Hardware Warranty
    9. 6.9  Thermal Resistance Characteristics
      1. 6.9.1 Thermal Resistance Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Requirements
        1. 6.10.2.1 Power Supply Slew Rate Requirement
        2. 6.10.2.2 Power Supply Sequencing
          1. 6.10.2.2.1 Power-Up Sequencing
          2. 6.10.2.2.2 Power-Down Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input Clocks / Oscillators
          1. 6.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.10.5 Peripherals
        1. 6.10.5.1  CPSW3G
          1. 6.10.5.1.1 CPSW3G MDIO Timing
          2. 6.10.5.1.2 CPSW3G RMII Timing
          3. 6.10.5.1.3 CPSW3G RGMII Timing
          4. 6.10.5.1.4 CPSW3G IOSETs
        2. 6.10.5.2  DDRSS
        3. 6.10.5.3  ECAP
        4. 6.10.5.4  EPWM
        5. 6.10.5.5  EQEP
        6. 6.10.5.6  FSI
        7. 6.10.5.7  GPIO
        8. 6.10.5.8  GPMC
          1. 6.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 6.10.5.8.4 GPMC0 IOSETs (ALV)
        9. 6.10.5.9  I2C
        10. 6.10.5.10 MCAN
        11. 6.10.5.11 MCSPI
          1. 6.10.5.11.1 MCSPI — Controller Mode
          2. 6.10.5.11.2 MCSPI — Peripheral Mode
        12. 6.10.5.12 MMCSD
          1. 6.10.5.12.1 MMC0 - eMMC Interface
            1. 6.10.5.12.1.1 Legacy SDR Mode
            2. 6.10.5.12.1.2 High Speed SDR Mode
            3. 6.10.5.12.1.3 High Speed DDR Mode
            4. 6.10.5.12.1.4 HS200 Mode
          2. 6.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 6.10.5.12.2.1 Default Speed Mode
            2. 6.10.5.12.2.2 High Speed Mode
            3. 6.10.5.12.2.3 UHS–I SDR12 Mode
            4. 6.10.5.12.2.4 UHS–I SDR25 Mode
            5. 6.10.5.12.2.5 UHS–I SDR50 Mode
            6. 6.10.5.12.2.6 UHS–I DDR50 Mode
            7. 6.10.5.12.2.7 UHS–I SDR104 Mode
        13. 6.10.5.13 CPTS
        14. 6.10.5.14 OSPI
          1. 6.10.5.14.1 OSPI0 PHY Mode
            1. 6.10.5.14.1.1 OSPI0 With PHY Data Training
            2. 6.10.5.14.1.2 OSPI0 Without Data Training
              1. 6.10.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 6.10.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 6.10.5.14.2 OSPI0 Tap Mode
            1. 6.10.5.14.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.14.2.2 OSPI0 Tap DDR Timing
        15. 6.10.5.15 PCIe
        16. 6.10.5.16 PRU_ICSSG
          1. 6.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 6.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 6.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 6.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 6.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 6.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 6.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 6.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 6.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 6.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 6.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 6.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 6.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 6.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 6.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 6.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 6.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 6.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 6.10.5.17 Timers
        18. 6.10.5.18 UART
        19. 6.10.5.19 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem (R5FSS)
      2. 7.2.2 Arm Cortex-M4F (M4FSS)
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 7.4 Other Subsystems
      1. 7.4.1 PDMA Controller
      2. 7.4.2 Peripherals
        1. 7.4.2.1  ADC
        2. 7.4.2.2  DCC
        3. 7.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 7.4.2.4  ECAP
        5. 7.4.2.5  EPWM
        6. 7.4.2.6  ELM
        7. 7.4.2.7  ESM
        8. 7.4.2.8  GPIO
        9. 7.4.2.9  EQEP
        10. 7.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 7.4.2.11 I2C
        12. 7.4.2.12 MCAN
        13. 7.4.2.13 MCRC Controller
        14. 7.4.2.14 MCSPI
        15. 7.4.2.15 MMCSD
        16. 7.4.2.16 OSPI
        17. 7.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 7.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 7.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 7.4.2.20 Dual Mode Timer (DMTIMER)
        21. 7.4.2.21 UART
        22. 7.4.2.22 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 General Routing Guidelines
      2. 8.2.2 DDR Board Design and Layout Guidelines
      3. 8.2.3 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.3.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.3.2 External Board Loopback
        3. 8.2.3.3 DQS (only available in Octal SPI devices)
      4. 8.2.4 USB VBUS Design Guidelines
      5. 8.2.5 System Power Supply Monitor Design Guidelines
      6. 8.2.6 High Speed Differential Signal Routing Guidance
      7. 8.2.7 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
      2. 8.3.2 Oscillator Ground Connection
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
      1. 9.3.1 Information About Cautions and Warnings
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
  • ALX|293
Thermal pad, mechanical data (Package|Pins)
Orderable Information

The following list describes the contents of each column in the Pin Attributes table:

  1. Ball Number: Ball numbers assigned to each terminal of the Ball Grid Array package.

  2. Ball Name: Ball name assigned to each terminal of the Ball Grid Array package (this name is typically taken from the primary MUXMODE 0 signal function).

  3. Signal Name: Signal name of all dedicated and pin multiplexed signal functions associated with a ball.

    Note:

    The Pin Attributes table, defines the SoC pin multiplexed signal function implemented at the pin and does not define secondary multiplexing of signal functions implemented in device subsystems. Secondary multiplexing of signal functions are not described in this table. For more information on secondary multiplexed signal functions, see the respective peripheral chapter of the device TRM.

  4. Mux Mode: The MUXMODE value associated with each pin multiplexed signal function:

    • MUXMODE 0 is the primary pin multiplexed signal function. However, the primary pin multiplexed signal function is not necessarily the default pin multiplexed signal function.
    • MUXMODE values 1 through 15 are possible for pin multiplexed signal functions. However, not all MUXMODE values have been implemented. The only valid MUXMODE values are those defined as pin multiplexed signal functions within the Pin Attributes table. Only valid values of MUXMODE can be used.
    • Bootstrap defines SOC configuration pins, where the logic state applied to each pin is latched on the rising edge of PORz_OUT. These input signal functions are fixed to their respective pins and are not programmable via MUXMODE.
    • An empty box or "-" means Not Applicable.
    Note:
    • The value found in the MUX MODE AFTER RESET column defines the default pin multiplexed signal function selected when MCU_PORz is deasserted.
    • Configuring two pins to the same pin multiplexed signal function can yield unexpected results and is not supported. This can be prevented with proper software configuration.

    • Configuring a pad to an undefined multiplexing mode results in undefined behavior and must be avoided.

  5. Type: Signal type and direction:

    • I = Input

    • O = Output

    • OD = Output, with open-drain output function

    • IO = Input, Output, or simultaneously Input and Output

    • IOD = Input, Output, or simultaneously Input and Output, with open-drain output function

    • IOZ = Input, Output, or simultaneously Input and Output, with three-state output function

    • OZ = Output with three-state output function

    • A = Analog

    • CAP = LDO capacitor

    • PWR = Power

    • GND = Ground

  6. DSIS: The deselected input state (DSIS) indicates the state driven to the subsystem input (logic "0", logic "1", or "pad" level) when the pin multiplexed signal function is not selected by MUXMODE.

    • 0: Logic 0 driven to the subsystem input.
    • 1: Logic 1 driven to the subsystem input.
    • pad: Logic state of the pad is driven to the subsystem input.
    • An empty box, NA, or "-" means Not Applicable.

  7. Ball State During Reset (RX/TX/PULL): State of the terminal while MCU_PORz is asserted, where RX defines the state of the input buffer, TX defines the state of the output buffer, and PULL defines the state of internal pull resistors:

    • RX (Input buffer)
      • Off: The input buffer is disabled.
      • On: The input buffer is enabled.
    • TX (Output buffer)
      • Off: The output buffer is disabled.
      • Low: The output buffer is enabled and drives VOL.
    • PULL (Internal pull resistors)
      • Off: Internal pull resistors are turned off.
      • Up: Internal pull-up resistor is turned on.
      • Down: Internal pull-down resistor is turned on.
      • NA: No internal pull resistor.
    • An empty box, or "-" means Not Applicable.

  8. Ball State After Reset (RX/TX/PULL): State of the terminal after MCU_PORz is deasserted, where RX defines the state of the input buffer, TX defines the state of the output buffer, and PULL defines the state of internal pull resistors:

    • RX (Input buffer)
      • Off: The input buffer is disabled.
      • On: The input buffer is enabled.
    • TX (Output buffer)
      • Off: The output buffer is disabled.
      • SS: The subsystem selected with MUXMODE determines the output buffer state.
    • PULL (Internal pull resistors)
      • Off: Internal pull resistors are turned off.
      • Up: Internal pull-up resistor is turned on.
      • Down: Internal pull-down resistor is turned on.
      • NA: No internal pull resistor.
    • An empty box, NA, or "-" means Not Applicable.

  9. Mux Mode After Reset: The value found in this column defines the default pin multiplexed signal function after MCU_PORz is deasserted.

    • An empty box, NA, or "-" means Not Applicable.

  10. I/O Voltage: This column describes I/O operating voltage options of the respective power supply, when applicable.

    • An empty box, NA, or "-" means Not Applicable.

    For more information, see valid operating voltage range defined for each power supply in Recommended Operating Conditions.

  11. Power: The power supply of the associated I/O, when applicable.

    • An empty box, NA, or "-" means Not Applicable.

  12. Hys: Indicates if the input buffer associated with this I/O has hysteresis:

    • Yes: Hysteresis Support
    • No: No Hysteresis Support
    • An empty box, NA, or "-" means Not Applicable.

    For more information, see the hysteresis values in Electrical Characteristics.

  13. Pull Type: Indicates the presence of an internal pull-up or pull-down resistor. Internal resistors can be enabled or disabled via software.

    • PU: Internal pull-up Only
    • PD: Internal pull-down Only
    • PU/PD: Internal pull-up and pull-down
    • An empty box, NA, or "-" means No internal pull.
    Note:

    Configuring two pins to the same pin multiplexed signal function is not supported as this yields unexpected results. Issues can be easily prevented with the proper software configuration.

    When a pad is set into a multiplexing mode which is not defined by pin multiplexing, that pad’s behavior is undefined. This must be avoided.

  14. Buffer Type: This column defines the buffer type associated with a terminal. This information can be used to determine the applicable Electrical Characteristics table.

    • An empty box, NA, or "-" means Not Applicable.

    For electrical characteristics, refer to the appropriate buffer type table in Electrical Characteristics.

  15. Pad Configuration Register Name: This is the name of the device pad/pin configuration register.

  16. Pad Configuration Register Address: This is the memory address of the device pad/pin configuration register.