SLLS202H may 1995 – august 2023 AM26LV32
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1)(2) | AM26LV32 | |||||
---|---|---|---|---|---|---|
D (SOIC) | DR (SOIC-Reel) | NS (SO) | NSR (SO-Reel) | UNIT | ||
16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 72.9 | 84.6 | 74 | 88.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 32.4 | 43.5 | 31.1 | 46.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 30.4 | 43.2 | 34.8 | 50.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 5.4 | 10.4 | 5.1 | 13.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 30.1 | 42.8 | 34.5 | 50.3 | °C/W |