SLLS849E april   2008  – august 2023 AM26LV32E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ±7-V Common-Mode Range With ±200-mV Sensitivity
      2. 8.3.2 Input Fail-Safe Circuitry
      3. 8.3.3 Active-High and Active-Low
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
  10. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) AM26LV32E UNIT
D (SOIC) DR (SOIC-Reel) PW (TSSOP) PWR (TSSOP-Reel) NS (SOP) NSR (SOP-Reel) RGY (VQFN) RGY (VQFN)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 73.1 84.6 109 107.5 69 88.5 92 48.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.4 43.5 34 38.4 34 46.2 40 46.4 °C/W
RθJB

Junction-to-board thermal resistance

 N/A 43.2 N/A 53.7 N/A 50.7 N/A 24.6 °C/W

ΨJT

 Junction-to-top characterization parameter N/A 10.4 N/A 3.2 N/A 13.5 N/A 2.3 °C/W
ΨJB Junction-to-board characterization parameter N/A 42.8 N/A 53.1 N/A 50.3 N/A 24.5 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A N/A 8.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.