SWRS245B December   2021  – December 2023 AM2732 , AM2732-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM273x ZCE Pin Diagram
      2. 5.1.2 AM273x NZN Pin Diagram
    2. 5.2 Pin Attributes (AM273x ZCE, NZN Packages)
      1.      13
    3. 5.3 Signal Descriptions
      1. 5.3.1  ADC Signal Descriptions
        1.       16
      2. 5.3.2  CPTS Signal Descriptions
        1.       18
      3. 5.3.3  CSI 2.0 Signal Descriptions
        1.       20
      4. 5.3.4  DMM Signal Descriptions
        1.       22
      5. 5.3.5  ECAP Signal Descriptions
        1.       24
      6. 5.3.6  EPWM Signal Descriptions
        1.       26
        2.       27
        3.       28
        4.       29
      7. 5.3.7  GPIO Signal Descriptions
        1.       31
        2.       32
      8. 5.3.8  I2C Signal Descriptions
        1.       34
        2.       35
        3.       36
      9. 5.3.9  Clock Signal Descriptions
        1.       38
        2.       39
      10. 5.3.10 JTAG Signal Descriptions
        1.       41
      11. 5.3.11 LVDS Signal Descriptions
        1.       43
      12. 5.3.12 MCAN Signal Descriptions
        1.       45
        2.       46
      13. 5.3.13 MCASP Signal Descriptions
        1.       48
        2.       49
        3.       50
      14. 5.3.14 Ethernet Signal Descriptions
        1.       52
        2.       53
        3.       54
        4.       55
      15. 5.3.15 GPIO Signal Descriptions
        1.       57
        2.       58
      16. 5.3.16 Power Supply Signal Descriptions
        1.       60
      17. 5.3.17 QSPI Signal Descriptions
        1.       62
      18. 5.3.18 Reserverd Signal Descriptions
        1.       64
      19. 5.3.19 UART Signal Descriptions
        1.       66
        2.       67
      20. 5.3.20 SPI Signal Descriptions
        1.       69
        2.       70
        3.       71
        4.       72
      21. 5.3.21 System Signal Descriptions
        1.       74
      22. 5.3.22 Trace Signal Descriptions
        1.       76
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - Automotive
    3. 6.3  Power-On Hours (POH)
      1. 6.3.1 Automotive Temperature Profile
      2. 6.3.2 Industrial Temperature Profile
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Supply Specifications
    7. 6.7  I/O Buffer Type and Voltage Rail Dependency
    8. 6.8  CPU Specifications
    9. 6.9  Thermal Resistance Characteristics for nFBGA Package [ZCE285A]
    10. 6.10 Thermal Resistance Characteristics for nFBGA Package [NZN225A]
    11. 6.11 Power Consumption Summary
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Power Supply Sequencing and Reset Timing
      2. 6.12.2 Clock Specifications
      3. 6.12.3 Peripheral Information
        1. 6.12.3.1  QSPI Flash Memory Peripheral
          1. 6.12.3.1.1 QSPI Timing Conditions
          2. 6.12.3.1.2 QSPI Timing Requirements
          3. 6.12.3.1.3 QSPI Switching Characteristics
        2. 6.12.3.2  MIBSPI Peripheral
          1. 6.12.3.2.1 SPI Timing Conditions
          2. 6.12.3.2.2 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 6.12.3.2.3 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          4. 6.12.3.2.4 SPI Slave Mode Timing and Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        3. 6.12.3.3  Ethernet Switch (RGMII/RMII/MII) Peripheral
          1. 6.12.3.3.1  RGMII/GMII/MII Timing Conditions
          2. 6.12.3.3.2  RGMII Transmit Clock Switching Characteristics
          3. 6.12.3.3.3  RGMII Transmit Data and Control Switching Characteristics
          4. 6.12.3.3.4  RGMII Recieve Clock Timing Requirements
          5. 6.12.3.3.5  RGMII Recieve Data and Control Timing Requirements
          6. 6.12.3.3.6  RMII Transmit Clock Switching Characteristics
          7. 6.12.3.3.7  RMII Transmit Data and Control Switching Characteristics
          8. 6.12.3.3.8  RMII Receive Clock Timing Requirements
          9. 6.12.3.3.9  RMII Receive Data and Control Timing Requirements
          10. 6.12.3.3.10 MII Transmit Switching Characteristics
          11. 6.12.3.3.11 MII Receive Clock Timing Requirements
          12. 6.12.3.3.12 MII Receive Timing Requirements
          13. 6.12.3.3.13 MII Transmit Clock Timing Requirements
          14. 6.12.3.3.14 MDIO Interface Timings
        4. 6.12.3.4  LVDS/Aurora Instrumentation and Measurement Peripheral
          1. 6.12.3.4.1 LVDS Interface Configuration
          2. 6.12.3.4.2 LVDS Interface Timings
        5. 6.12.3.5  UART Peripheral
          1. 6.12.3.5.1 UART Timing Requirements
        6. 6.12.3.6  I2C Protocol Definition
          1. 6.12.3.6.1 I2C Timing Requirements #GUID-D615B3D8-5F52-430D-93CB-70204118ACE4/T4362547-185
        7. 6.12.3.7  Controller Area Network - Flexible Data-Rate (CAN-FD)
          1. 6.12.3.7.1 Dynamic Characteristics for the CAN-FD TX and RX Pins
        8. 6.12.3.8  CSI-2 Peripheral
        9. 6.12.3.9  General Purpose ADC (GPADC)
        10. 6.12.3.10 Enhanced Pulse-Width Modulator (ePWM)
        11. 6.12.3.11 Enhanced Capture (eCAP)
        12. 6.12.3.12 General-Purpose Input/Output
          1. 6.12.3.12.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-45 #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-50
      4. 6.12.4 Emulation and Debug
        1. 6.12.4.1 Emulation and Debug Description
        2. 6.12.4.2 JTAG Interface
          1. 6.12.4.2.1 Timing Requirements for IEEE 1149.1 JTAG
          2. 6.12.4.2.2 Switching Characteristics for IEEE 1149.1 JTAG
        3. 6.12.4.3 ETM Trace Interface
          1. 6.12.4.3.1 ETM TRACE Timing Requirements
          2. 6.12.4.3.2 ETM TRACE Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Main Subsystem
    3. 7.3 DSP Subsystem
    4. 7.4 Radar Control Subsystem
    5. 7.5 Other Subsystems
      1. 7.5.1 Radar A2D Data Format Over CSI2 Interface
      2. 7.5.2 ADC Channels (Service) for User Application
    6. 7.6 Boot Modes
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Typical Application
      1. 8.1.1 Schematic
      2. 8.1.2 Layout
        1. 8.1.2.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZCE|285
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE
AM2732ADRFGAZCER 285-Pin NFBGA 13.0 mm x 13.0 mm
AM2732CDRFHAZCER 285-Pin NFBGA 13.0 mm x 13.0 mm
AM2732ADRFGQZCERQ1 285-Pin NFBGA 13.0 mm x 13.0 mm
AM2732CDRFHQZCERQ1 285-Pin NFBGA 13.0 mm x 13.0 mm
AM2732CMSFHQNZNRQ1 225-Pin NFBGA 13.0 mm x 13.0 mm
AM2731CLSFHQNZNRQ1 225-Pin NFBGA 13.0 mm x 13.0 mm
AM2731CASFHQNZNRQ1 225-Pin NFBGA 13.0 mm x 13.0 mm
AM2731CNSFHQNZNRQ1 225-Pin NFBGA 13.0 mm x 13.0 mm
(1) For more information, see Section 11.