SWRS245B December   2021  – December 2023 AM2732 , AM2732-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM273x ZCE Pin Diagram
      2. 5.1.2 AM273x NZN Pin Diagram
    2. 5.2 Pin Attributes (AM273x ZCE, NZN Packages)
      1.      13
    3. 5.3 Signal Descriptions
      1. 5.3.1  ADC Signal Descriptions
        1.       16
      2. 5.3.2  CPTS Signal Descriptions
        1.       18
      3. 5.3.3  CSI 2.0 Signal Descriptions
        1.       20
      4. 5.3.4  DMM Signal Descriptions
        1.       22
      5. 5.3.5  ECAP Signal Descriptions
        1.       24
      6. 5.3.6  EPWM Signal Descriptions
        1.       26
        2.       27
        3.       28
        4.       29
      7. 5.3.7  GPIO Signal Descriptions
        1.       31
        2.       32
      8. 5.3.8  I2C Signal Descriptions
        1.       34
        2.       35
        3.       36
      9. 5.3.9  Clock Signal Descriptions
        1.       38
        2.       39
      10. 5.3.10 JTAG Signal Descriptions
        1.       41
      11. 5.3.11 LVDS Signal Descriptions
        1.       43
      12. 5.3.12 MCAN Signal Descriptions
        1.       45
        2.       46
      13. 5.3.13 MCASP Signal Descriptions
        1.       48
        2.       49
        3.       50
      14. 5.3.14 Ethernet Signal Descriptions
        1.       52
        2.       53
        3.       54
        4.       55
      15. 5.3.15 GPIO Signal Descriptions
        1.       57
        2.       58
      16. 5.3.16 Power Supply Signal Descriptions
        1.       60
      17. 5.3.17 QSPI Signal Descriptions
        1.       62
      18. 5.3.18 Reserverd Signal Descriptions
        1.       64
      19. 5.3.19 UART Signal Descriptions
        1.       66
        2.       67
      20. 5.3.20 SPI Signal Descriptions
        1.       69
        2.       70
        3.       71
        4.       72
      21. 5.3.21 System Signal Descriptions
        1.       74
      22. 5.3.22 Trace Signal Descriptions
        1.       76
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - Automotive
    3. 6.3  Power-On Hours (POH)
      1. 6.3.1 Automotive Temperature Profile
      2. 6.3.2 Industrial Temperature Profile
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Supply Specifications
    7. 6.7  I/O Buffer Type and Voltage Rail Dependency
    8. 6.8  CPU Specifications
    9. 6.9  Thermal Resistance Characteristics for nFBGA Package [ZCE285A]
    10. 6.10 Thermal Resistance Characteristics for nFBGA Package [NZN225A]
    11. 6.11 Power Consumption Summary
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Power Supply Sequencing and Reset Timing
      2. 6.12.2 Clock Specifications
      3. 6.12.3 Peripheral Information
        1. 6.12.3.1  QSPI Flash Memory Peripheral
          1. 6.12.3.1.1 QSPI Timing Conditions
          2. 6.12.3.1.2 QSPI Timing Requirements
          3. 6.12.3.1.3 QSPI Switching Characteristics
        2. 6.12.3.2  MIBSPI Peripheral
          1. 6.12.3.2.1 SPI Timing Conditions
          2. 6.12.3.2.2 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 6.12.3.2.3 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          4. 6.12.3.2.4 SPI Slave Mode Timing and Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        3. 6.12.3.3  Ethernet Switch (RGMII/RMII/MII) Peripheral
          1. 6.12.3.3.1  RGMII/GMII/MII Timing Conditions
          2. 6.12.3.3.2  RGMII Transmit Clock Switching Characteristics
          3. 6.12.3.3.3  RGMII Transmit Data and Control Switching Characteristics
          4. 6.12.3.3.4  RGMII Recieve Clock Timing Requirements
          5. 6.12.3.3.5  RGMII Recieve Data and Control Timing Requirements
          6. 6.12.3.3.6  RMII Transmit Clock Switching Characteristics
          7. 6.12.3.3.7  RMII Transmit Data and Control Switching Characteristics
          8. 6.12.3.3.8  RMII Receive Clock Timing Requirements
          9. 6.12.3.3.9  RMII Receive Data and Control Timing Requirements
          10. 6.12.3.3.10 MII Transmit Switching Characteristics
          11. 6.12.3.3.11 MII Receive Clock Timing Requirements
          12. 6.12.3.3.12 MII Receive Timing Requirements
          13. 6.12.3.3.13 MII Transmit Clock Timing Requirements
          14. 6.12.3.3.14 MDIO Interface Timings
        4. 6.12.3.4  LVDS/Aurora Instrumentation and Measurement Peripheral
          1. 6.12.3.4.1 LVDS Interface Configuration
          2. 6.12.3.4.2 LVDS Interface Timings
        5. 6.12.3.5  UART Peripheral
          1. 6.12.3.5.1 UART Timing Requirements
        6. 6.12.3.6  I2C Protocol Definition
          1. 6.12.3.6.1 I2C Timing Requirements #GUID-D615B3D8-5F52-430D-93CB-70204118ACE4/T4362547-185
        7. 6.12.3.7  Controller Area Network - Flexible Data-Rate (CAN-FD)
          1. 6.12.3.7.1 Dynamic Characteristics for the CAN-FD TX and RX Pins
        8. 6.12.3.8  CSI-2 Peripheral
        9. 6.12.3.9  General Purpose ADC (GPADC)
        10. 6.12.3.10 Enhanced Pulse-Width Modulator (ePWM)
        11. 6.12.3.11 Enhanced Capture (eCAP)
        12. 6.12.3.12 General-Purpose Input/Output
          1. 6.12.3.12.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-45 #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-50
      4. 6.12.4 Emulation and Debug
        1. 6.12.4.1 Emulation and Debug Description
        2. 6.12.4.2 JTAG Interface
          1. 6.12.4.2.1 Timing Requirements for IEEE 1149.1 JTAG
          2. 6.12.4.2.2 Switching Characteristics for IEEE 1149.1 JTAG
        3. 6.12.4.3 ETM Trace Interface
          1. 6.12.4.3.1 ETM TRACE Timing Requirements
          2. 6.12.4.3.2 ETM TRACE Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Main Subsystem
    3. 7.3 DSP Subsystem
    4. 7.4 Radar Control Subsystem
    5. 7.5 Other Subsystems
      1. 7.5.1 Radar A2D Data Format Over CSI2 Interface
      2. 7.5.2 ADC Channels (Service) for User Application
    6. 7.6 Boot Modes
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Typical Application
      1. 8.1.1 Schematic
      2. 8.1.2 Layout
        1. 8.1.2.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZCE|285
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Pin Connectivity Requirements

This section describes connectivity requirements for package balls that have specific connectivity requirements and unused package balls.

Note:

All power balls must be supplied with the voltages specified in the Recommended Operating Conditions section, unless otherwise specified.

Note:

For additional clarification, "leave unconnected" or "no connect" (NC) means no signal traces can be connected to these device ball numbers.

Note: See associated AM273x Hardware Design Guide for further details and design context.
Table 5-42 Connectivity Requirements - AM273x ZCE Package
BALL NUMBER BALL NAME CONNECTION REQUIREMENTS
V1 CLKP Crystal oscillator excitation output. Can be attached to external crystal terminal or driven with 1.8 V oscillator output.
U1 CLKM Crystal oscillator excitation input. Can be attached to external crystal terminal. If an external 1.8 V oscillator is used to drive the CLKP pin, this CLKM pin should be attached to VSS. Recommend attaching through pull-down resistor.
T1 VBGAP Should be attached to external 0.047 uF capacitor for proper bandgap voltage operation.
N18, N17, J3, T8 VNWA, VDD_SRAM_1, VDD_SRAM_2, VDD_SRAM_3 All of these power pins must be shorted to common VDD 1.2 V core supply net and provided separate decoupling capacitance on the PCB.
U9 VPP Should be connected to valid e-fuse programming voltage source, or routed to connector. If unused, this should be completely disconnected on the PCB.
K1, L1, L3 WARM_RESET, NERROR_OUT and NERROR_IN WARM_RESET, NERROR_OUT and NERROR_IN are implemented as fail-safe, open-drain I/O. These pins require separate, external pull-up resistor to VIOIN to function correctly.
P4, N3 RESERVED1, RESERVED2 Reserved signals. Should be shorted to VSS.
Table 5-43 Connectivity Requirements - AM273x NZN Package
BALL NUMBER BALL NAME CONNECTION REQUIREMENTS
P1 CLKP Crystal oscillator excitation output. Can be attached to external crystal terminal or driven with 1.8 V oscillator output.
N1 CLKM Crystal oscillator excitation input. Can be attached to external crystal terminal. If an external 1.8 V oscillator is used to drive the CLKP pin, this CLKM pin should be attached to VSS. Recommend attaching through pull-down resistor.
M1 VBGAP Should be attached to external 0.047 uF capacitor for proper bandgap voltage operation.
L13, K14, G3, M6 VNWA, VDD_SRAM_1, VDD_SRAM_2, VDD_SRAM_3 All of these power pins must be shorted to common VDD 1.2 V core supply net and provided separate decoupling capacitance on the PCB.
N7 VPP Should be connected to valid e-fuse programming voltage source, or routed to connector. If unused, this should be completely disconnected on the PCB.
H3, H1, H2 WARM_RESET, NERROR_OUT and NERROR_IN WARM_RESET, NERROR_OUT and NERROR_IN are implemented as fail-safe, open-drain I/O. These pins require separate, external pull-up resistor to VIOIN to function correctly.
L3, K3 RESERVED1, RESERVED2 Reserved signals. Should be shorted to VSS.

Note:

Internal pull resistors are weak and may not source enough current to maintain a valid logic level for some operating conditions. This can be the case when connected to components with leakage to the opposite logic level, or when external noise sources couple to signal traces attached to balls which are only pulled to a valid logic level by the internal resistor. Therefore, external pull resistors are recommended to hold a valid logic level on balls with external connections.

Many of the device IOs are turned off by default and external pull resistors may be required to hold inputs of any attached device in a valid logic state until software initializes the respective IOs. The state of configurable device IOs are defined in the BALL STATE DURING RESET RX/TX/PULL and BALL STATE AFTER RESET RX/TX/PULL columns of the Pin Attributes table. Any IO with its input buffer (RX) turned off is allowed to float without damaging the device. However, any IO with its input buffer (RX) turned on shall never be allowed to float to any potential between VILSS and VIHSS. The input buffer can enter a high-current state which could damage the IO cell if allowed to float between these levels.