SLUSC35B April   2015  – April 2019 AM3358-EP

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Features
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
      1. 4.1.1 GCZ Package Pin Maps (Top View)
        1.       GCZ Pin Map [Section Left - Top View]
        2.       GCZ Pin Map [Section Middle - Top View]
        3.       GCZ Pin Map [Section Right - Top View]
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. 4.3.1 External Memory Interfaces
      2. 4.3.2 General Purpose IOs
      3. 4.3.3 Miscellaneous
        1. 4.3.3.1 eCAP
        2. 4.3.3.2 eHRPWM
        3. 4.3.3.3 eQEP
        4. 4.3.3.4 Timer
      4. 4.3.4 PRU-ICSS
        1. 4.3.4.1 PRU0
        2. 4.3.4.2 PRU1
      5. 4.3.5 Removable Media Interfaces
      6. 4.3.6 Serial Communication Interfaces
        1. 4.3.6.1 CAN
        2. 4.3.6.2 GEMAC_CPSW
        3. 4.3.6.3 I2C
        4. 4.3.6.4 McASP
        5. 4.3.6.5 SPI
        6. 4.3.6.6 UART
        7. 4.3.6.7 USB
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Operating Performance Points (OPPs)
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Power Consumption Summary
    7. 5.7  DC Electrical Characteristics
    8. 5.8  Thermal Resistance Characteristics for GCZ Package
    9. 5.9  External Capacitors
      1. 5.9.1 Voltage Decoupling Capacitors
        1. 5.9.1.1 Core Voltage Decoupling Capacitors
        2. 5.9.1.2 I/O and Analog Voltage Decoupling Capacitors
      2. 5.9.2 Output Capacitors
    10. 5.10 Touch Screen Controller and Analog-to-Digital Subsystem Electrical Parameters
  6. 6Power and Clocking
    1. 6.1 Power Supplies
      1. 6.1.1 Power Supply Slew Rate Requirement
      2. 6.1.2 Power-Down Sequencing
      3. 6.1.3 VDD_MPU_MON Connections
      4. 6.1.4 Digital Phase-Locked Loop Power Supply Requirements
    2. 6.2 Clock Specifications
      1. 6.2.1 Input Clock Specifications
      2. 6.2.2 Input Clock Requirements
        1. 6.2.2.1 OSC0 Internal Oscillator Clock Source
          1. Table 6-2 OSC0 Crystal Circuit Requirements
          2. Table 6-3 OSC0 Crystal Circuit Characteristics
        2. 6.2.2.2 OSC0 LVCMOS Digital Clock Source
        3. 6.2.2.3 OSC1 Internal Oscillator Clock Source
          1. Table 6-5 OSC1 Crystal Circuit Requirements
          2. Table 6-6 OSC1 Crystal Circuit Characteristics
        4. 6.2.2.4 OSC1 LVCMOS Digital Clock Source
        5. 6.2.2.5 OSC1 Not Used
      3. 6.2.3 Output Clock Specifications
      4. 6.2.4 Output Clock Characteristics
        1. 6.2.4.1 CLKOUT1
        2. 6.2.4.2 CLKOUT2
  7. 7Peripheral Information and Timings
    1. 7.1  Parameter Information
      1. 7.1.1 Timing Parameters and Board Routing Analysis
    2. 7.2  Recommended Clock and Control Signal Transition Behavior
    3. 7.3  OPP50 Support
    4. 7.4  Controller Area Network (CAN)
      1. 7.4.1 DCAN Electrical Data and Timing
        1. Table 7-1 DCAN Timing Conditions
        2. Table 7-2 Timing Requirements for DCANx Receive
        3. Table 7-3 Switching Characteristics for DCANx Transmit
    5. 7.5  DMTimer
      1. 7.5.1 DMTimer Electrical Data and Timing
        1. Table 7-4 DMTimer Timing Conditions
        2. Table 7-5 Timing Requirements for DMTimer [1-7]
        3. Table 7-6 Switching Characteristics for DMTimer [4-7]
    6. 7.6  Ethernet Media Access Controller (EMAC) and Switch
      1. 7.6.1 EMAC and Switch Electrical Data and Timing
        1. Table 7-7 EMAC and Switch Timing Conditions
        2. 7.6.1.1   EMAC/Switch MDIO Electrical Data and Timing
          1. Table 7-8  Timing Requirements for MDIO_DATA
          2. Table 7-9  Switching Characteristics for MDIO_CLK
          3. Table 7-10 Switching Characteristics for MDIO_DATA
        3. 7.6.1.2   EMAC and Switch MII Electrical Data and Timing
          1. Table 7-11 Timing Requirements for GMII[x]_RXCLK - MII Mode
          2. Table 7-12 Timing Requirements for GMII[x]_TXCLK - MII Mode
          3. Table 7-13 Timing Requirements for GMII[x]_RXD[3:0], GMII[x]_RXDV, and GMII[x]_RXER - MII Mode
          4. Table 7-14 Switching Characteristics for GMII[x]_TXD[3:0], and GMII[x]_TXEN - MII Mode
        4. 7.6.1.3   EMAC and Switch RMII Electrical Data and Timing
          1. Table 7-15 Timing Requirements for RMII[x]_REFCLK - RMII Mode
          2. Table 7-16 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER - RMII Mode
          3. Table 7-17 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN - RMII Mode
        5. 7.6.1.4   EMAC and Switch RGMII Electrical Data and Timing
          1. Table 7-18 Timing Requirements for RGMII[x]_RCLK - RGMII Mode
          2. Table 7-19 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL - RGMII Mode
          3. Table 7-20 Switching Characteristics for RGMII[x]_TCLK - RGMII Mode
          4. Table 7-21 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL - RGMII Mode
    7. 7.7  External Memory Interfaces
      1. 7.7.1 General-Purpose Memory Controller (GPMC)
        1. 7.7.1.1 GPMC and NOR Flash—Synchronous Mode
          1. Table 7-22 GPMC and NOR Flash Timing Conditions—Synchronous Mode
          2. Table 7-23 GPMC and NOR Flash Timing Requirements—Synchronous Mode
          3. Table 7-24 GPMC and NOR Flash Switching Characteristics—Synchronous Mode
        2. 7.7.1.2 GPMC and NOR Flash—Asynchronous Mode
          1. Table 7-25 GPMC and NOR Flash Timing Conditions—Asynchronous Mode
          2. Table 7-26 GPMC and NOR Flash Internal Timing Requirements—Asynchronous Mode
          3. Table 7-27 GPMC and NOR Flash Timing Requirements—Asynchronous Mode
          4. Table 7-28 GPMC and NOR Flash Switching Characteristics—Asynchronous Mode
        3. 7.7.1.3 GPMC and NAND Flash—Asynchronous Mode
          1. Table 7-29 GPMC and NAND Flash Timing Conditions—Asynchronous Mode
          2. Table 7-30 GPMC and NAND Flash Internal Timing Requirements—Asynchronous Mode
          3. Table 7-31 GPMC and NAND Flash Timing Requirements—Asynchronous Mode
          4. Table 7-32 GPMC and NAND Flash Switching Characteristics—Asynchronous Mode
      2. 7.7.2 mDDR(LPDDR), DDR2, DDR3, DDR3L Memory Interface
        1. 7.7.2.1 mDDR (LPDDR) Routing Guidelines
          1. 7.7.2.1.1 Board Designs
          2. 7.7.2.1.2 LPDDR Interface
            1. 7.7.2.1.2.1 LPDDR Interface Schematic
            2. 7.7.2.1.2.2 Compatible JEDEC LPDDR Devices
              1. Table 7-34 Compatible JEDEC LPDDR Devices (Per Interface)
            3. 7.7.2.1.2.3 PCB Stackup
            4. 7.7.2.1.2.4 Placement
            5. 7.7.2.1.2.5 LPDDR Keepout Region
            6. 7.7.2.1.2.6 Bulk Bypass Capacitors
            7. 7.7.2.1.2.7 High-Speed Bypass Capacitors
            8. 7.7.2.1.2.8 Net Classes
            9. 7.7.2.1.2.9 LPDDR Signal Termination
          3. 7.7.2.1.3 LPDDR CK and ADDR_CTRL Routing
        2. 7.7.2.2 DDR2 Routing Guidelines
          1. 7.7.2.2.1 Board Designs
          2. 7.7.2.2.2 DDR2 Interface
            1. 7.7.2.2.2.1  DDR2 Interface Schematic
            2. 7.7.2.2.2.2  Compatible JEDEC DDR2 Devices
              1. Table 7-46 Compatible JEDEC DDR2 Devices (Per Interface)
            3. 7.7.2.2.2.3  PCB Stackup
            4. 7.7.2.2.2.4  Placement
            5. 7.7.2.2.2.5  DDR2 Keepout Region
            6. 7.7.2.2.2.6  Bulk Bypass Capacitors
            7. 7.7.2.2.2.7  High-Speed (HS) Bypass Capacitors
            8. 7.7.2.2.2.8  Net Classes
            9. 7.7.2.2.2.9  DDR2 Signal Termination
            10. 7.7.2.2.2.10 DDR_VREF Routing
          3. 7.7.2.2.3 DDR2 CK and ADDR_CTRL Routing
        3. 7.7.2.3 DDR3 and DDR3L Routing Guidelines
          1. 7.7.2.3.1 Board Designs
            1. 7.7.2.3.1.1 DDR3 versus DDR2
          2. 7.7.2.3.2 DDR3 Device Combinations
          3. 7.7.2.3.3 DDR3 Interface
            1. 7.7.2.3.3.1  DDR3 Interface Schematic
            2. 7.7.2.3.3.2  Compatible JEDEC DDR3 Devices
            3. 7.7.2.3.3.3  PCB Stackup
            4. 7.7.2.3.3.4  Placement
            5. 7.7.2.3.3.5  DDR3 Keepout Region
            6. 7.7.2.3.3.6  Bulk Bypass Capacitors
            7. 7.7.2.3.3.7  High-Speed Bypass Capacitors
              1. 7.7.2.3.3.7.1 Return Current Bypass Capacitors
            8. 7.7.2.3.3.8  Net Classes
            9. 7.7.2.3.3.9  DDR3 Signal Termination
            10. 7.7.2.3.3.10 DDR_VREF Routing
            11. 7.7.2.3.3.11 VTT
          4. 7.7.2.3.4 DDR3 CK and ADDR_CTRL Topologies and Routing Definition
            1. 7.7.2.3.4.1 Two DDR3 Devices
              1. 7.7.2.3.4.1.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
              2. 7.7.2.3.4.1.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
            2. 7.7.2.3.4.2 One DDR3 Device
              1. 7.7.2.3.4.2.1 CK and ADDR_CTRL Topologies, One DDR3 Device
              2. 7.7.2.3.4.2.2 CK and ADDR_CTRL Routing, One DDR3 Device
          5. 7.7.2.3.5 Data Topologies and Routing Definition
            1. 7.7.2.3.5.1 DQS[x] and DQ[x] Topologies, Any Number of Allowed DDR3 Devices
            2. 7.7.2.3.5.2 DQS[x] and DQ[x] Routing, Any Number of Allowed DDR3 Devices
          6. 7.7.2.3.6 Routing Specification
            1. 7.7.2.3.6.1 CK and ADDR_CTRL Routing Specification
            2. 7.7.2.3.6.2 DQS[x] and DQ[x] Routing Specification
    8. 7.8  I2C
      1. 7.8.1 I2C Electrical Data and Timing
        1. Table 7-70 I2C Timing Conditions – Slave Mode
        2. Table 7-71 Timing Requirements for I2C Input Timings
        3. Table 7-72 Switching Characteristics for I2C Output Timings
    9. 7.9  JTAG Electrical Data and Timing
      1. Table 7-73 JTAG Timing Conditions
      2. Table 7-74 Timing Requirements for JTAG
      3. Table 7-75 Switching Characteristics for JTAG
    10. 7.10 LCD Controller (LCDC)
      1. Table 7-76 LCD Controller Timing Conditions
      2. 7.10.1     LCD Interface Display Driver (LIDD Mode)
        1. Table 7-77 Timing Requirements for LCD LIDD Mode
        2. Table 7-78 Switching Characteristics for LCD LIDD Mode
      3. 7.10.2     LCD Raster Mode
        1. Table 7-79 Switching Characteristics for LCD Raster Mode
    11. 7.11 Multichannel Audio Serial Port (McASP)
      1. 7.11.1 McASP Device-Specific Information
      2. 7.11.2 McASP Electrical Data and Timing
        1. Table 7-80 McASP Timing Conditions
        2. Table 7-81 Timing Requirements for McASP
        3. Table 7-82 Switching Characteristics for McASP
    12. 7.12 Multichannel Serial Port Interface (McSPI)
      1. 7.12.1 McSPI Electrical Data and Timing
        1. 7.12.1.1 McSPI—Slave Mode
          1. Table 7-83 McSPI Timing Conditions – Slave Mode
          2. Table 7-84 Timing Requirements for McSPI Input Timings—Slave Mode
          3. Table 7-85 Switching Characteristics for McSPI Output Timings—Slave Mode
        2. 7.12.1.2 McSPI—Master Mode
          1. Table 7-86 McSPI Timing Conditions – Master Mode
          2. Table 7-87 Timing Requirements for McSPI Input Timings – Master Mode
          3. Table 7-88 Switching Characteristics for McSPI Output Timings – Master Mode
    13. 7.13 Multimedia Card (MMC) Interface
      1. 7.13.1 MMC Electrical Data and Timing
        1. Table 7-89 MMC Timing Conditions
        2. Table 7-90 Timing Requirements for MMC[x]_CMD and MMC[x]_DAT[7:0]
        3. Table 7-91 Switching Characteristics for MMC[x]_CLK
        4. Table 7-92 Switching Characteristics for MMC[x]_CMD and MMC[x]_DAT[7:0]—Standard Mode
        5. Table 7-93 Switching Characteristics for MMC[x]_CMD and MMC[x]_DAT[7:0]—High-Speed Mode
    14. 7.14 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      1. 7.14.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. Table 7-94 PRU-ICSS PRU Timing Conditions
        2. 7.14.1.1   PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
          1. Table 7-95 PRU-ICSS PRU Timing Requirements - Direct Input Mode
          2. Table 7-96 PRU-ICSS PRU Switching Requirements – Direct Output Mode
        3. 7.14.1.2   PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
          1. Table 7-97 PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
        4. 7.14.1.3   PRU-ICSS PRU Shift Mode Electrical Data and Timing
          1. Table 7-98 PRU-ICSS PRU Timing Requirements – Shift In Mode
          2. Table 7-99 PRU-ICSS PRU Switching Requirements - Shift Out Mode
      2. 7.14.2 PRU-ICSS MII_RT and Switch
        1. Table 7-100 PRU-ICSS MII_RT Switch Timing Conditions
        2. 7.14.2.1    PRU-ICSS MDIO Electrical Data and Timing
          1. Table 7-101 PRU-ICSS MDIO Timing Requirements – MDIO_DATA
          2. Table 7-102 PRU-ICSS MDIO Switching Characteristics - MDIO_CLK
          3. Table 7-103 PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
        3. 7.14.2.2    PRU-ICSS MII_RT Electrical Data and Timing
          1. Table 7-104 PRU-ICSS MII_RT Timing Requirements – MII_RXCLK
          2. Table 7-105 PRU-ICSS MII_RT Timing Requirements - MII[x]_TXCLK
          3. Table 7-106 PRU-ICSS MII_RT Timing Requirements - MII_RXD[3:0], MII_RXDV, and MII_RXER
          4. Table 7-107 PRU-ICSS MII_RT Switching Characteristics - MII_TXD[3:0] and MII_TXEN
      3. 7.14.3 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
        1. Table 7-108 UART Timing Conditions
        2. Table 7-109 Timing Requirements for PRU-ICSS UART Receive
        3. Table 7-110 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
    15. 7.15 Universal Asynchronous Receiver Transmitter (UART)
      1. 7.15.1 UART Electrical Data and Timing
        1. Table 7-111 Timing Requirements for UARTx Receive
        2. Table 7-112 Switching Characteristics for UARTx Transmit
      2. 7.15.2 UART IrDA Interface
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Via Channel
    2. 9.2 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1.1 Features

  • Up to 800-MHz Sitara™ARM®Cortex®-A8 32‑bit RISC processor
    • NEON™ SIMD coprocessor
    • 32KB of L1 instruction and 32KB of data cache with single-error detection (parity)
    • 256KB of L2 cache with error correcting code (ECC)
    • 176KB of on-chip boot ROM
    • 64KB of dedicated RAM
    • Emulation and debug - JTAG
    • Interrupt controller (up to 128 interrupt requests)
  • On-chip memory (shared L3 RAM)
    • 64KB of general-purpose on-chip memory controller (OCMC) RAM
    • Accessible to all masters
    • Supports retention for fast wakeup
  • External memory interfaces (EMIF)
    • mDDR(LPDDR), DDR2, DDR3, DDR3L controller:
      • mDDR: 200-MHz clock (400-MHz data rate)
      • DDR2: 266-MHz clock (532-MHz data rate)
      • DDR3: 400-MHz clock (800-MHz data rate)
      • DDR3L: 400-MHz clock (800-MHz data rate)
      • 16-bit data bus
      • 1GB of total addressable space
      • Supports one x16 or two x8 memory device configurations
    • General-purpose memory controller (GPMC)
      • Flexible 8-bit and 16-bit asynchronous memory interface with up to seven chip selects (NAND, NOR, Muxed-NOR, SRAM)
      • Uses BCH code to support 4-, 8-, or 16-bit ECC
      • Uses hamming code to support 1-bit ECC
    • Error locator module (ELM)
      • Used in conjunction with the GPMC to locate addresses of data errors from syndrome polynomials generated using a BCH algorithm
      • Supports 4-, 8-, and 16-bit per 512-byte block error location based on BCH algorithms
  • Programmable real-time unit subsystem and industrial communication sSubsystem (PRU-ICSS)
    • Supports protocols such as PROFIBUS, PROFINET, EtherNet/IP™, and more
    • Two programmable real-time units (PRUs)
      • 32-bit load/store RISC processor capable of running at 200 MHz
      • 8KB of instruction RAM with single-error detection (parity)
      • 8KB of data RAM with single-error detection (parity)
      • Single-cycle 32-bit multiplier with 64-bit accumulator
      • Enhanced GPIO module provides shift-in/out support and parallel latch on external signal
    • 12KB of shared RAM with single-error detection (parity)
    • Three 120-byte register banks accessible by each PRU
    • Interrupt controller (INTC) for handling system input events
    • Local interconnect bus for connecting internal and external masters to the resources inside the PRU-ICSS
    • Peripherals inside the PRU-ICSS:
      • One UART port with flow control pins, supports up to 12 Mbps
      • One enhanced capture (eCAP) module
      • Two MII Ethernet ports that support industrial ethernet
      • One MDIO port
  • Power, reset, and clock management (PRCM) module
    • Controls the entry and exit of stand-by and deep-sleep modes
    • Responsible for sleep sequencing, power domain switch-off sequencing, wake-up sequencing, and power domain switch-on sequencing
    • Clocks
      • Integrated 15- to 35-MHz high-frequency oscillator used to generate a reference clock for various system and peripheral clocks
      • Supports individual clock enable and disable control for subsystems and peripherals to facilitate reduced power consumption
      • Five ADPLLs to generate system clocks (MPU subsystem, DDR interface, USB and peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], LCD pixel clock)
    • Power
      • Two nonswitchable power domains (real-time clock [RTC], wake-up logic [WAKEUP])
      • Three switchable power domains (MPU subsystem [MPU], SGX530 [GFX], peripherals and infrastructure [PER])
      • Implements SmartReflex™ class 2B for core voltage scaling based on die temperature, process variation, and performance (adaptive voltage scaling [AVS])
      • Dynamic voltage frequency scaling (DVFS)
  • Real-time clock (RTC)
    • Real-time date (Day-Month-Year-Day of Week) and time (Hours-Minutes-Seconds) information
    • Internal 32.768-kHz oscillator, RTC logic and 1.1-V internal LDO
    • Independent power-on-reset (RTC_PWRONRSTn) input
    • Dedicated input pin (EXT_WAKEUP) for external wake events
    • Programmable alarm can be used to generate internal interrupts to the PRCM (for wakeup) or Cortex-A8 (for event notification)
    • Programmable alarm can be used with external output (PMIC_POWER_EN) to enable the power management IC to restore non-RTC power domains
  • Peripherals
    • Up to two USB 2.0 High-Speed DRD (Dual-Role Device) ports with integrated PHY
    • Up to two industrial gigabit ethernet MACs (10, 100, 1000 Mbps)
      • Integrated switch
      • Each MAC supports MII, RMII, RGMII, and MDIO interfaces
      • Ethernet MACs and switch can operate independent of other functions
      • IEEE 1588v2 precision time protocol (PTP)
    • Up to two controller-area network (CAN) ports
      • Supports CAN version 2 parts A and B
    • Up to two multichannel audio serial ports (McASPs)
      • Transmit and receive clocks up to 50 MHz
      • Up to four serial data pins per McASP port with independent TX and RX clocks
      • Supports time division multiplexing (TDM), inter-IC sound (I2S), and similar formats
      • Supports digital audio interface transmission (SPDIF, IEC60958-1, and AES-3 formats)
      • FIFO buffers for transmit and receive (256 bytes)
    • Up to six UARTs
      • All UARTs support IrDA and CIR modes
      • All UARTs support RTS and CTS flow control
      • UART1 supports full modem control
    • Up to two master and slave McSPI serial interfaces
      • Up to two chip selects
      • Up to 48 MHz
    • Up to three MMC, SD, SDIO ports
      • 1-, 4-, and 8-bit MMC, SD, SDIO modes
      • MMCSD0 has dedicated power rail for 1.8‑V or 3.3-V operation
      • Up to 48-MHz data transfer rate
      • Supports card detect and write protect
      • Complies with MMC4.3, SD, SDIO 2.0 specifications
    • Up to three I2C master and slave interfaces
      • Standard mode (up to 100 kHz)
      • Fast mode (up to 400 kHz)
    • Up to four banks of general-purpose I/O (GPIO) pins
      • 32 GPIO pins per bank (multiplexed with other functional pins)
      • GPIO pins can be used as interrupt inputs (up to two interrupt inputs per bank)
    • Up to three external DMA event inputs that can also be used as interrupt inputs
    • Eight 32-bit general-purpose timers
      • DMTIMER1 is a 1-ms timer used for operating system (OS) ticks
      • DMTIMER4–DMTIMER7 are pinned out
    • One watchdog timer
    • SGX530 3D graphics engine
      • Tile-based architecture delivering up to 20 million polygons per second
      • Universal scalable shader engine (USSE) is a multithreaded engine incorporating pixel and vertex shader functionality
      • Advanced shader feature set in excess of Microsoft VS3.0, PS3.0, and OGL2.0
      • Industry standard API support of Direct3D mobile, OGL-ES 1.1 and 2.0, and OpenMax
      • Fine-grained task switching, load balancing, and power management
      • Advanced geometry DMA-driven operation for minimum CPU interaction
      • Programmable high-quality image anti-aliasing
      • Fully virtualized memory addressing for OS operation in a unified memory architecture
    • LCD controller
      • Up to 24-bit data output; 8 bits per pixel (RGB)
      • Resolution up to 2048 × 2048 (with maximum 126-MHz pixel clock)
      • Integrated LCD interface display driver (LIDD) controller
      • Integrated raster controller
      • Integrated DMA engine to pull data from the external frame buffer without burdening the processor via interrupts or a firmware timer
      • 512-word deep internal FIFO
      • Supported display types:
        • Character displays - uses LIDD controller to program these displays
        • Passive matrix LCD displays - uses LCD raster display controller to provide timing and data for constant graphics refresh to a passive display
        • Active matrix LCD displays - uses external frame buffer space and the internal DMA engine to drive streaming data to the panel
    • 12-bit successive approximation register (SAR) ADC
      • 200K samples per second
      • Input can be selected from any of the eight analog inputs multiplexed through an 8:1 analog switch
      • Can be configured to operate as a 4-Wire, 5-Wire, or 8-Wire resistive touch screen controller (TSC) interface
    • Up to three 32-bit eCAP modules
      • Configurable as three capture inputs or three auxiliary PWM outputs
    • Up to three enhanced high-resolution PWM modules (eHRPWMs)
      • Dedicated 16-bit time-base counter with time and frequency controls
      • Configurable as six single-ended, six dual-edge symmetric, or three dual-edge asymmetric outputs
    • Up to three 32-bit enhanced quadrature encoder pulse (eQEP) modules
  • Device identification
    • Contains electrical fuse farm (FuseFarm) of which some bits are factory programmable
      • Production ID
      • Device part number (unique JTAG ID)
      • Device revision (readable by host ARM)
  • Debug interface support
    • JTAG and cJTAG for ARM (Cortex-A8 and PRCM)
    • Supports device boundary scan
    • Supports IEEE 1500
  • DMA
    • On-chip enhanced DMA controller (EDMA) has three third-party transfer controllers (TPTCs) and one third-party channel controller (TPCC), which supports up to 64 programmable logical channels and eight QDMA channels. EDMA is used for:
      • Transfers to and from on-chip memories
      • Transfers to and from external storage (EMIF, GPMC, slave peripherals)
  • Inter-processor communication (IPC)
    • Integrates hardware-based mailbox for IPC and spinlock for process synchronization between Cortex-A8, PRCM, and PRU-ICSS
      • Mailbox registers that generate interrupts
        • Initiators (Cortex-A8, PRCM)
      • Spinlock has 128 software-assigned lock registers
  • Security
    • Crypto hardware accelerators (AES, SHA, PKA, RNG)
  • Boot modes
    • Boot mode is selected through boot configuration pins latched on the rising edge of the PWRONRSTn reset input pin
  • Package:
    • 324-pin S-PBGA-N324 package
      (GCZ suffix), 0.80-mm ball pitch