SLUSC35B April   2015  – April 2019 AM3358-EP

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Features
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
      1. 4.1.1 GCZ Package Pin Maps (Top View)
        1.       GCZ Pin Map [Section Left - Top View]
        2.       GCZ Pin Map [Section Middle - Top View]
        3.       GCZ Pin Map [Section Right - Top View]
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. 4.3.1 External Memory Interfaces
      2. 4.3.2 General Purpose IOs
      3. 4.3.3 Miscellaneous
        1. 4.3.3.1 eCAP
        2. 4.3.3.2 eHRPWM
        3. 4.3.3.3 eQEP
        4. 4.3.3.4 Timer
      4. 4.3.4 PRU-ICSS
        1. 4.3.4.1 PRU0
        2. 4.3.4.2 PRU1
      5. 4.3.5 Removable Media Interfaces
      6. 4.3.6 Serial Communication Interfaces
        1. 4.3.6.1 CAN
        2. 4.3.6.2 GEMAC_CPSW
        3. 4.3.6.3 I2C
        4. 4.3.6.4 McASP
        5. 4.3.6.5 SPI
        6. 4.3.6.6 UART
        7. 4.3.6.7 USB
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Operating Performance Points (OPPs)
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Power Consumption Summary
    7. 5.7  DC Electrical Characteristics
    8. 5.8  Thermal Resistance Characteristics for GCZ Package
    9. 5.9  External Capacitors
      1. 5.9.1 Voltage Decoupling Capacitors
        1. 5.9.1.1 Core Voltage Decoupling Capacitors
        2. 5.9.1.2 I/O and Analog Voltage Decoupling Capacitors
      2. 5.9.2 Output Capacitors
    10. 5.10 Touch Screen Controller and Analog-to-Digital Subsystem Electrical Parameters
  6. 6Power and Clocking
    1. 6.1 Power Supplies
      1. 6.1.1 Power Supply Slew Rate Requirement
      2. 6.1.2 Power-Down Sequencing
      3. 6.1.3 VDD_MPU_MON Connections
      4. 6.1.4 Digital Phase-Locked Loop Power Supply Requirements
    2. 6.2 Clock Specifications
      1. 6.2.1 Input Clock Specifications
      2. 6.2.2 Input Clock Requirements
        1. 6.2.2.1 OSC0 Internal Oscillator Clock Source
          1. Table 6-2 OSC0 Crystal Circuit Requirements
          2. Table 6-3 OSC0 Crystal Circuit Characteristics
        2. 6.2.2.2 OSC0 LVCMOS Digital Clock Source
        3. 6.2.2.3 OSC1 Internal Oscillator Clock Source
          1. Table 6-5 OSC1 Crystal Circuit Requirements
          2. Table 6-6 OSC1 Crystal Circuit Characteristics
        4. 6.2.2.4 OSC1 LVCMOS Digital Clock Source
        5. 6.2.2.5 OSC1 Not Used
      3. 6.2.3 Output Clock Specifications
      4. 6.2.4 Output Clock Characteristics
        1. 6.2.4.1 CLKOUT1
        2. 6.2.4.2 CLKOUT2
  7. 7Peripheral Information and Timings
    1. 7.1  Parameter Information
      1. 7.1.1 Timing Parameters and Board Routing Analysis
    2. 7.2  Recommended Clock and Control Signal Transition Behavior
    3. 7.3  OPP50 Support
    4. 7.4  Controller Area Network (CAN)
      1. 7.4.1 DCAN Electrical Data and Timing
        1. Table 7-1 DCAN Timing Conditions
        2. Table 7-2 Timing Requirements for DCANx Receive
        3. Table 7-3 Switching Characteristics for DCANx Transmit
    5. 7.5  DMTimer
      1. 7.5.1 DMTimer Electrical Data and Timing
        1. Table 7-4 DMTimer Timing Conditions
        2. Table 7-5 Timing Requirements for DMTimer [1-7]
        3. Table 7-6 Switching Characteristics for DMTimer [4-7]
    6. 7.6  Ethernet Media Access Controller (EMAC) and Switch
      1. 7.6.1 EMAC and Switch Electrical Data and Timing
        1. Table 7-7 EMAC and Switch Timing Conditions
        2. 7.6.1.1   EMAC/Switch MDIO Electrical Data and Timing
          1. Table 7-8  Timing Requirements for MDIO_DATA
          2. Table 7-9  Switching Characteristics for MDIO_CLK
          3. Table 7-10 Switching Characteristics for MDIO_DATA
        3. 7.6.1.2   EMAC and Switch MII Electrical Data and Timing
          1. Table 7-11 Timing Requirements for GMII[x]_RXCLK - MII Mode
          2. Table 7-12 Timing Requirements for GMII[x]_TXCLK - MII Mode
          3. Table 7-13 Timing Requirements for GMII[x]_RXD[3:0], GMII[x]_RXDV, and GMII[x]_RXER - MII Mode
          4. Table 7-14 Switching Characteristics for GMII[x]_TXD[3:0], and GMII[x]_TXEN - MII Mode
        4. 7.6.1.3   EMAC and Switch RMII Electrical Data and Timing
          1. Table 7-15 Timing Requirements for RMII[x]_REFCLK - RMII Mode
          2. Table 7-16 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER - RMII Mode
          3. Table 7-17 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN - RMII Mode
        5. 7.6.1.4   EMAC and Switch RGMII Electrical Data and Timing
          1. Table 7-18 Timing Requirements for RGMII[x]_RCLK - RGMII Mode
          2. Table 7-19 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL - RGMII Mode
          3. Table 7-20 Switching Characteristics for RGMII[x]_TCLK - RGMII Mode
          4. Table 7-21 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL - RGMII Mode
    7. 7.7  External Memory Interfaces
      1. 7.7.1 General-Purpose Memory Controller (GPMC)
        1. 7.7.1.1 GPMC and NOR Flash—Synchronous Mode
          1. Table 7-22 GPMC and NOR Flash Timing Conditions—Synchronous Mode
          2. Table 7-23 GPMC and NOR Flash Timing Requirements—Synchronous Mode
          3. Table 7-24 GPMC and NOR Flash Switching Characteristics—Synchronous Mode
        2. 7.7.1.2 GPMC and NOR Flash—Asynchronous Mode
          1. Table 7-25 GPMC and NOR Flash Timing Conditions—Asynchronous Mode
          2. Table 7-26 GPMC and NOR Flash Internal Timing Requirements—Asynchronous Mode
          3. Table 7-27 GPMC and NOR Flash Timing Requirements—Asynchronous Mode
          4. Table 7-28 GPMC and NOR Flash Switching Characteristics—Asynchronous Mode
        3. 7.7.1.3 GPMC and NAND Flash—Asynchronous Mode
          1. Table 7-29 GPMC and NAND Flash Timing Conditions—Asynchronous Mode
          2. Table 7-30 GPMC and NAND Flash Internal Timing Requirements—Asynchronous Mode
          3. Table 7-31 GPMC and NAND Flash Timing Requirements—Asynchronous Mode
          4. Table 7-32 GPMC and NAND Flash Switching Characteristics—Asynchronous Mode
      2. 7.7.2 mDDR(LPDDR), DDR2, DDR3, DDR3L Memory Interface
        1. 7.7.2.1 mDDR (LPDDR) Routing Guidelines
          1. 7.7.2.1.1 Board Designs
          2. 7.7.2.1.2 LPDDR Interface
            1. 7.7.2.1.2.1 LPDDR Interface Schematic
            2. 7.7.2.1.2.2 Compatible JEDEC LPDDR Devices
              1. Table 7-34 Compatible JEDEC LPDDR Devices (Per Interface)
            3. 7.7.2.1.2.3 PCB Stackup
            4. 7.7.2.1.2.4 Placement
            5. 7.7.2.1.2.5 LPDDR Keepout Region
            6. 7.7.2.1.2.6 Bulk Bypass Capacitors
            7. 7.7.2.1.2.7 High-Speed Bypass Capacitors
            8. 7.7.2.1.2.8 Net Classes
            9. 7.7.2.1.2.9 LPDDR Signal Termination
          3. 7.7.2.1.3 LPDDR CK and ADDR_CTRL Routing
        2. 7.7.2.2 DDR2 Routing Guidelines
          1. 7.7.2.2.1 Board Designs
          2. 7.7.2.2.2 DDR2 Interface
            1. 7.7.2.2.2.1  DDR2 Interface Schematic
            2. 7.7.2.2.2.2  Compatible JEDEC DDR2 Devices
              1. Table 7-46 Compatible JEDEC DDR2 Devices (Per Interface)
            3. 7.7.2.2.2.3  PCB Stackup
            4. 7.7.2.2.2.4  Placement
            5. 7.7.2.2.2.5  DDR2 Keepout Region
            6. 7.7.2.2.2.6  Bulk Bypass Capacitors
            7. 7.7.2.2.2.7  High-Speed (HS) Bypass Capacitors
            8. 7.7.2.2.2.8  Net Classes
            9. 7.7.2.2.2.9  DDR2 Signal Termination
            10. 7.7.2.2.2.10 DDR_VREF Routing
          3. 7.7.2.2.3 DDR2 CK and ADDR_CTRL Routing
        3. 7.7.2.3 DDR3 and DDR3L Routing Guidelines
          1. 7.7.2.3.1 Board Designs
            1. 7.7.2.3.1.1 DDR3 versus DDR2
          2. 7.7.2.3.2 DDR3 Device Combinations
          3. 7.7.2.3.3 DDR3 Interface
            1. 7.7.2.3.3.1  DDR3 Interface Schematic
            2. 7.7.2.3.3.2  Compatible JEDEC DDR3 Devices
            3. 7.7.2.3.3.3  PCB Stackup
            4. 7.7.2.3.3.4  Placement
            5. 7.7.2.3.3.5  DDR3 Keepout Region
            6. 7.7.2.3.3.6  Bulk Bypass Capacitors
            7. 7.7.2.3.3.7  High-Speed Bypass Capacitors
              1. 7.7.2.3.3.7.1 Return Current Bypass Capacitors
            8. 7.7.2.3.3.8  Net Classes
            9. 7.7.2.3.3.9  DDR3 Signal Termination
            10. 7.7.2.3.3.10 DDR_VREF Routing
            11. 7.7.2.3.3.11 VTT
          4. 7.7.2.3.4 DDR3 CK and ADDR_CTRL Topologies and Routing Definition
            1. 7.7.2.3.4.1 Two DDR3 Devices
              1. 7.7.2.3.4.1.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
              2. 7.7.2.3.4.1.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
            2. 7.7.2.3.4.2 One DDR3 Device
              1. 7.7.2.3.4.2.1 CK and ADDR_CTRL Topologies, One DDR3 Device
              2. 7.7.2.3.4.2.2 CK and ADDR_CTRL Routing, One DDR3 Device
          5. 7.7.2.3.5 Data Topologies and Routing Definition
            1. 7.7.2.3.5.1 DQS[x] and DQ[x] Topologies, Any Number of Allowed DDR3 Devices
            2. 7.7.2.3.5.2 DQS[x] and DQ[x] Routing, Any Number of Allowed DDR3 Devices
          6. 7.7.2.3.6 Routing Specification
            1. 7.7.2.3.6.1 CK and ADDR_CTRL Routing Specification
            2. 7.7.2.3.6.2 DQS[x] and DQ[x] Routing Specification
    8. 7.8  I2C
      1. 7.8.1 I2C Electrical Data and Timing
        1. Table 7-70 I2C Timing Conditions – Slave Mode
        2. Table 7-71 Timing Requirements for I2C Input Timings
        3. Table 7-72 Switching Characteristics for I2C Output Timings
    9. 7.9  JTAG Electrical Data and Timing
      1. Table 7-73 JTAG Timing Conditions
      2. Table 7-74 Timing Requirements for JTAG
      3. Table 7-75 Switching Characteristics for JTAG
    10. 7.10 LCD Controller (LCDC)
      1. Table 7-76 LCD Controller Timing Conditions
      2. 7.10.1     LCD Interface Display Driver (LIDD Mode)
        1. Table 7-77 Timing Requirements for LCD LIDD Mode
        2. Table 7-78 Switching Characteristics for LCD LIDD Mode
      3. 7.10.2     LCD Raster Mode
        1. Table 7-79 Switching Characteristics for LCD Raster Mode
    11. 7.11 Multichannel Audio Serial Port (McASP)
      1. 7.11.1 McASP Device-Specific Information
      2. 7.11.2 McASP Electrical Data and Timing
        1. Table 7-80 McASP Timing Conditions
        2. Table 7-81 Timing Requirements for McASP
        3. Table 7-82 Switching Characteristics for McASP
    12. 7.12 Multichannel Serial Port Interface (McSPI)
      1. 7.12.1 McSPI Electrical Data and Timing
        1. 7.12.1.1 McSPI—Slave Mode
          1. Table 7-83 McSPI Timing Conditions – Slave Mode
          2. Table 7-84 Timing Requirements for McSPI Input Timings—Slave Mode
          3. Table 7-85 Switching Characteristics for McSPI Output Timings—Slave Mode
        2. 7.12.1.2 McSPI—Master Mode
          1. Table 7-86 McSPI Timing Conditions – Master Mode
          2. Table 7-87 Timing Requirements for McSPI Input Timings – Master Mode
          3. Table 7-88 Switching Characteristics for McSPI Output Timings – Master Mode
    13. 7.13 Multimedia Card (MMC) Interface
      1. 7.13.1 MMC Electrical Data and Timing
        1. Table 7-89 MMC Timing Conditions
        2. Table 7-90 Timing Requirements for MMC[x]_CMD and MMC[x]_DAT[7:0]
        3. Table 7-91 Switching Characteristics for MMC[x]_CLK
        4. Table 7-92 Switching Characteristics for MMC[x]_CMD and MMC[x]_DAT[7:0]—Standard Mode
        5. Table 7-93 Switching Characteristics for MMC[x]_CMD and MMC[x]_DAT[7:0]—High-Speed Mode
    14. 7.14 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
      1. 7.14.1 Programmable Real-Time Unit (PRU-ICSS PRU)
        1. Table 7-94 PRU-ICSS PRU Timing Conditions
        2. 7.14.1.1   PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
          1. Table 7-95 PRU-ICSS PRU Timing Requirements - Direct Input Mode
          2. Table 7-96 PRU-ICSS PRU Switching Requirements – Direct Output Mode
        3. 7.14.1.2   PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
          1. Table 7-97 PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
        4. 7.14.1.3   PRU-ICSS PRU Shift Mode Electrical Data and Timing
          1. Table 7-98 PRU-ICSS PRU Timing Requirements – Shift In Mode
          2. Table 7-99 PRU-ICSS PRU Switching Requirements - Shift Out Mode
      2. 7.14.2 PRU-ICSS MII_RT and Switch
        1. Table 7-100 PRU-ICSS MII_RT Switch Timing Conditions
        2. 7.14.2.1    PRU-ICSS MDIO Electrical Data and Timing
          1. Table 7-101 PRU-ICSS MDIO Timing Requirements – MDIO_DATA
          2. Table 7-102 PRU-ICSS MDIO Switching Characteristics - MDIO_CLK
          3. Table 7-103 PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
        3. 7.14.2.2    PRU-ICSS MII_RT Electrical Data and Timing
          1. Table 7-104 PRU-ICSS MII_RT Timing Requirements – MII_RXCLK
          2. Table 7-105 PRU-ICSS MII_RT Timing Requirements - MII[x]_TXCLK
          3. Table 7-106 PRU-ICSS MII_RT Timing Requirements - MII_RXD[3:0], MII_RXDV, and MII_RXER
          4. Table 7-107 PRU-ICSS MII_RT Switching Characteristics - MII_TXD[3:0] and MII_TXEN
      3. 7.14.3 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
        1. Table 7-108 UART Timing Conditions
        2. Table 7-109 Timing Requirements for PRU-ICSS UART Receive
        3. Table 7-110 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
    15. 7.15 Universal Asynchronous Receiver Transmitter (UART)
      1. 7.15.1 UART Electrical Data and Timing
        1. Table 7-111 Timing Requirements for UARTx Receive
        2. Table 7-112 Switching Characteristics for UARTx Transmit
      2. 7.15.2 UART IrDA Interface
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Via Channel
    2. 9.2 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Tools and Software

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

Design Kits and Evaluation Modules

    AM335x Evaluation ModuleEnables developers to immediately start evaluating the AM335x processor family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications such as portable navigation, portable gaming, home/building automation and others.
    AM335x Starter KitProvides a stable and affordable platform to quickly start evaluation of Sitara ARM Cortex-A8 AM335x Processors (AM3351, AM3352, AM3354, AM3356, AM3358) and accelerate development for smart appliance, industrial and networking applications. It is a low-cost development platform based on the ARM Cortex-A8 processor that is integrated with options such as Dual Gigabit Ethernet, DDR3 and LCD touch screen.
    BeagleBone Black Development BoardLow-cost, open source, community-supported development platform for ARM Cortex-A8 processor developers and hobbyists. Boot Linux in under 10-seconds and get started on Sitara AM335x ARM Cortex-A8 processor development in less than 5 minutes with just a single USB cable.
    BeagleBone Development BoardLow-cost, community-supported development platform for ARM Cortex-A8 processor developers. Boot Linux in under 10-seconds and get started on Sitara AM335x ARM Cortex-A8 processor development in less than 5 minutes with just a single USB cable. For TI-supported hardware platforms, consider the Sitara ARM AM335x Starter Kit or AM335x Evaluation Module.
    Data Concentrator Evaluation ModuleBased on AM3359 as the main processor and has Power Line Communication (PLC) Module to support various OFDM PLC communication standards. TMDSDC3359 also has capability to support multiple interfaces, sub-1GHz and 2.4GHz RF, Ethernet, RS-232, and RS-485. This evaluation module is ideal development platform for smart grid infrastructure applications including data concentrator, convergent node of grid sensor network, and control equipment of power automation.
    WiLink™ 8 Dual Band 2.4 & 5 GHz Wi-Fi® + Bluetooth® COM8 Evaluation ModuleEnables customers to add both Wi-Fi and Bluetooth to home and building automation, smart energy, gateways, wireless audio, enterprise, wearables and many more industrial and Internet of Things (IoT) applications. TI’s WiLink 8 modules are certified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply).
    WiLink 8 Module 2.4 GHz WiFi + Bluetooth COM8 Evaluation ModuleEnables customers to add Wi-Fi and Bluetooth (WL183x module only) to embedded applications based on TI's Sitara microprocessors. TI’s WiLink 8 Wi-Fi + Bluetooth modules are pre-certified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply).

TI Designs

    EtherCAT Communications Development PlatformAllows designers to implement real-time EtherCAT communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
    PROFIBUS Communications Development PlatformAllows designers to implement PROFIBUS communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
    Ethernet/IP Communications Development PlatformAllows designers to mplement Ethernet/IP communications standards in a broad range of industrial automation equipment. It enables low foot print designs in applications such as industrial automation, factory automation or industrial communication with minimal external components and with best in class low power performance.
    Acontis EtherCAT Master Stack Reference DesignHighly portable software stack that can be used on various embedded platforms. The EC-Master supports the high performane TI Sitara MPUs, it provides a sophisticated EtherCAT Master solution which customers can use to implement EtherCAT communication interface boards, EtherCAT based PLC or motion control applications. The EC-Master architectural design does not require additional tasks to be scheduled, thus the full stack functionality is available even on an OS less platform such as TI Starterware suported on AM335x. Due to this architecture combined with the high speed Ethernet driver it is possible to implement EtherCAT master based applications on the Sitara platform with short cycle times of 100 microseconds or even below.
    Solar Inverter Gateway Development Platform Reference DesignAdds communication functions to solar energy generation systems to enable system monitoring, real-time feedback, system updates, and more. The TIDEP0044 reference design describes the implementation of a solar inverter gateway using display, Ethernet, USB, and CAN on the TMDXEVM3358 featuring TI's AM335x processor.
    PRU Real-Time I/O Evaluation Reference DesignBeagleBone Black add-on board that allows users get to know TI’s powerful Programmable Real-Time Unit (PRU) core and basic functionality. The PRU is a low-latency microcontroller subsystem integrated in the Sitara AM335x and AM437x family of devices. The PRU core is optimized for deterministic, real-time processing, direct access to I/Os and ultra-low-latency requirements. With LEDs and push buttons for GPIO, audio, a temp sensor, optional character display and more, this add-on board includes schematics, bill of materials (BOM), design files, and design guide to teach the basics of the PRU.
    Smart Home and Energy Gateway Reference DesignProvides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as WiFi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Since objects in the house and buildings are becoming more and more connected, the gateway design needs to be flexible to accommodate different RF standard, since no single RF standard is dominating the market. This example gateway addresses this problem by supporting existing legacy RF standards (WiFi, Bluetooth) and newer RF standards (ZigBee, BLE).
    Streaming Audio Reference DesignMinimizes design time for customers by offering small form factor hardware and major software components, including streaming protocols and internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink8 platform solution. This proven combo solution provides key advantages in this market category that helps bring your products to the next level.

Software

    Processor SDK for AM335X Sitara Processors - Linux and TI-RTOS SupportUnified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and migrate software across devices. Developing scalable platform solutions has never been easier than with the Processor SDK and TI’s embedded processor solutions.
    G3 Data Concentrator Power-Line Communication ModemG3-PLC standard for narrowband OFDM Power Line Communications. The data concentrator solution is designed for the head-end systems which communicate with the end meters (“service node”) in the neighborhood area network.
    PRIME Data Concentrator Power-Line Communication ModemPRIME standard for narrowband OFDM Power Line Communications. The data concentrator solution is designed for the head-end systems which communicate with the end meters (“service node”) in the neighborhood area network.
    TI Dual-Mode Bluetooth StackComprised of Single-Mode and Dual-Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, provides simple command line sample applications to speed development, and upon request has MFI capability.
    Cryptography for TI DevicesEnables encryption, crypto for TI devices. These files contain only cryptographic modules that were part of a TI software release. For the complete software release please search ti.com for your device part number, and download the Software Development Kit (SDK).

Development Tools

    Code Composer Studio (CCS) Integrated Development Environment (IDE) for Sitara ARM ProcessorsIntegrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking you through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers.
    Pin Mux ToolProvides a Graphical User Interface for configuring pin multiplexing settings, resolving conflicts and specifying I/O cell characteristics for TI MPUs. Results are output as C header/code files that can be imported into software development kits (SDK) or used to configure customer's custom software. Version 3 of the Pin Mux utility adds the capability of automatically selecting a mux configuration that satisfies the entered requirements.
    Power Estimation Tool (PET)Provides users the ability to gain insight in to the power consumption of select TI processors. The tool includes the ability for the user to choose multiple application scenarios and understand the power consumption as well as how advanced power saving techniques can be applied to further reduce overall power consumption.
    XDS200 USB Debug ProbeConnects to the target board via a TI 20-pin connector (with multiple adapters for TI 14-pin, ARM 10-pin and ARM 20-pin) and to the host PC via USB2.0 High Speed (480Mbps). It also requires a license of Code Composer Studio IDE running on the host PC.
    XDS560v2 System Trace USB and Ethernet Debug ProbeAdds system pin trace in its large external memory buffer. Available for selected TI devices, this external memory buffer captures device-level information that allows obtaining accurate bus performance activity and throughput, as well as power management of core and peripherals. Also, all XDS debug probes support Core and System Trace in all ARM and DSP processors that feature an Embedded Trace Buffer (ETB).
    XDS560v2 System Trace USB Debug ProbeAdds system pin trace in its large external memory buffer. Available for selected TI devices, this external memory buffer captures device-level information that allows obtaining accurate bus performance activity and throughput, as well as power management of core and peripherals. Also, all XDS debug probes support Core and System Trace in all ARM and DSP processors that feature an Embedded Trace Buffer (ETB).

Models